Handbook Of Surface Mount Technology
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Handbook Of Surface Mount Technology
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Author : Stephen W. Hinch
language : en
Publisher: Longman Scientific and Technical
Release Date : 1988
Handbook Of Surface Mount Technology written by Stephen W. Hinch and has been published by Longman Scientific and Technical this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Technology & Engineering categories.
A Scientific Guide To Surface Mount Technology
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Author : Colin Lea
language : en
Publisher:
Release Date : 1988
A Scientific Guide To Surface Mount Technology written by Colin Lea and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Technology & Engineering categories.
Handbook Of Surface Mount Technology
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Author : Stephen W. Hinch
language : en
Publisher:
Release Date : 1988
Handbook Of Surface Mount Technology written by Stephen W. Hinch and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Electronic packaging categories.
Handbook Of Fine Pitch Surface Mount Technology
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 1993-12-14
Handbook Of Fine Pitch Surface Mount Technology written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993-12-14 with Technology & Engineering categories.
Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.
Handbook Of Fine Pitch Surface Mount Technology
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 1994
Handbook Of Fine Pitch Surface Mount Technology written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computers categories.
Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.
Smt Soldering Handbook
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Author : RUDOLF STRAUSS
language : en
Publisher: Elsevier
Release Date : 1998-02-24
Smt Soldering Handbook written by RUDOLF STRAUSS and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-02-24 with Technology & Engineering categories.
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology
Soldering Handbook For Printed Circuits And Surface Mounting
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Author : Howard H. Manko
language : en
Publisher: Springer Science & Business Media
Release Date : 1995-10-31
Soldering Handbook For Printed Circuits And Surface Mounting written by Howard H. Manko and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-10-31 with Computers categories.
Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
A Beginners Guide To Surface Mount Technology
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Author : RATAN SENGUPTA
language : en
Publisher: Blue Rose Publishers
Release Date : 2022-12-30
A Beginners Guide To Surface Mount Technology written by RATAN SENGUPTA and has been published by Blue Rose Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-12-30 with Education categories.
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through hole technology (THT). SMT comes into existence because our earlier version of Through Hole Manufacturing Technology (THT)were having following limitations: 1.Large in Size 2.Only one side of PCB can be used 3.Lesser functions 4.Automation of PCB Assembly restricted 5.Cross Talk becomes predominating factor at Higher Frequency, restricting evolution of Mobile Technology.
Surface Mount Technology
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Author : Ray P. Prasad
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Surface Mount Technology written by Ray P. Prasad and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.
The Electrical Engineering Handbook Second Edition
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Author : Richard C. Dorf
language : en
Publisher: CRC Press
Release Date : 1997-09-26
The Electrical Engineering Handbook Second Edition written by Richard C. Dorf and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-09-26 with Technology & Engineering categories.
In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.