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Diode Laser Materials And Devices A Worldwide Market And Technology Overview To 2005


Diode Laser Materials And Devices A Worldwide Market And Technology Overview To 2005
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Diode Laser Materials And Devices A Worldwide Market And Technology Overview To 2005


Diode Laser Materials And Devices A Worldwide Market And Technology Overview To 2005
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Author : R. Szweda
language : en
Publisher: Elsevier
Release Date : 2001-12-20

Diode Laser Materials And Devices A Worldwide Market And Technology Overview To 2005 written by R. Szweda and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-12-20 with Technology & Engineering categories.


This report examines the development of the diode laser industry over a six-year period, 2000 to 2005, incorporating analysis of trends in markets, technologies and industry structure. It is designed to provide key information to users and manufacturers of substrates, epitaxial wafers (epiwafers) and devices. The coverage includes components, laser diodes, and the semiconducting (SC) wafers and epiwafers on which most of these devices are made. The geographical coverage of the report includes North America, Japan and Europe, which together will account for over 90% of the production and consumption of diode laser materials and devices over the next five years. However, many other countries have activities in this field including South-East Asia (Taiwan, South Korea, Singapore, Malaysia etc), China, India, Australia and Eastern Europe (Russia, Poland, Hungary, the Czech Republic) amongst others. Activities in these countries are commented on in the text where relevant, but are not quantified in the market data. Chapter 1 is an introduction to the market study. Chapter 2 contains an executive summary. Chapter 3 overviews materials markets. The size, quality, and particularly the price, of substrates and wafers are key factors in determining the ability of companies to produce competitive laser products. Chapter 3 also examines trends in materials technologies for laser diodes, the impact of the device markets on wafer demand, and the main suppliers. This chapter introduces the semiconductor materials that are presently or will likely become important to the fabrication of diode laser devices. The principal distinguishing properties of these materials are explained with reference to their application. Chapter 4 chapter examines the basic application sectors for laser diode devices as well as the basic commercial opportunities, changes and forces acting within each sector. The chapter also examines the market for the basic types of device as well as the promising newer types. For each type of device, market data and forecasts are provided and future prospects described. The application data are presented for the following industrial groups: • Automotive • Computers • Consumer • Industrial • Military and Aerospace • Telecommunications • Others A full 5-year forecast and analysis is provided by application and region. Chapter 5 is a technology overview. In this chapter a background and overview of developments in the principal technological R&D and production processes for devices is provided. The main focus is on the most important enabling technology for the production of the present and future generations of laser diodes and related devices. This process is crystal growth and involves the following sequence: • Bulk growth of single crystals • Epitaxial growth of semiconductor single crystal layers • Ion implantation • Device fabrication, ie gate and contact formation, etc • Packaging & test Chapter 6 profiles substrate suppliers, epiwafers suppliers and merchant and captive producers of GaAs devices. Chapter 7 lists universities and selected industrial labs involved in the areas of diode laser research. Chapter 8 is a directory of suppliers. Chapter 9 provides acronyms and exchange rates. For a PDF version of the report please call Tina Enright on +44 (0) 1865 843008 for price details.



Silicon Germanium Materials And Devices A Market And Technology Overview To 2006


Silicon Germanium Materials And Devices A Market And Technology Overview To 2006
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Author : R. Szweda
language : en
Publisher: Elsevier
Release Date : 2002-11-26

Silicon Germanium Materials And Devices A Market And Technology Overview To 2006 written by R. Szweda and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-11-26 with Technology & Engineering categories.


The first edition of Silicon Germanium Materials & Devices - A Market & Technology Overview to 2006 examines the development of the silicon germanium business over a six-year period 2001 to 2006. It analyses the trends in markets, technologies and industry structure and profiles all the major players. It is specifically aimed at users and manufacturers of substrates, epiwafers, equipment and devices. The analysis includes a competitive assessment of the market of silicon germanium vs. gallium arsenide, indium phosphide vs. other forms of silicon. Silicon Germanium Materials & Devices - A Market & Technology Overview to 2006 is designed to assist with business plans, R&D and manufacturing strategies. It will be an indispensable aid for managers responsible for business development, technology assessment and market research. The report examines the rapid development of silicon germanium from an R&D curiosity to production status. An extensive treatment from materials through processes to devices and applications it encapsulates the entire silicon germanium business of today and assesses future directions. For a PDF version of the report please call Tina Enright on +44 (0) 1865 843008 for price details.



