Design Guidelines For Surface Mount And Fine Pitch Technology
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Design Guidelines For Surface Mount And Fine Pitch Technology
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Author : Vern Solberg
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1996
Design Guidelines For Surface Mount And Fine Pitch Technology written by Vern Solberg and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
Very Good,No Highlights or Markup,all pages are intact.
Fine Pitch Surface Mount Technology
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Author : Phil Marcoux
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Fine Pitch Surface Mount Technology written by Phil Marcoux and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Surface Mount Technology
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Author : Ray Prasad
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Surface Mount Technology written by Ray Prasad and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Handbook Of Fine Pitch Surface Mount Technology
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 1994
Handbook Of Fine Pitch Surface Mount Technology written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computers categories.
Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.
Electronic Materials Handbook
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Author :
language : en
Publisher: ASM International
Release Date : 1989-11-01
Electronic Materials Handbook written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-01 with Technology & Engineering categories.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Surface Mount Technology
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Author : Ray P. Prasad
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Surface Mount Technology written by Ray P. Prasad and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.
Printed Circuit Board Design Using Autocad
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Author : Chris Schroeder
language : en
Publisher: Newnes
Release Date : 1998
Printed Circuit Board Design Using Autocad written by Chris Schroeder and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Computers categories.
Introduction to PCB Design * Schematic Drafting * Single-Sided PCB Design * Double-Sided PCB Design * Surface Mount PCB Design * Importing Gerber Files for Manufacturing Documentation * Importing HPGL Files for Manufacturing Documentation * Importing Gerber Artwork Files for Viewing * Importing Excellon Format NC Drill Data * Converting HPGL to Gerber Format * Appendix A: Gerber Format * Appendix B: Excellon Format * Appendix C: HPGL Format * Appendix D: Information about the Disk Supplied with the Book * Index.
Manufacturing
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Author : Beno Benhabib
language : en
Publisher: CRC Press
Release Date : 2003-07-03
Manufacturing written by Beno Benhabib and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-07-03 with Technology & Engineering categories.
From concept development to final production, this comprehensive text thoroughly examines the design, prototyping, and fabrication of engineering products and emphasizes modern developments in system modeling, analysis, and automatic control. This reference details various management strategies, design methodologies, traditional production techniques, and assembly applications for clear illustration of manufacturing engineering technology in the modern age. Considers a variety of methods for product design including axiomatic design, design for X, group technology, and the Taguchi method, as well as modern production techniques including laser-beam machining, microlithography.
Design To Test
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Author : John Turino
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Design To Test written by John Turino and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
This book is the second edition of Design to Test. The first edition, written by myself and H. Frank Binnendyk and first published in 1982, has undergone several printings and become a standard in many companies, even in some countries. Both Frank and I are very proud of the success that our customers have had in utilizing the information, all of it still applicable to today's electronic designs. But six years is a long time in any technology field. I therefore felt it was time to write a new edition. This new edition, while retaining the basic testability prin ciples first documented six years ago, contains the latest material on state-of-the-art testability techniques for electronic devices, boards, and systems and has been completely rewritten and up dated. Chapter 15 from the first edition has been converted to an appendix. Chapter 6 has been expanded to cover the latest tech nology devices. Chapter 1 has been revised, and several examples throughout the book have been revised and updated. But some times the more things change, the more they stay the same. All of the guidelines and information presented in this book deal with the three basic testability principles-partitioning, control, and visibility. They have not changed in years. But many people have gotten smarter about how to implement those three basic test ability principles, and it is the aim of this text to enlighten the reader regarding those new (and old) testability implementation techniques.
Reliability Engineering
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Author : Alessandro Birolini
language : en
Publisher: Springer Science & Business Media
Release Date : 2003-08-20
Reliability Engineering written by Alessandro Birolini and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-08-20 with Technology & Engineering categories.
Using clear language, this book shows you how to build in, evaluate, and demonstrate reliability and availability of components, equipment, and systems. It presents the state of the art in theory and practice, and is based on the author's 30 years' experience, half in industry and half as professor of reliability engineering at the ETH, Zurich. In this extended edition, new models and considerations have been added for reliability data analysis and fault tolerant reconfigurable repairable systems including reward and frequency / duration aspects. New design rules for imperfect switching, incomplete coverage, items with more than 2 states, and phased-mission systems, as well as a Monte Carlo approach useful for rare events are given. Trends in quality management are outlined. Methods and tools are given in such a way that they can be tailored to cover different reliability requirement levels and be used to investigate safety as well. The book contains a large number of tables, figures, and examples to support the practical aspects.