Home eBooks Download › integrated circuit quality and reliability

Integrated Circuit Quality And Reliability

Download Integrated Circuit Quality And Reliability PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Integrated Circuit Quality And Reliability book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page

Integrated Circuit Quality And Reliability

DOWNLOAD
Author : Eugene R. Hnatek
language : en
Publisher: CRC Press
Release Date : 2018-10-03

Integrated Circuit Quality And Reliability written by Eugene R. Hnatek and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.

Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

Integrated Circuit Quality And Reliability

DOWNLOAD
Author : Eugene R. Hnatek
language : en
Publisher: CRC Press
Release Date : 2018-10-03

Integrated Circuit Quality And Reliability

DOWNLOAD
Author : Eugene R. Hnatek
language : en
Publisher:
Release Date : 1987

Integrated Circuit Quality And Reliability written by Eugene R. Hnatek and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with Technology & Engineering categories.

Integrated Circuit Manufacturability

DOWNLOAD
Author : José Pineda de Gyvez
language : en
Publisher: John Wiley & Sons
Release Date : 1998-10-30

Integrated Circuit Manufacturability written by José Pineda de Gyvez and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-10-30 with Technology & Engineering categories.

"INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."

Thermal And Power Management Of Integrated Circuits

DOWNLOAD
Author : Arman Vassighi
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-06-01

Thermal And Power Management Of Integrated Circuits written by Arman Vassighi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-06-01 with Technology & Engineering categories.

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Integrated Circuit Failure Analysis

DOWNLOAD
Author : Friedrich Beck
language : en
Publisher: John Wiley & Sons
Release Date : 1998-02-04

Integrated Circuit Failure Analysis written by Friedrich Beck and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-02-04 with Technology & Engineering categories.

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text will enable both academic and industrial researchers and IC designers to expand the range of analytical and preparative methods at their disposal and to adapt to the needs of new technologies.

Reliability Of Electronic Components

DOWNLOAD
Author : Titu I. Bajenescu
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Reliability Of Electronic Components written by Titu I. Bajenescu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.

The first detailed studies of electronic components reliability were undertaken to improve the performance of communications and navigational systems used by the American army. The techniques then developed were subsequently refined and applied to equipment used for many other applications where high reliability was of paramount importance - for example in civil airline electronic systems. The evolution of good and reliable products is the responsibility of technical and professional persons, engineers and designers. These individuals cannot succeed unless they are given adequate opportunity to apply their arts and mysteries so as to bring the end-product to the necessary level of satisfaction. Few managements, however, are yet aware of the far greater potential value of the reliability of their products or services. Yet customer satisfaction depends, in most cases, far more on the reliability of performance than on quality in the industrial sense. There was a time when reliable design could be prescribed simply as "picking good parts and using them right". Nowadays the complexity of systems, particularly electronic systems, and the demand for ultrahigh reliability in many applications mean that sophisticated methods based on numerical analysis and probability techniques have been brought to bear - particularly in the early stages of design - on determining the feasibility of systems.

Electromigration Modeling At Circuit Layout Level

DOWNLOAD
Author : Cher Ming Tan
language : en
Publisher: Springer
Release Date : 2013-05-04

Electromigration Modeling At Circuit Layout Level written by Cher Ming Tan and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-05-04 with Technology & Engineering categories.

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

Techniques For The Control Of Integrated Circuit Quality And Reliability Volume Ii Appendices

DOWNLOAD
Author : Erwin A. Herr
language : en
Publisher:
Release Date : 1967

Techniques For The Control Of Integrated Circuit Quality And Reliability Volume Ii Appendices written by Erwin A. Herr and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1967 with categories.

This is a program directed to establish techniques for the control of integrated circuit quality and reliability. The primary objective of this program was to investigate a method to monitor integrated circuit fabrication which would provide information about the quality and reliability of the device. The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semiconductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits.

Technical Abstract Bulletin

DOWNLOAD
Author :
language : en
Publisher:
Release Date :

Technical Abstract Bulletin written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with Science categories.

Integrated Circuit Quality And Reliability

Recent Posts