Books In Print 2004 2005


Books In Print 2004 2005
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Author : Ed Bowker Staff
language : en
Publisher: R. R. Bowker
Release Date : 2004

Books In Print 2004 2005 written by Ed Bowker Staff and has been published by R. R. Bowker this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Reference categories.




Introduction To Laser Technology


Introduction To Laser Technology
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Author : C. Breck Hitz
language : en
Publisher: John Wiley & Sons
Release Date : 2012-04-02

Introduction To Laser Technology written by C. Breck Hitz and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-04-02 with Technology & Engineering categories.


The only introductory text on the market today that explains the underlying physics and engineering applicable to all lasers Although lasers are becoming increasingly important in our high-tech environment, many of the technicians and engineers who install, operate, and maintain them have had little, if any, formal training in the field of electro-optics. This can result in less efficient usage of these important tools. Introduction to Laser Technology, Fourth Edition provides readers with a good understanding of what a laser is and what it can and cannot do. The book explains what types of laser to use for different purposes and how a laser can be modified to improve its performance in a given application. With a unique combination of clarity and technical depth, the book explains the characteristics and important applications of commercial lasers worldwide and discusses light and optics, the fundamental elements of lasers, and laser modification.? In addition to new chapter-end problems, the Fourth Edition includes new and expanded chapter material on: Material and wavelength Diode Laser Arrays Quantum-cascade lasers Fiber lasers Thin-disk and slab lasers Ultrafast fiber lasers Raman lasers Quasi-phase matching Optically pumped semiconductor lasers Introduction to Laser Technology, Fourth Edition is an excellent book for students, technicians, engineers, and other professionals seeking a fuller, more formal introduction to the field of laser technology.



Optics And Spectroscopy


Optics And Spectroscopy
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Author :
language : en
Publisher:
Release Date : 2003

Optics And Spectroscopy written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Optics categories.




Diodenlasersysteme F R Anwendungen In Terahertztechnologie Und Zwei Photonen Polymerisation


Diodenlasersysteme F R Anwendungen In Terahertztechnologie Und Zwei Photonen Polymerisation
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Author : Nils Dominik Surkamp
language : de
Publisher: Cuvillier Verlag
Release Date : 2023-02-27

Diodenlasersysteme F R Anwendungen In Terahertztechnologie Und Zwei Photonen Polymerisation written by Nils Dominik Surkamp and has been published by Cuvillier Verlag this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-02-27 with Technology & Engineering categories.


