Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor

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Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor

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Author : Bhavani Prasad Dewan Sandur
language : en
Publisher: ProQuest
Release Date : 2006

Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor written by Bhavani Prasad Dewan Sandur and has been published by ProQuest this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Mechanical engineering categories.

This thesis focuses on carrying out a parametric study of stacking memory and the logic processor on the same substrate. In present technologies, logic processor and memory packages are located side-by-side on the board or they are packaged separately and then stacked on top of each other (Package-on-package [PoP]). Mixing memory and logic processor in the same stack has advantage and challenges, but requires the integration ability of economies-of-scale. The technology needed for packaging memory and logic dice on the same substrate is completely different as compared to packaging only memory dice or logic dice, or, packaging memory and logic separately and creating a single functional package [PoP]. Geometries needed were generated by using Pro/EngineerRTM Wildfire(TM) 2.0 as a Computer-Aided-Design (CAD) tool and were transferred to ANSYSRTM Workbench(TM) 10.0, where meshed analysis was conducted. Package architectures evaluated were rotated stack, staggered stack utilizing redistributed pads, and stacking with spacers, while all other parameters were held constant. The values of these parameters were determined to give a junction temperature of 100°C, which is an unacceptable value due to wafer level electromigration. A discussion is presented as to what parameters need to be adjusted in order to meet the required thermal design specification. In that light, a list of solutions consisting of increasing the heat transfer co-efficient on top of the package, the use of underfill, improved thermal conductivity of the PCB, and the use of a copper heat spreader were evaluated. Results are evaluated in the light of market segment requirements. (Abstract shortened by UMI.).

Die Stacking Architecture

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Author : Yuan Xie
language : en
Publisher: Springer Nature
Release Date : 2022-05-31

Die Stacking Architecture written by Yuan Xie and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.

The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.

Proceedings Of The Asme Heat Transfer Division

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Author :
language : en
Publisher:
Release Date : 2007

Proceedings Of The Asme Heat Transfer Division written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Combustion categories.

Handbook Of 3d Integration Volume 4

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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-25

Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-25 with Technology & Engineering categories.

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Vertical 3d Memory Technologies

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Author : Betty Prince
language : en
Publisher: John Wiley & Sons
Release Date : 2014-08-13

Vertical 3d Memory Technologies written by Betty Prince and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-13 with Technology & Engineering categories.

The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference

Dark Silicon And Future On Chip Systems

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Author :
language : en
Publisher: Academic Press
Release Date : 2018-07-26

Dark Silicon And Future On Chip Systems written by and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-07-26 with Computers categories.

Dark Silicon and the Future of On-chip Systems, Volume 110, the latest release in the Advances in Computers series published since 1960, presents detailed coverage of innovations in computer hardware, software, theory, design and applications, with this release focusing on an Introduction to dark silicon and future processors, a Revisiting of processor allocation and application mapping in future CMPs in the dark silicon era, Multi-objectivism in the dark silicon age, Dark silicon aware resource management for many-core systems, Dynamic power management for dark silicon multi-core processors, Topology specialization for networks-on-chip in the dark silicon era, and Emerging SRAM-based FPGA architectures. Provides in-depth surveys and tutorials on new computer technology Covers well-known authors and researchers in the field Presents extensive bibliographies with most chapters Includes volumes that are devoted to single themes or subfields of computer science, with this release focusing on Dark Silicon and Future On-chip Systems

Interlayer Thermal Management Of High Performance Microprocessor Chip Stacks

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Author : Thomas Brunschwiler
language : en
Publisher: Cuvillier Verlag
Release Date : 2012-04-12

Interlayer Thermal Management Of High Performance Microprocessor Chip Stacks written by Thomas Brunschwiler and has been published by Cuvillier Verlag this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-04-12 with Technology & Engineering categories.

