High Speed Interconnects In Vlsi Design Modeling And Signal Integrity
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High Speed Interconnects In Vlsi Design Modeling And Signal Integrity
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Author : Dr. Bhaskar Gugulothu
language : en
Publisher: AQUA PUBLICATIONS
Release Date :
High Speed Interconnects In Vlsi Design Modeling And Signal Integrity written by Dr. Bhaskar Gugulothu and has been published by AQUA PUBLICATIONS this book supported file pdf, txt, epub, kindle and other format this book has been release on with Computers categories.
The rapid advancement in VLSI (Very-Large-Scale Integration) technology has ushered in a new era of high-performance systems, where interconnects have become a critical bottleneck in determining speed, power, and reliability. This textbook provides a comprehensive understanding of high-speed interconnect design, analytical and simulation-based modeling techniques, and signal integrity challenges in modern integrated circuits. It is intended for graduate students, researchers, and industry professionals involved in IC design and signal integrity analysis.
Compact Models And Measurement Techniques For High Speed Interconnects
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Author : Rohit Sharma
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-02-17
Compact Models And Measurement Techniques For High Speed Interconnects written by Rohit Sharma and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-17 with Technology & Engineering categories.
Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Compact Models And Performance Investigations For Subthreshold Interconnects
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Author : Rohit Dhiman
language : en
Publisher: Springer
Release Date : 2014-11-07
Compact Models And Performance Investigations For Subthreshold Interconnects written by Rohit Dhiman and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-07 with Technology & Engineering categories.
The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.
Soc System On A Chip Testing For Plug And Play Test Automation
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Author : Krishnendu Chakrabarty
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-04-17
Soc System On A Chip Testing For Plug And Play Test Automation written by Krishnendu Chakrabarty and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-04-17 with Technology & Engineering categories.
System-on-a-Chip (SOC) integrated circuits composed of embedded cores are now commonplace. Nevertheless, there remain several roadblocks to rapid and efficient system integration. Test development is seen as a major bottleneck in SOC design and manufacturing capabilities. Testing SOCs is especially challenging in the absence of standardized test structures, test automation tools, and test protocols. In addition, long interconnects, high density, and high-speed designs lead to new types of faults involving crosstalk and signal integrity. SOC (System-on-a-Chip) Testing for Plug and Play Test Automation is an edited work containing thirteen contributions that address various aspects of SOC testing. SOC (System-on-a-Chip) Testing for Plug and Play Test Automation is a valuable reference for researchers and students interested in various aspects of SOC testing.
Layout Optimization In Vlsi Design
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Author : Bing Lu
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29
Layout Optimization In Vlsi Design written by Bing Lu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Computers categories.
Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.
Advanced Signal Integrity For High Speed Digital Designs
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Author : Stephen H. Hall
language : en
Publisher: John Wiley & Sons
Release Date : 2011-09-20
Advanced Signal Integrity For High Speed Digital Designs written by Stephen H. Hall and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-09-20 with Science categories.
A synergistic approach to signal integrity for high-speed digital design This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications. Following an introduction to the importance of signal integrity, chapter coverage includes: Electromagnetic fundamentals for signal integrity Transmission line fundamentals Crosstalk Non-ideal conductor models, including surface roughness and frequency-dependent inductance Frequency-dependent properties of dielectrics Differential signaling Mathematical requirements of physical channels S-parameters for digital engineers Non-ideal return paths and via resonance I/O circuits and models Equalization Modeling and budgeting of timing jitter and noise System analysis using response surface modeling Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.
Nano Interconnect Materials And Models For Next Generation Integrated Circuit Design
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Author : Sandip Bhattacharya
language : en
Publisher: CRC Press
Release Date : 2023-12-22
Nano Interconnect Materials And Models For Next Generation Integrated Circuit Design written by Sandip Bhattacharya and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-12-22 with Technology & Engineering categories.
Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: • Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). • Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. • Describes hybrid CNT- and GNR-based interconnects. • Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. • Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics.
Analytical Methodology Of Tree Microstrip Interconnects Modelling For Signal Distribution
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Author : Blaise Ravelo
language : en
Publisher: Springer Nature
Release Date : 2019-11-21
Analytical Methodology Of Tree Microstrip Interconnects Modelling For Signal Distribution written by Blaise Ravelo and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-21 with Technology & Engineering categories.
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement
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Author : Yue Ma
language : en
Publisher: CRC Press
Release Date : 2019-03-08
Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement written by Yue Ma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-08 with Computers categories.
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
High Speed Signaling
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Author : Kyung Suk Oh
language : en
Publisher:
Release Date : 2011
High Speed Signaling written by Kyung Suk Oh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Signal integrity (Electronics) categories.
New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field's most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge. Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy. The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes New advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.