Fine Pitch Surface Mount Technology
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Fine Pitch Surface Mount Technology
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Author : Phil Marcoux
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Fine Pitch Surface Mount Technology written by Phil Marcoux and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Handbook Of Fine Pitch Surface Mount Technology
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 1994
Handbook Of Fine Pitch Surface Mount Technology written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computers categories.
Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.
Fine Pitch Surface Mount Technology
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Author : Phil Marcoux
language : en
Publisher:
Release Date : 2014-09-01
Fine Pitch Surface Mount Technology written by Phil Marcoux and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-09-01 with categories.
Surface Mount Technology With Fine Pitch Components
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Author : H. Danielsson
language : en
Publisher: Springer
Release Date : 1995
Surface Mount Technology With Fine Pitch Components written by H. Danielsson and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Technology & Engineering categories.
This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.
Design Guidelines For Surface Mount And Fine Pitch Technology
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Author : Vern Solberg
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1996
Design Guidelines For Surface Mount And Fine Pitch Technology written by Vern Solberg and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
Very Good,No Highlights or Markup,all pages are intact.
Surface Mount Technology For Concurrent Engineering And Manufacturing
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Author : Frank Classon
language : en
Publisher: McGraw-Hill Companies
Release Date : 1993
Surface Mount Technology For Concurrent Engineering And Manufacturing written by Frank Classon and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Technology & Engineering categories.
A guide to gaining the valuable miniaturization and cost-saving benefits of surface mount technology (SMT), showing how to integrate multiple company functions - designs, manufacturing, testing and management - and save time and money at every stage.
Surface Mount Technology
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Author : Ray Prasad
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Surface Mount Technology written by Ray Prasad and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Surface Mount Technology For Pc Boards
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Author : Glenn R. Blackwell
language : en
Publisher: Delmar Thomson Learning
Release Date : 2006
Surface Mount Technology For Pc Boards written by Glenn R. Blackwell and has been published by Delmar Thomson Learning this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Computers categories.
Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.
Design Guidelines For Surface Mount And Fine Pitch Technology
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Author : Vern Solberg
language : en
Publisher: McGraw-Hill
Release Date : 1999-11
Design Guidelines For Surface Mount And Fine Pitch Technology written by Vern Solberg and has been published by McGraw-Hill this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-11 with Architecture categories.
Solder Joint Reliability Of Bga Csp Flip Chip And Fine Pitch Smt Assemblies
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Author : John H. Lau
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1997
Solder Joint Reliability Of Bga Csp Flip Chip And Fine Pitch Smt Assemblies written by John H. Lau and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.