In dieser Dissertation wird die Anwendung von Diodenlasersystemen für die Anwendungen Zwei-Photonen Polymerisation (2PP) und Terahertztechnologie demonstriert. Zunächst wurde der Einsatz eines Lasers mit einem Y-förmig verzweigtem Resonator zur Erzeugung von kontinuierlicher Terahertzstrahlung (cw-THz) mittels photoleitenden Antennen demonstriert. Durch spektral selektive Rückkopplung in den Verzweigungen des Laserresonators wird ein zur Erzeugung von cw-THz geeignetes optisches Spektrum emittiert. Die erzeugte Terahertzfrequenz konnte durch Veränderung des Pumpstroms verstimmt werden, wodurch Messungen im Frequenzbereich ohne Verzögerungsstrecke möglich sind. Anhand von Siliziumwaferproben verschiedener Dicke wurde gezeigt, dass mit dieser Technik der Brechungsindex und die Probendicke unabhängig voneinander bestimmt werden können. Die hierbei eingesetzte Laserstruktur weist gegenüber bisher genutzten Systemen den Vorteil auf, dass eine Implementierung in photonisch integrierte Systeme leichter realisierbar ist. Im Rahmen dieser Dissertation wurden darüber hinaus modengekoppelte Diodenlaser, welche ultrakurze Lichtpulse erzeugen, für die gepulste Terahertztechnologie und die Zwei-Photonen Polymerisation (2PP) eingesetzt. Die 2PP ist ein Laserbasiertes 3D-Druck Verfahren. Durch selektives Aushärten eines Polymers mit einem Ultrakurzpulslaser können Bauteile gefertigt werden, deren kleinsten Strukturgrößen bis zu 100 nm klein sein können. Im Rahmen dieser Arbeit konnte gezeigt werden, dass Diodenlasersysteme zur 2PP eingesetzt werden können. Zunächst wurde mit einem komplexen Diodenlasersystem, welches eine Beeinflussung der optischen Leistung sowie der Pulslänge erlaubt, der effektiv nutzbare Parameterbereich untersucht sowie geometrisch komplexe Mikrostrukturen erzeugt. Anschließend konnte gezeigt werden, dass auch mit einem hochkompakten Laser eine Polymeraushärtung durch mehrfaches Überschreiben möglich ist. Diese Erkenntnis ermöglicht die Konstruktion eines kompakten 2PP-Systems, welches zum Patent angemeldet wurde. Für die gepulste Terahertztechnologie wurde mit zwei modengekoppelten Diodenlasern ein asynchron abtastendes Terahertzsystem realisiert. Solche Systeme basieren darauf, dass geringe Unterschiede in der Pulswiederholrate an Sende- und Empfangsseite einen Zeitversatz ergeben, welcher zur Abtastung genutzt wird. Mit dem diodenlaserbasierten System konnten hierbei Frequenzanteile im abgetasteten Terahertzspektrum bis 250 GHz detektiert werden. Die Limitierung der Maximalfrequenz entstand hierbei durch die verwendete Detektionselektronik. Darüber hinaus wurde eine Möglichkeit entwickelt und zum Patent angemeldet, welche den Zeitversatz zwischen zwei Pulszügen elektronisch kontrolliert. Dies soll in zukünftigen Arbeiten auch zur Abtastung von Terahertzpulsen genutzt werden. Es konnte gezeigt werden, dass Diodenlaser und Diodenlasersysteme für die drei betrachteten Anwendungsfelder sehr gut geeignet sind. Zwar können bestehende Systeme, welche nicht auf Diodenlasern beruhen, höhere technische Spezifikationen erfüllen, jedoch liegt der große Vorteil von Diodenlasern insbesondere in der potenziellen Kostenskalierung. Während konventionell eingesetzte Ultrakurzpulslaser (Tita:Saphir- oder Faserlaser) aus diskreten Komponenten aufgebaut werden müssen, können Diodenlaser mittels Mikrotechnologischer Fertigung in großen Stückzahlen hergestellt werden. Durch die erzielbare Kostenreduktion in einem kommerziellen System können so neue Nutzerkreise, wie zum Beispiel mittelständische Unternehmen oder Forschungsgruppen ohne entsprechende Expertise zum Aufbau eines solchen Systems, erschlossen werden.



The British National Bibliography


The British National Bibliography
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Author : Arthur James Wells
language : en
Publisher:
Release Date : 2006

The British National Bibliography written by Arthur James Wells and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Bibliography, National categories.




The Morgan Stanley And D A European Technology Atlas 2005


The Morgan Stanley And D A European Technology Atlas 2005
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Author :
language : en
Publisher: d&a hi-tech information Ltd.
Release Date :

The Morgan Stanley And D A European Technology Atlas 2005 written by and has been published by d&a hi-tech information Ltd. this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.




Handbook Of Silicon Based Mems Materials And Technologies


Handbook Of Silicon Based Mems Materials And Technologies
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Author : Markku Tilli
language : en
Publisher: William Andrew
Release Date : 2015-09-02

Handbook Of Silicon Based Mems Materials And Technologies written by Markku Tilli and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-09-02 with Technology & Engineering categories.


The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures Geared towards practical applications rather than theory



More Than Moore 2 5d And 3d Sip Integration


More Than Moore 2 5d And 3d Sip Integration
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Author : Riko Radojcic
language : en
Publisher: Springer
Release Date : 2017-02-08

More Than Moore 2 5d And 3d Sip Integration written by Riko Radojcic and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-02-08 with Technology & Engineering categories.


This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.