Die Stacking Architecture
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Die Stacking Architecture
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Author : Yuan Xie
language : en
Publisher: Springer Nature
Release Date : 2022-05-31
Die Stacking Architecture written by Yuan Xie and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor
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Author : Bhavani Prasad Dewan Sandur
language : en
Publisher: ProQuest
Release Date : 2006
Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor written by Bhavani Prasad Dewan Sandur and has been published by ProQuest this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Mechanical engineering categories.
This thesis focuses on carrying out a parametric study of stacking memory and the logic processor on the same substrate. In present technologies, logic processor and memory packages are located side-by-side on the board or they are packaged separately and then stacked on top of each other (Package-on-package [PoP]). Mixing memory and logic processor in the same stack has advantage and challenges, but requires the integration ability of economies-of-scale. The technology needed for packaging memory and logic dice on the same substrate is completely different as compared to packaging only memory dice or logic dice, or, packaging memory and logic separately and creating a single functional package [PoP]. Geometries needed were generated by using Pro/EngineerRTM Wildfire(TM) 2.0 as a Computer-Aided-Design (CAD) tool and were transferred to ANSYSRTM Workbench(TM) 10.0, where meshed analysis was conducted. Package architectures evaluated were rotated stack, staggered stack utilizing redistributed pads, and stacking with spacers, while all other parameters were held constant. The values of these parameters were determined to give a junction temperature of 100°C, which is an unacceptable value due to wafer level electromigration. A discussion is presented as to what parameters need to be adjusted in order to meet the required thermal design specification. In that light, a list of solutions consisting of increasing the heat transfer co-efficient on top of the package, the use of underfill, improved thermal conductivity of the PCB, and the use of a copper heat spreader were evaluated. Results are evaluated in the light of market segment requirements. (Abstract shortened by UMI.).
Design For Test And Test Optimization Techniques For Tsv Based 3d Stacked Ics
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Author : Brandon Noia
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-19
Design For Test And Test Optimization Techniques For Tsv Based 3d Stacked Ics written by Brandon Noia and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-19 with Technology & Engineering categories.
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
Three Dimensional System Integration
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Author : Antonis Papanikolaou
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-12-07
Three Dimensional System Integration written by Antonis Papanikolaou and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-12-07 with Architecture categories.
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Progress In Vlsi Design And Test
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Author : Hafizur Rahaman
language : en
Publisher: Springer
Release Date : 2012-06-26
Progress In Vlsi Design And Test written by Hafizur Rahaman and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-06-26 with Computers categories.
This book constitutes the refereed proceedings of the 16th International Symposium on VSLI Design and Test, VDAT 2012, held in Shibpur, India, in July 2012. The 30 revised regular papers presented together with 10 short papers and 13 poster sessions were carefully selected from 135 submissions. The papers are organized in topical sections on VLSI design, design and modeling of digital circuits and systems, testing and verification, design for testability, testing memories and regular logic arrays, embedded systems: hardware/software co-design and verification, emerging technology: nanoscale computing and nanotechnology.
Multi Core Cache Hierarchies
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Author : Rajeev Balasubramonian
language : en
Publisher: Morgan & Claypool Publishers
Release Date : 2011
Multi Core Cache Hierarchies written by Rajeev Balasubramonian and has been published by Morgan & Claypool Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Computers categories.
A key determinant of overall system performance and power dissipation is the cache hierarchy since access to off-chip memory consumes many more cycles and energy than on-chip accesses. In addition, multi-core processors are expected to place ever higher bandwidth demands on the memory system. All these issues make it important to avoid off-chip memory access by improving the efficiency of the on-chip cache. Future multi-core processors will have many large cache banks connected by a network and shared by many cores. Hence, many important problems must be solved: cache resources must be allocated across many cores, data must be placed in cache banks that are near the accessing core, and the most important data must be identified for retention. Finally, difficulties in scaling existing technologies require adapting to and exploiting new technology constraints.The book attempts a synthesis of recent cache research that has focused on innovations for multi-core processors. It is an excellent starting point for early-stage graduate students, researchers, and practitioners who wish to understand the landscape of recent cache research.The book is suitable as a reference for advanced computer architecture classes as well as for experienced researchers and VLSI engineers.Table of Contents: Basic Elements of Large Cache Design / Organizing Data in CMP Last Level Caches / Policies Impacting Cache Hit Rates / Interconnection Networks within Large Caches / Technology / Concluding Remarks
Computer Engineering And Technology
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Author : Weixia Xu
language : en
Publisher: Springer
Release Date : 2016-01-13
Computer Engineering And Technology written by Weixia Xu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-01-13 with Computers categories.
This book constitutes the refereed proceedings of the 19th CCF Conference on Computer Engineering and Technology, NCCET 2015, held in Hefei, China, in October 2015. The 18 papers presented were carefully reviewed and selected from 158 submissions. They are organized in topical sections on processor architecture; application specific processors; computer application and software optimization; technology on the horizon.
Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-25
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-25 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Deep Learning For Computer Architects
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Author : Brandon Reagen
language : en
Publisher: Morgan & Claypool Publishers
Release Date : 2017-08-22
Deep Learning For Computer Architects written by Brandon Reagen and has been published by Morgan & Claypool Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-08-22 with Computers categories.
This is a primer written for computer architects in the new and rapidly evolving field of deep learning. It reviews how machine learning has evolved since its inception in the 1960s and tracks the key developments leading up to the emergence of the powerful deep learning techniques that emerged in the last decade. Machine learning, and specifically deep learning, has been hugely disruptive in many fields of computer science. The success of deep learning techniques in solving notoriously difficult classification and regression problems has resulted in their rapid adoption in solving real-world problems. The emergence of deep learning is widely attributed to a virtuous cycle whereby fundamental advancements in training deeper models were enabled by the availability of massive datasets and high-performance computer hardware. It also reviews representative workloads, including the most commonly used datasets and seminal networks across a variety of domains. In addition to discussing the workloads themselves, it also details the most popular deep learning tools and show how aspiring practitioners can use the tools with the workloads to characterize and optimize DNNs. The remainder of the book is dedicated to the design and optimization of hardware and architectures for machine learning. As high-performance hardware was so instrumental in the success of machine learning becoming a practical solution, this chapter recounts a variety of optimizations proposed recently to further improve future designs. Finally, it presents a review of recent research published in the area as well as a taxonomy to help readers understand how various contributions fall in context.
3d Ic Stacking Technology
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Author : Banqiu Wu
language : en
Publisher: McGraw Hill Professional
Release Date : 2011-10-14
3d Ic Stacking Technology written by Banqiu Wu and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-14 with Technology & Engineering categories.
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology