Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor
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Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor
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Author : Bhavani Prasad Dewan Sandur
language : en
Publisher: ProQuest
Release Date : 2006
Thermal Management Of Die Stacking Architecture That Includes Memory And Logic Processor written by Bhavani Prasad Dewan Sandur and has been published by ProQuest this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Mechanical engineering categories.
This thesis focuses on carrying out a parametric study of stacking memory and the logic processor on the same substrate. In present technologies, logic processor and memory packages are located side-by-side on the board or they are packaged separately and then stacked on top of each other (Package-on-package [PoP]). Mixing memory and logic processor in the same stack has advantage and challenges, but requires the integration ability of economies-of-scale. The technology needed for packaging memory and logic dice on the same substrate is completely different as compared to packaging only memory dice or logic dice, or, packaging memory and logic separately and creating a single functional package [PoP]. Geometries needed were generated by using Pro/EngineerRTM Wildfire(TM) 2.0 as a Computer-Aided-Design (CAD) tool and were transferred to ANSYSRTM Workbench(TM) 10.0, where meshed analysis was conducted. Package architectures evaluated were rotated stack, staggered stack utilizing redistributed pads, and stacking with spacers, while all other parameters were held constant. The values of these parameters were determined to give a junction temperature of 100°C, which is an unacceptable value due to wafer level electromigration. A discussion is presented as to what parameters need to be adjusted in order to meet the required thermal design specification. In that light, a list of solutions consisting of increasing the heat transfer co-efficient on top of the package, the use of underfill, improved thermal conductivity of the PCB, and the use of a copper heat spreader were evaluated. Results are evaluated in the light of market segment requirements. (Abstract shortened by UMI.).
Proceedings Of The Asme Heat Transfer Division
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Author :
language : en
Publisher:
Release Date : 2007
Proceedings Of The Asme Heat Transfer Division written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Combustion categories.
Die Stacking Architecture
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Author : Yuan Xie
language : en
Publisher: Springer Nature
Release Date : 2022-05-31
Die Stacking Architecture written by Yuan Xie and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-31 with Technology & Engineering categories.
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-25
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-25 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Nano Chips 2030
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Author : Boris Murmann
language : en
Publisher: Springer Nature
Release Date : 2020-06-08
Nano Chips 2030 written by Boris Murmann and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-06-08 with Science categories.
In this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the performance and energy efficiency needed for AI-driven advancements in autonomous mobility, healthcare, and man-machine cooperation. Recent reviews of the status quo, as presented in CHIPS 2020 (Springer), have prompted the need for an urgent reassessment of opportunities in nanoelectronic information technology. As such, this book explores the foundations of a new era in nanoelectronics that will drive progress in intelligent chip systems for energy-efficient information technology, on-chip deep learning for data analytics, and quantum computing. Given its scope, this book provides a timely compendium that hopes to inspire and shape the future of nanoelectronics in the decades to come.
Vertical 3d Memory Technologies
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Author : Betty Prince
language : en
Publisher: John Wiley & Sons
Release Date : 2014-08-13
Vertical 3d Memory Technologies written by Betty Prince and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-13 with Technology & Engineering categories.
The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference
Design Automation Of Cyber Physical Systems
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Author : Mohammad Abdullah Al Faruque
language : en
Publisher: Springer
Release Date : 2019-05-17
Design Automation Of Cyber Physical Systems written by Mohammad Abdullah Al Faruque and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-05-17 with Technology & Engineering categories.
This book presents the state-of-the-art and breakthrough innovations in design automation for cyber-physical systems.The authors discuss various aspects of cyber-physical systems design, including modeling, co-design, optimization, tools, formal methods, validation, verification, and case studies. Coverage includes a survey of the various existing cyber-physical systems functional design methodologies and related tools will provide the reader unique insights into the conceptual design of cyber-physical systems.
3d Ic Stacking Technology
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Author : Banqiu Wu
language : en
Publisher: McGraw Hill Professional
Release Date : 2011-10-14
3d Ic Stacking Technology written by Banqiu Wu and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-14 with Technology & Engineering categories.
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
Hybrid Bonding Advanced Substrates Failure Mechanisms And Thermal Management For Chiplets And Heterogeneous Integration
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Author : John Lau
language : en
Publisher: Springer Nature
Release Date : 2025-05-18
Hybrid Bonding Advanced Substrates Failure Mechanisms And Thermal Management For Chiplets And Heterogeneous Integration written by John Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-05-18 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
Dark Silicon And Future On Chip Systems
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Author :
language : en
Publisher: Academic Press
Release Date : 2018-07-26
Dark Silicon And Future On Chip Systems written by and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-07-26 with Computers categories.
Dark Silicon and the Future of On-chip Systems, Volume 110, the latest release in the Advances in Computers series published since 1960, presents detailed coverage of innovations in computer hardware, software, theory, design and applications, with this release focusing on an Introduction to dark silicon and future processors, a Revisiting of processor allocation and application mapping in future CMPs in the dark silicon era, Multi-objectivism in the dark silicon age, Dark silicon aware resource management for many-core systems, Dynamic power management for dark silicon multi-core processors, Topology specialization for networks-on-chip in the dark silicon era, and Emerging SRAM-based FPGA architectures. - Provides in-depth surveys and tutorials on new computer technology - Covers well-known authors and researchers in the field - Presents extensive bibliographies with most chapters - Includes volumes that are devoted to single themes or subfields of computer science, with this release focusing on Dark Silicon and Future On-chip Systems