Electronic Materials Innovations And Reliability In Advanced Memory Packaging
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Electronic Materials Innovations And Reliability In Advanced Memory Packaging
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Author : Chong Leong Gan
language : en
Publisher: Springer Nature
Release Date : 2025-08-22
Electronic Materials Innovations And Reliability In Advanced Memory Packaging written by Chong Leong Gan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-08-22 with Science categories.
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
Electronic Materials Innovations And Reliability In Advanced Memory Packaging
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Author : Chong Leong Gan
language : en
Publisher: Springer
Release Date : 2025-07-31
Electronic Materials Innovations And Reliability In Advanced Memory Packaging written by Chong Leong Gan and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-07-31 with Science categories.
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
Program Solicitation
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Author :
language : en
Publisher:
Release Date : 1995
Program Solicitation written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Military research categories.
Semiconductor Packaging
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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2016-04-19
Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Interconnect Technologies For Integrated Circuits And Flexible Electronics
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Author : Yash Agrawal
language : en
Publisher: Springer Nature
Release Date : 2023-09-21
Interconnect Technologies For Integrated Circuits And Flexible Electronics written by Yash Agrawal and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-09-21 with Technology & Engineering categories.
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Direct Copper Interconnection For Advanced Semiconductor Technology
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Author : Dongkai Shangguan
language : en
Publisher: CRC Press
Release Date : 2024-06-28
Direct Copper Interconnection For Advanced Semiconductor Technology written by Dongkai Shangguan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-06-28 with Technology & Engineering categories.
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Electrical Electronics Abstracts
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Author :
language : en
Publisher:
Release Date : 1997
Electrical Electronics Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electrical engineering categories.
Design And Reliability Of Solders And Solder Interconnections
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Author : Rao K. Mahidhara
language : en
Publisher: Minerals, Metals, & Materials Society
Release Date : 1997
Design And Reliability Of Solders And Solder Interconnections written by Rao K. Mahidhara and has been published by Minerals, Metals, & Materials Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.
Nanometer Cmos Ics
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Author : Harry Veendrick
language : en
Publisher: Springer Nature
Release Date : 2024-10-21
Nanometer Cmos Ics written by Harry Veendrick and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-10-21 with Technology & Engineering categories.
This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 3nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design, fabrication and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, Infineon, TSMC, etc., courseware, which, to date, has been completed by more than 7000 engineers working in a large variety of the above mentioned disciplines.
Nanotechnology In Electronics For Miniaturized Devices And Circuits
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Author : Ms. Priyanka
language : en
Publisher: RK Publication
Release Date : 2024-12-17
Nanotechnology In Electronics For Miniaturized Devices And Circuits written by Ms. Priyanka and has been published by RK Publication this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-12-17 with Technology & Engineering categories.
Nanotechnology in Electronics for Miniaturized Devices and Circuits the transformative impact of nanotechnology on electronic components, enabling ultra-compact, high-performance devices. This nanoscale materials, fabrication techniques, and emerging applications in transistors, memory storage, sensors, and quantum computing. It examines advancements in nanoelectronics, including carbon nanotubes, graphene-based circuits, and molecular electronics, highlighting their role in enhancing speed, efficiency, and energy consumption. With a focus on current research and future prospects, this serves as a comprehensive resource for students, researchers, and industry professionals navigating the rapidly evolving landscape of miniaturized electronic systems.