Electronic Materials Innovations And Reliability In Advanced Memory Packaging
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Electronic Materials Innovations And Reliability In Advanced Memory Packaging
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Author : Chong Leong Gan
language : en
Publisher: Springer Nature
Release Date : 2025-08-22
Electronic Materials Innovations And Reliability In Advanced Memory Packaging written by Chong Leong Gan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-08-22 with Science categories.
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
Program Solicitation
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Author :
language : en
Publisher:
Release Date : 1995
Program Solicitation written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Military research categories.
Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium
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Author : Nurul Razliana Abdul Razak
language : en
Publisher: Springer Nature
Release Date : 2025-03-11
Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium written by Nurul Razliana Abdul Razak and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-03-11 with Science categories.
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.
Direct Copper Interconnection For Advanced Semiconductor Technology
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Author : Dongkai Shangguan
language : en
Publisher: CRC Press
Release Date : 2024-06-28
Direct Copper Interconnection For Advanced Semiconductor Technology written by Dongkai Shangguan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-06-28 with Technology & Engineering categories.
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Electrical Electronics Abstracts
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Author :
language : en
Publisher:
Release Date : 1997
Electrical Electronics Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electrical engineering categories.
Advanced Organics For Electronic Substrates And Packages
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Author : Andrew E Fletcher
language : en
Publisher: Elsevier
Release Date : 2013-10-22
Advanced Organics For Electronic Substrates And Packages written by Andrew E Fletcher and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Science categories.
Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet preserve the performance of the semiconductors with minimum package delay to the system. Trends in each of the major packaging technologies include chip level connection, providing the required connections between the chip and the semiconductor package. The power distribution to the chip and heat removal from the chip; first level packages providing all the necessary wiring; interconnections and power distribution; first-to-second level interconnections; and second level packages providing all the necessary wiring, connections, power distribution, and power supply connection are included as well. This book is a useful and informative reference to students or individuals studying or conducting research within the field of electronic engineering.
Nanotechnology In Electronics For Miniaturized Devices And Circuits
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Author : Ms. Priyanka
language : en
Publisher: RK Publication
Release Date : 2024-12-17
Nanotechnology In Electronics For Miniaturized Devices And Circuits written by Ms. Priyanka and has been published by RK Publication this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-12-17 with Technology & Engineering categories.
Nanotechnology in Electronics for Miniaturized Devices and Circuits the transformative impact of nanotechnology on electronic components, enabling ultra-compact, high-performance devices. This nanoscale materials, fabrication techniques, and emerging applications in transistors, memory storage, sensors, and quantum computing. It examines advancements in nanoelectronics, including carbon nanotubes, graphene-based circuits, and molecular electronics, highlighting their role in enhancing speed, efficiency, and energy consumption. With a focus on current research and future prospects, this serves as a comprehensive resource for students, researchers, and industry professionals navigating the rapidly evolving landscape of miniaturized electronic systems.
Design And Reliability Of Solders And Solder Interconnections
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Author : Rao K. Mahidhara
language : en
Publisher: Minerals, Metals, & Materials Society
Release Date : 1997
Design And Reliability Of Solders And Solder Interconnections written by Rao K. Mahidhara and has been published by Minerals, Metals, & Materials Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.
Nanometer Cmos Ics
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Author : Harry Veendrick
language : en
Publisher: Springer Nature
Release Date : 2024-10-21
Nanometer Cmos Ics written by Harry Veendrick and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-10-21 with Technology & Engineering categories.
This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 3nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design, fabrication and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, Infineon, TSMC, etc., courseware, which, to date, has been completed by more than 7000 engineers working in a large variety of the above mentioned disciplines.
Principles Of Extreme Mechanics Xm In Design For Reliability Dfr
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Author : Arief Suriadi Budiman
language : en
Publisher: Springer Nature
Release Date : 2021-11-13
Principles Of Extreme Mechanics Xm In Design For Reliability Dfr written by Arief Suriadi Budiman and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-11-13 with Science categories.
This book addresses issues pertinent to mechanics and stress generation, especially in recent advanced cases of technology developments, spanning from micrometer interconnects in solar photovoltaics (PV), next-gen energy storage devices to multilayers of nano-scale composites enabling novel stretchable/flexible conductor technologies. In these cases, the mechanics of materials have been pushed to the extreme edges of human knowledge to enable cutting-edge, unprecedented functionalities and technological innovations. Synchrotron X-ray diffraction, in situ small-scale mechanical testing combined with physics-based computational modeling/simulation, has been widely used approaches to probe these mechanics of the materials at their extreme limits due to their recently discovered distinct advantages. The techniques discussed in this manuscript are highlights specially curated from the broad body of work recently reported in the literature, especially ones that the author had led the pursuits at the frontier himself. Extreme stress generation in these advanced material leads to often new failure modes, and hence, the reliability of the final product is directly affected. From the recent topics and various advanced case studies covered in this book, the reader gets an updated knowledge of how new mechanics can and has been applied in Design-for-Reliability (DfR) for some of the latest technological innovations known in our modern world. Further, this also helps in building better designs, which may avoid the pitfalls of the current practiced trends.