Heat Management In Integrated Circuits
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Heat Management In Integrated Circuits
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Author : Seda Ogrenci-Memik
language : en
Publisher:
Release Date : 2015
Heat Management In Integrated Circuits written by Seda Ogrenci-Memik and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with TECHNOLOGY & ENGINEERING categories.
"As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important. This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above"--Provided by publisher.
Heat Management In Integrated Circuits
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Author : Seda Ogrenci-Memik
language : en
Publisher: IET
Release Date : 2015-12
Heat Management In Integrated Circuits written by Seda Ogrenci-Memik and has been published by IET this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-12 with Computers categories.
Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.
Thermal And Power Management Of Integrated Circuits
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Author : Arman Vassighi
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-06-01
Thermal And Power Management Of Integrated Circuits written by Arman Vassighi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-06-01 with Technology & Engineering categories.
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Three Dimensional Integrated Circuit Design
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Author : Vasilis F. Pavlidis
language : en
Publisher: Newnes
Release Date : 2017-07-04
Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-04 with Technology & Engineering categories.
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Advanced Materials For Thermal Management Of Electronic Packaging
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Author : Xingcun Colin Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-01-05
Advanced Materials For Thermal Management Of Electronic Packaging written by Xingcun Colin Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-05 with Technology & Engineering categories.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Design Of Power Management Integrated Circuits
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Author : Bernhard Wicht
language : en
Publisher: John Wiley & Sons
Release Date : 2024-05-14
Design Of Power Management Integrated Circuits written by Bernhard Wicht and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-05-14 with Technology & Engineering categories.
Design of Power Management Integrated Circuits Comprehensive resource on power management ICs affording new levels of functionality and applications with cost reduction in various fields Design of Power Management Integrated Circuits is a comprehensive reference for power management IC design, covering the circuit design of main power management circuits like linear and switched-mode voltage regulators, along with sub-circuits such as power switches, gate drivers and their supply, level shifters, the error amplifier, current sensing, and control loop design. Circuits for protection and diagnostics, as well as aspects of the physical design like lateral and vertical power delivery, pin-out, floor planning, grounding/supply guidelines, and packaging, are also addressed. A full chapter is dedicated to the design of integrated passives. The text illustrates the application of power management integrated circuits (PMIC) to growth areas like computing, the Internet of Things, mobility, and renewable energy. Includes numerous real-world examples, case studies, and exercises illustrating key design concepts and techniques. Offering a unique insight into this rapidly evolving technology through the author’s experience developing PMICs in both the industrial and academic environment, Design of Power Management Integrated Circuits includes information on: Capacitive, inductive and hybrid DC-DC converters and their essential circuit blocks, covering error amplifiers, comparators, and ramp generators Sensing, protection, and diagnostics, covering thermal protection, inductive loads and clamping structures, under-voltage, reference and power-on reset generation Integrated MOS, MOM and MIM capacitors, integrated inductors Control loop design and PWM generation ensuring stability and fast transient response; subharmonic oscillations in current mode control (analysis and circuit design for slope compensation) DC behavior and DC-related circuit design, covering power efficiency, line and load regulation, error amplifier, dropout, and power transistor sizing Commonly used level shifters (including sizing rules) and cascaded (tapered) driver sizing and optimization guidelines Optimizing the physical design considering packaging, floor planning, EMI, pinout, PCB design and thermal design Design of Power Management Integrated Circuits is an essential resource on the subject for circuit designers/IC designers, system engineers, and application engineers, along with advanced undergraduate students and graduate students in related programs of study.
Design Of 3d Integrated Circuits And Systems
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Author : Rohit Sharma
language : en
Publisher: CRC Press
Release Date : 2018-09-03
Design Of 3d Integrated Circuits And Systems written by Rohit Sharma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Technology & Engineering categories.
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Heat Transfer
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Author : Younes Shabany
language : en
Publisher: CRC Press
Release Date : 2009-12-17
Heat Transfer written by Younes Shabany and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-17 with Science categories.
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Adaptive Cooling Of Integrated Circuits Using Digital Microfluidics
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Author : Philip Y. Paik
language : en
Publisher: Artech House Publishers
Release Date : 2007
Adaptive Cooling Of Integrated Circuits Using Digital Microfluidics written by Philip Y. Paik and has been published by Artech House Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Science categories.
Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.
Integrated Electronic Circuits
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Author : Jad G. Atallah
language : en
Publisher: Springer Nature
Release Date : 2024-08-08
Integrated Electronic Circuits written by Jad G. Atallah and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-08-08 with Technology & Engineering categories.
This textbook takes a unique approach to fundamental courses in electronic circuits, providing the students with early exposure to Integrated Circuit (IC) technology and Electronic Design Automation (EDA) tools using a Process Design Kit (PDK). This aims at preparing the students to participate in the advancements taking place in the field today and in the foreseeable future. The book follows a novel, hands-on approach to electronics education, combining a unique pedagogy that balances theory with practice. The starting point consists of circuit simulation results rather than device physics. Therefore, hand calculations and simulations are readily used, and the loop between the two is closed. The information is presented visually not only for the circuits, but also for the signals involved, all of which being simulation results. The book is aimed to be easily read and understood by the students, which gives the instructors ample time to concentrate on the important points. The book discusses technology and its applications and limitations along with the IC design flow. It goes in depth into various types of circuits including analog, digital, and mixed-signal, where the students are encouraged to discover the connections between the different applications. This is because future electronic circuit designers should be able to understand system and technology aspects, and be able to switch easily between applications. This results in the students being better-prepared for future cross-disciplinary innovations.