Vertical integration of integrated circuit dies offers tremendous opportunities from an architectural as well as from an economical standpoint. Memory proximity supports performance scaling, and might enable significant energy savings. Partitioning of the corresponding functionalities and technologies into individual tiers can improve yield and modularity substantially. The paradigm change of stacking active components has a direct impact on heat-removal concepts and is therefore the motivation of this thesis. A stack comprised of a single logic layer in combination with multiple memory dies was identified as the limit for traditional back-side heat removal. To minimize junction temperatures, a stacking sequence with the high heat-flux component in close proximity to the cold plate is proposed. Interlayer cooling is the only volumetric heat-removal solution that scales with the number of dies in the stack. Hence, the focus of this thesis has been to identify the potential of interlayer cooling and to provide a modeling framework. Fundamental heat-transfer building blocks, such as unit-cell geometries, fluid structure modulation, fluid focusing, as well as four-port fluid delivery supporting power-map-aware heat removal, are discussed. Moreover, the theoretical foundation was experimentally validated on resistively heated convective test cavities. Therefore, specific bonding and insulation schemes were developed. Finally, the interlayer cooling performance was demonstrated on a pyramid chip stack. A multi-scale modeling approach for the efficient design of non-uniform heat-removal cavities was proposed. Periodic arrangements of heat-removal unit-cells in the cavities are described by the porousmedia approximation. Their characteristics are represented by the directional and velocity-dependent modified permeability and convective thermal resistance. An extended tensor description was developed to map the pressure gradient to the DARCY velocity. These parameters were derived from detailed numerical heat and mass transport modeling for arbitrary angle-of-attack of the fluid, using a set of novel routines that support periodic hydrodynamic and thermal boundary conditions. For pin-fin arrays, a biased fluid flow towards directions with maximal permeability could be observed. Fieldcoupling between the two-dimensional porous and adjacent three-dimensional solid domains was performed to derive the temperature field in the chip stack, including heat spreading in the silicon die. The modeling results are conservative and deviate less than 20% from the measured junction temperatures, when considering the temperature dependency of the coolant viscosity. This is a very good value considering the immense complexity reduction, resulting in a low computational time of less than 20 min on a desktop computer, to derive the mass transport and junction temperatures within a chip stack. Sputtered AuSn 80/20 was investigated as eutectic thin-film bond to form leak-tight interfaces with mechanical, electrical, and thermal functionality, as part of the technology development, to enable the use of water as coolant. The resulting bond quality was characterized for various underbump metallizations, atmospheres, and reflow/force profiles. The implementation of a differential pumped chamber allowed the use of formic acid in the flip chip bonder to reduce the tin oxide on the solder surface. The transient liquid-solid nature of the thin-film solder process explains the sensitivity on the underbump metallization and the heat ramp. Finally, processing guidelines supporting the design of leak-tight bond interfaces were summarized. Acceptable intermetallic compound formation was achieved at heat ramps of 100 K/min and with chromium as wetting layer. A bondline thickness of 4μm and a Teflon support provided sufficient compliance to form successful bonds considering the wedge errors of the flip chip bonder. Waterproof, two-level metallizations to mimic processor-like, non-uniform power maps with background and hot-spot heaters were developed for the implementation of single- and multi-cavity test sections. Pin-hole-free dielectric layers (1μm PECVD Si3N4 / 100nm ALD Al2O3) were achieved by conformal thin-film deposition. Numerous heat transfer assessments yielded the following insights: The limited heat capacity and flow rate of the coolant were identified as the major contributor to the thermal gradient in convective interlayer heat removal, even when water using as coolant. This is due to the small hydraulic diameter defined by the interconnect density (pitches 200 μm) and the length of the cross-flow heat exchange cavity ( 10 mm). The circular pin-fin in-line unit-cell was identified as the optimal heat transfer geometry for heat capacity limited cross-flow heat transfer. It results in the highest porosity, beneficial for efficient mass transport, compared with microchannels and other pin shapes at a given minimal radius constraint. Improved convective heat transfer towards the outlet of the cavities caused by transient vortex shedding was observed at increased REYNOLDS numbers ( 100) in the pin-fin in-line case. Fluid cavities with four-port fluid delivery and heat removal geometry modulation need to be considered for chip stacks larger than 2 cm2 and a interconnect pitch of  50 μm. Their effectiveness was demonstrated with cavities that were either partially fully or half populated with pin-fin arrays. These arrangements result in a significant increase in local fluid flow compared with uniform heat transfer cavities. Microchannels have proved to dissipate heat efficiently to multiple fluid cavities in the chip stack because of the improved die-to-die coupling, caused by the 50% fin fill factor. This is advantageous for disparate tier stacking. The high-power die can benefit from heat dissipation into cavities adjacent to low-power tiers. Additional recommendations, critical for electro-thermal co-design, are also discussed: i) Heat spreading in the silicon helps to mitigate hot-spots below a critical spatial dimension of 1mm. ii) High heat flux macros should be placed towards the fluid inlet and die corners if the two- or four-port configuration is implemented, respectively. iii) A manifold width of 1mm should be considered to achieve a fluid maldistribution below 1% between the fluid cavities. iv) A 1.6 ms thermal time constant was derived for an interlayer cooled chip stack. Hence, predictive cooling-loop control schemes need to be implemented to account for the comparable high pump time constant. Finally, for the first time, the superiority of interlayer cooling as a volumetric heat-removal method could be experimentally demonstrated on the pyramid chip stack test vehicle with four fluid cavities and three power dissipating tiers. Aligned hot-spots were included with 250 W/cm2 heat flux each. A total power of 390 W, corresponding to a 3.9 kW/cm3 volumetric heat flow, could be dissipated on the 1 cm2 device at a 54.7 K junction temperature increase. In comparison, back-side cooling would result in a junction temperature increase of 223 K with respect to the fluid inlet temperature of the microchannel cold plate. Using the results of the present work, it is now possible to design and predict mass and heat transport in an interlayer cooled chip stack, with the support of the proposed best-practice design rules in combination with the validated multi-scale modeling framework. The scalable nature of interlayer cooling will enable “Extreme-3D-Integration” with computation in sugar cube form factor chip stacks, extending integration density and efficiency scaling beyond the “End-of-2D-Scaling”.

Design Of 3d Integrated Circuits And Systems

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Author : Rohit Sharma
language : en
Publisher: CRC Press
Release Date : 2018-09-03

Design Of 3d Integrated Circuits And Systems written by Rohit Sharma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Technology & Engineering categories.

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility

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Author : Lih-Tyng Hwang
language : en
Publisher: John Wiley & Sons
Release Date : 2018-03-29

3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility written by Lih-Tyng Hwang and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-03-29 with Technology & Engineering categories.

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

3d Ic Stacking Technology

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Author : Banqiu Wu
language : en
Publisher: McGraw Hill Professional
Release Date : 2011-10-14

3d Ic Stacking Technology written by Banqiu Wu and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-14 with Technology & Engineering categories.

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology