Die Stacking Architecture
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Die Stacking Architecture
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Author : Yuan Xie
language : en
Publisher: Springer Nature
Release Date : 2022-05-31
Die Stacking Architecture written by Yuan Xie and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Die Stacking Architecture
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Author : Yuan Xie
language : en
Publisher: Morgan & Claypool Publishers
Release Date : 2015-06-01
Die Stacking Architecture written by Yuan Xie and has been published by Morgan & Claypool Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-06-01 with Computers categories.
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor
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Author : Bhavani Prasad Dewan Sandur
language : en
Publisher: ProQuest
Release Date : 2006
Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor written by Bhavani Prasad Dewan Sandur and has been published by ProQuest this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Mechanical engineering categories.
This thesis focuses on carrying out a parametric study of stacking memory and the logic processor on the same substrate. In present technologies, logic processor and memory packages are located side-by-side on the board or they are packaged separately and then stacked on top of each other (Package-on-package [PoP]). Mixing memory and logic processor in the same stack has advantage and challenges, but requires the integration ability of economies-of-scale. The technology needed for packaging memory and logic dice on the same substrate is completely different as compared to packaging only memory dice or logic dice, or, packaging memory and logic separately and creating a single functional package [PoP]. Geometries needed were generated by using Pro/EngineerRTM Wildfire(TM) 2.0 as a Computer-Aided-Design (CAD) tool and were transferred to ANSYSRTM Workbench(TM) 10.0, where meshed analysis was conducted. Package architectures evaluated were rotated stack, staggered stack utilizing redistributed pads, and stacking with spacers, while all other parameters were held constant. The values of these parameters were determined to give a junction temperature of 100°C, which is an unacceptable value due to wafer level electromigration. A discussion is presented as to what parameters need to be adjusted in order to meet the required thermal design specification. In that light, a list of solutions consisting of increasing the heat transfer co-efficient on top of the package, the use of underfill, improved thermal conductivity of the PCB, and the use of a copper heat spreader were evaluated. Results are evaluated in the light of market segment requirements. (Abstract shortened by UMI.).
Multi Core Cache Hierarchies
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Author : Rajeev Balasubramonian
language : en
Publisher: Morgan & Claypool Publishers
Release Date : 2011
Multi Core Cache Hierarchies written by Rajeev Balasubramonian and has been published by Morgan & Claypool Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Computers categories.
A key determinant of overall system performance and power dissipation is the cache hierarchy since access to off-chip memory consumes many more cycles and energy than on-chip accesses. In addition, multi-core processors are expected to place ever higher bandwidth demands on the memory system. All these issues make it important to avoid off-chip memory access by improving the efficiency of the on-chip cache. Future multi-core processors will have many large cache banks connected by a network and shared by many cores. Hence, many important problems must be solved: cache resources must be allocated across many cores, data must be placed in cache banks that are near the accessing core, and the most important data must be identified for retention. Finally, difficulties in scaling existing technologies require adapting to and exploiting new technology constraints.The book attempts a synthesis of recent cache research that has focused on innovations for multi-core processors. It is an excellent starting point for early-stage graduate students, researchers, and practitioners who wish to understand the landscape of recent cache research.The book is suitable as a reference for advanced computer architecture classes as well as for experienced researchers and VLSI engineers.Table of Contents: Basic Elements of Large Cache Design / Organizing Data in CMP Last Level Caches / Policies Impacting Cache Hit Rates / Interconnection Networks within Large Caches / Technology / Concluding Remarks
Progress In Vlsi Design And Test
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Author : Hafizur Rahaman
language : en
Publisher: Springer
Release Date : 2012-06-26
Progress In Vlsi Design And Test written by Hafizur Rahaman and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-06-26 with Computers categories.
This book constitutes the refereed proceedings of the 16th International Symposium on VSLI Design and Test, VDAT 2012, held in Shibpur, India, in July 2012. The 30 revised regular papers presented together with 10 short papers and 13 poster sessions were carefully selected from 135 submissions. The papers are organized in topical sections on VLSI design, design and modeling of digital circuits and systems, testing and verification, design for testability, testing memories and regular logic arrays, embedded systems: hardware/software co-design and verification, emerging technology: nanoscale computing and nanotechnology.
Encyclopedia Of Thermal Packaging Set 2 Thermal Packaging Tools A 4 Volume Set
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Author :
language : en
Publisher: World Scientific
Release Date : 2014-10-23
Encyclopedia Of Thermal Packaging Set 2 Thermal Packaging Tools A 4 Volume Set written by and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-23 with Technology & Engineering categories.
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
3d Ic Stacking Technology
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Author : Banqiu Wu
language : en
Publisher: McGraw Hill Professional
Release Date : 2011-10-14
3d Ic Stacking Technology written by Banqiu Wu and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-14 with Technology & Engineering categories.
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research
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Author : Madhusudan Iyengar
language : en
Publisher: World Scientific
Release Date : 2014-08-25
Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research written by Madhusudan Iyengar and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-25 with Technology & Engineering categories.
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Deep Learning For Computer Architects
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Author : Brandon Reagen
language : en
Publisher: Springer Nature
Release Date : 2022-05-31
Deep Learning For Computer Architects written by Brandon Reagen and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.
Machine learning, and specifically deep learning, has been hugely disruptive in many fields of computer science. The success of deep learning techniques in solving notoriously difficult classification and regression problems has resulted in their rapid adoption in solving real-world problems. The emergence of deep learning is widely attributed to a virtuous cycle whereby fundamental advancements in training deeper models were enabled by the availability of massive datasets and high-performance computer hardware. This text serves as a primer for computer architects in a new and rapidly evolving field. We review how machine learning has evolved since its inception in the 1960s and track the key developments leading up to the emergence of the powerful deep learning techniques that emerged in the last decade. Next we review representative workloads, including the most commonly used datasets and seminal networks across a variety of domains. In addition to discussing the workloadsthemselves, we also detail the most popular deep learning tools and show how aspiring practitioners can use the tools with the workloads to characterize and optimize DNNs. The remainder of the book is dedicated to the design and optimization of hardware and architectures for machine learning. As high-performance hardware was so instrumental in the success of machine learning becoming a practical solution, this chapter recounts a variety of optimizations proposed recently to further improve future designs. Finally, we present a review of recent research published in the area as well as a taxonomy to help readers understand how various contributions fall in context.
Quantum Computer Systems
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Author : Yongshan Ding
language : en
Publisher: Springer Nature
Release Date : 2022-05-31
Quantum Computer Systems written by Yongshan Ding and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.
This book targets computer scientists and engineers who are familiar with concepts in classical computer systems but are curious to learn the general architecture of quantum computing systems. It gives a concise presentation of this new paradigm of computing from a computer systems' point of view without assuming any background in quantum mechanics. As such, it is divided into two parts. The first part of the book provides a gentle overview on the fundamental principles of the quantum theory and their implications for computing. The second part is devoted to state-of-the-art research in designing practical quantum programs, building a scalable software systems stack, and controlling quantum hardware components. Most chapters end with a summary and an outlook for future directions. This book celebrates the remarkable progress that scientists across disciplines have made in the past decades and reveals what roles computer scientists and engineers can play to enable practical-scale quantum computing.