Flexible Electronic Packaging And Encapsulation Technology
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Flexible Electronic Packaging And Encapsulation Technology
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Author : Hong Meng
language : en
Publisher: John Wiley & Sons
Release Date : 2024-03-25
Flexible Electronic Packaging And Encapsulation Technology written by Hong Meng and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-03-25 with Technology & Engineering categories.
Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Encapsulation Technologies For Electronic Applications
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Author : Haleh Ardebili
language : en
Publisher: William Andrew
Release Date : 2018-10-23
Encapsulation Technologies For Electronic Applications written by Haleh Ardebili and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-23 with Technology & Engineering categories.
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them
Modeling And Application Of Flexible Electronics Packaging
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Author : YongAn Huang
language : en
Publisher: Springer
Release Date : 2019-04-23
Modeling And Application Of Flexible Electronics Packaging written by YongAn Huang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-23 with Technology & Engineering categories.
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Introduction To Microsystem Packaging Technology
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Author : Yufeng Jin
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Introduction To Microsystem Packaging Technology written by Yufeng Jin and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Printed Electronics
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Author : Zheng Cui
language : en
Publisher: John Wiley & Sons
Release Date : 2016-04-12
Printed Electronics written by Zheng Cui and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-12 with Technology & Engineering categories.
This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support of examples and graphic illustrations • Serves both as an advanced introductory to the topic and as an aid for professional development into the new field • Includes end of chapter references and links to further reading
Advanced Materials For Printed Flexible Electronics
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Author : Colin Tong
language : en
Publisher: Springer Nature
Release Date : 2021-10-04
Advanced Materials For Printed Flexible Electronics written by Colin Tong and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-10-04 with Technology & Engineering categories.
This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.
Materials And Technologies For Flexible And Printed Electronics
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Author : Liangliang Chen
language : en
Publisher:
Release Date : 2015-05
Materials And Technologies For Flexible And Printed Electronics written by Liangliang Chen and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05 with Electronics categories.
Flexible and printed electronics are rather new fields in China. In particular, the term of "printed electronics" was almost unheard of in China five years ago when Professor Cui setup the first research center dedicated to the R&D of this technology. The collection includes selected peer reviewed papers form the 5th International Conference on Flexible and Printed Electronics (ICFPE) was successfully held in Beijing on 21-23 October 2014. The 39 papers share the newest ideas in the fields of followed: Synthesis and characterization of organic and inorganic electronics materials for printed electronics; Ink formulation of nanomaterials and applications in printed electronics; Solution-processing and/or printing of organic and inorganic thin film transistors, solar cells and light emitting devices; Organic and inorganic flexible electronic devices and displays; Flexible and plastic sensors and their applications; Processes, techniques and equipment for printed electronics; Design of flexible and printable electronic systems; Manufacturing of printed circuit (PCB) boards and RFID antennas; Packaging and encapsulation of OLED/OPV and printed electronic devices.
Materials For High Density Electronic Packaging And Interconnection
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Author : National Research Council
language : en
Publisher: National Academies Press
Release Date : 1990-02-01
Materials For High Density Electronic Packaging And Interconnection written by National Research Council and has been published by National Academies Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-02-01 with Technology & Engineering categories.
Advances In Embedded And Fan Out Wafer Level Packaging Technologies
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Author : Beth Keser
language : en
Publisher: John Wiley & Sons
Release Date : 2019-02-20
Advances In Embedded And Fan Out Wafer Level Packaging Technologies written by Beth Keser and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-20 with Technology & Engineering categories.
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Flexible Electronics
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Author : William S. Wong
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-04-09
Flexible Electronics written by William S. Wong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-04-09 with Technology & Engineering categories.
This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.