Encapsulation Technologies For Electronic Applications

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Encapsulation Technologies For Electronic Applications

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Author : Haleh Ardebili
language : en
Publisher: William Andrew
Release Date : 2009-07-22

Encapsulation Technologies For Electronic Applications written by Haleh Ardebili and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-07-22 with Technology & Engineering categories.

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. - Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Coverage of environmentally friendly 'green encapsulants' - Practical coverage of faults and defects: how to analyze them and how to avoid them

Polymers In Electronics

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Author : Zulkifli Ahmad
language : en
Publisher: Elsevier
Release Date : 2023-07-28

Polymers In Electronics written by Zulkifli Ahmad and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-07-28 with Technology & Engineering categories.

Polymers in Electronics: Optoelectronic Properties, Design, Fabrication, and Applications brings together the fundamentals and latest advances in polymeric materials for electronic device applications, supporting researchers, scientists and advanced students, and approaching the topic from a range of disciplines. The book begins by introducing polymeric materials, their dielectric, optical, and thermal properties, and the essential principles and techniques for polymers as applied to electronics. This is followed by detailed coverage of the key steps in the preparation of polymeric materials for opto-electronic devices, including fabrication methods, materials design, rheology, encapsulation, and conductive polymer mechanisms. The final part of the book focuses on the latest developments in advanced devices, covering the areas of photovoltaics, transistors, light-emitting diodes, and stretchable electronics. In addition, it explains mechanisms, design, fabrication techniques, and end applications. This is a highly valuable resource for researchers, advanced students, engineers and R&D professionals from a range of disciplines. - Offers introductory coverage of polymeric materials for electronics, including principles, design, properties, fabrication and applications - Focuses on key issues such as materials selection, structure-property relationships and challenges in application - Explores advanced applications of polymers in photovoltaics, transistors, sensors, light-emitting diodes and stretchable electronics

Polymers In Organic Electronics

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Author : Sulaiman Khalifeh
language : en
Publisher: Elsevier
Release Date : 2020-04-01

Polymers In Organic Electronics written by Sulaiman Khalifeh and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-04-01 with Technology & Engineering categories.

Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components

Rapid Cure Composites

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Author : Nishar Hameed
language : en
Publisher: Elsevier
Release Date : 2023-05-17

Rapid Cure Composites written by Nishar Hameed and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-05-17 with Technology & Engineering categories.

Rapid Cure Composites: Materials, Processing and Manufacturing presents up-to-date information on the design criteria to formulate matrix systems for rapid curing. Emphasis is placed on the role different materials [resin compound and fiber reinforcement] play in developing fast curing composites, assessment of current and novel manufacturing techniques for adapting fast curing processes, the comparison between conventional curing and rapid curing, and different applications in various industrial sectors [e.g., aerospace, automotive, renewables and marine]. The book will be an essential reference resource for academic and industrial researchers working in the field of composite materials, processing and manufacturing organizations, materials scientists, and more. Polymer composites are widely used in several industries, including aerospace, automobile, spray and coatings, and electronics due to their lightweight and superior mechanical properties. However, one of the dominant hurdles towards their growth in commercial industries is the long curing cycle and slow production. - Comprehensively addresses the scientific and technological development of rapid cured epoxy composites - Covers, in detail, the chemistry, processing, structure and performance of rapid cured epoxy composites - Provides detailed comparisons of how/why rapid cure composites are different to conventional composites - Discusses the challenges of the existing technology and future trends

Flexible Electronic Packaging And Encapsulation Technology

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Author : Hong Meng
language : en
Publisher: John Wiley & Sons
Release Date : 2024-03-25

Flexible Electronic Packaging And Encapsulation Technology written by Hong Meng and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-03-25 with Technology & Engineering categories.

Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

Electronic Enclosures Housings And Packages

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Author : Frank Suli
language : en
Publisher: Woodhead Publishing
Release Date : 2018-11-01

Electronic Enclosures Housings And Packages written by Frank Suli and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-11-01 with Technology & Engineering categories.

Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.

Microbial Cultures And Enzymes In Dairy Technology

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Author : Öztürkoğlu Budak, Şebnem
language : en
Publisher: IGI Global
Release Date : 2018-04-27

Microbial Cultures And Enzymes In Dairy Technology written by Öztürkoğlu Budak, Şebnem and has been published by IGI Global this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-27 with Technology & Engineering categories.

Microorganisms are an integral part of the fermentation process in food products and help to improve sensory and textural properties of the products. As such, it is vital to explore the current uses of microorganisms in the dairy industry. Microbial Cultures and Enzymes in Dairy Technology is a critical scholarly resource that explores multidisciplinary uses of cultures and enzymes in the production of dairy products. Featuring coverage on a wide range of topics such as dairy probiotics, biopreservatives, and fermentation, this book is geared toward academicians, researchers, and professionals in the dairy industry seeking current research on the major role of microorganisms in the production of many dairy products.

Reliability Technology

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Author : Norman Pascoe
language : en
Publisher: John Wiley & Sons
Release Date : 2011-04-25

Reliability Technology written by Norman Pascoe and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-04-25 with Technology & Engineering categories.

A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers. This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers? attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disposal. Revolutionary in focus, as it describes how to achieve failure free performance rather than how to predict an acceptable performance failure rate (reliability technology rather than reliability engineering) Author has over 40 years experience in the field, and the text is based on classroom tested notes from the reliability technology course he taught at Massachusetts Institute of Technology (MIT), USA Contains graphical interpretations of mathematical models together with diagrams, tables of physical constants, case studies and unique worked examples

Materials For Electronics Security And Assurance

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Author : Navid Asadizanjani
language : en
Publisher: Elsevier
Release Date : 2024-01-15

Materials For Electronics Security And Assurance written by Navid Asadizanjani and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-01-15 with Technology & Engineering categories.

Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing

Reliability And Failure Analysis Of High Power Led Packaging

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Author : Cher Ming Tan
language : en
Publisher: Woodhead Publishing
Release Date : 2022-09-24

Reliability And Failure Analysis Of High Power Led Packaging written by Cher Ming Tan and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-24 with Technology & Engineering categories.

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs