Exploring Emerging Three Dimensional Integration And Memory Technologies In Processor Microarchitecture Design
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Exploring Emerging Three Dimensional Integration And Memory Technologies In Processor Microarchitecture Design
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Author : Wangyuan Zhang
language : en
Publisher:
Release Date : 2010
Exploring Emerging Three Dimensional Integration And Memory Technologies In Processor Microarchitecture Design written by Wangyuan Zhang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with categories.
ABSTRACT: Aggressive scaling of process technologies has allowed the semiconductor industry to keep pace with Moore's Law for the past several decades. However, CMOS process technology is approaching its limits and interconnects are becoming a major performance bottleneck. Moreover, microprocessor designers are facing an increasing number of related challenges, including high power consumption, low reliability, enlarged performance gap between high-speed processor and off-chip memory, and increased demand for high-density memory. In response to these issues, new devices and manufacturing process technologies have been proposed. Among them, three-dimensional (3D) integration is a promising technology for extending Moore's Law by stacking multiple layers of processed silicon with very high-density, low-latency, and vertical interconnects. Phase Change Memory (PCM) is another emerging technology, which is regarded as a promising candidate for the next generation of computer memory and may help solve the power and reliability challenges faced by designers. However, these emerging technologies pose unanswered questions to the field of computer architecture: What are the impacts of these emerging technologies on the microarchitecture design? How can these resources be leveraged effectively to design future processor innovatively? What new challenges are introduced and how can they is addressed?
Die Stacking Architecture
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Author : Yuan Xie
language : en
Publisher: Morgan & Claypool Publishers
Release Date : 2015-06-01
Die Stacking Architecture written by Yuan Xie and has been published by Morgan & Claypool Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-06-01 with Computers categories.
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Three Dimensional System Integration
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Author : Antonis Papanikolaou
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-12-07
Three Dimensional System Integration written by Antonis Papanikolaou and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-12-07 with Architecture categories.
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Design Exploration For Three Dimensional Integrated Circuits 3dics
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Author : Xiaoxia Wu
language : en
Publisher:
Release Date : 2010
Design Exploration For Three Dimensional Integrated Circuits 3dics written by Xiaoxia Wu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with categories.
Die Stacking Architecture
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Author : Yuan Xie
language : en
Publisher: Springer Nature
Release Date : 2022-05-31
Die Stacking Architecture written by Yuan Xie and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Advances In Computer Systems Architecture
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Author : Lynn Choi
language : en
Publisher: Springer
Release Date : 2007-08-21
Advances In Computer Systems Architecture written by Lynn Choi and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-08-21 with Computers categories.
The refereed proceedings of the 12th Asia-Pacific Computer Systems Architecture Conference are presented in this volume. Twenty-six full papers are presented together with two keynote and eight invited lectures. Collectively, they represent some of the most important developments in computer systems architecture. The papers emphasize hardware and software techniques for state-of-the-art, multi-core and multi-threaded architectures.
Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-25
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-25 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-05-06
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-05-06 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
3d Integration For Vlsi Systems
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Author : Chuan Seng Tan
language : en
Publisher: CRC Press
Release Date : 2016-04-19
3d Integration For Vlsi Systems written by Chuan Seng Tan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Science categories.
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Network On Chip Architectures
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Author : Chrysostomos Nicopoulos
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-18
Network On Chip Architectures written by Chrysostomos Nicopoulos and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-18 with Technology & Engineering categories.
[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.