Integrated Circuit Quality And Reliability
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Integrated Circuit Quality And Reliability
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Author : Eugene R. Hnatek
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Integrated Circuit Quality And Reliability written by Eugene R. Hnatek and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Integrated Circuit Manufacturability
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Author : José Pineda de Gyvez
language : en
Publisher: John Wiley & Sons
Release Date : 1998-10-30
Integrated Circuit Manufacturability written by José Pineda de Gyvez and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-10-30 with Technology & Engineering categories.
"INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."
Techniques For The Control Of Integrated Circuit Quality And Reliability Volume Ii Appendices
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Author : Erwin A. Herr
language : en
Publisher:
Release Date : 1967
Techniques For The Control Of Integrated Circuit Quality And Reliability Volume Ii Appendices written by Erwin A. Herr and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1967 with categories.
This is a program directed to establish techniques for the control of integrated circuit quality and reliability. The primary objective of this program was to investigate a method to monitor integrated circuit fabrication which would provide information about the quality and reliability of the device. The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semiconductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits.
Characterization Of Integrated Circuit Packaging Materials
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Author : Thomas Moore
language : en
Publisher: Elsevier
Release Date : 2013-10-22
Characterization Of Integrated Circuit Packaging Materials written by Thomas Moore and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Technical Abstract Bulletin
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Author :
language : en
Publisher:
Release Date :
Technical Abstract Bulletin written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with Science categories.
Techniques For The Control Of Integrated Circuit Quality And Reliability
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Author : Erwin A. Herr
language : en
Publisher:
Release Date : 1967
Techniques For The Control Of Integrated Circuit Quality And Reliability written by Erwin A. Herr and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1967 with categories.
The use of the test pattern concept, TEG, for in-process quality control and device reliability of integrated circuits was investigated during the fabrication and reliability testing phases of integrated circuit production. The Test Element Group (TEG), which was diffused on the wafer at the same time as the elements of the integrated circuit, proved to be a very successful vehicle for achieving the goals of this program. The TEG was made up of a number of selected elements in the integrated circuit diffusion pattern, metallized and connected for test evaluation as discrete components. The relationship was investigated between in-process variables of semi-conductor fabrication, pre-stress characteristics of TEGS and integrated circuits and the post-stress characteristics of TEGS and integrated circuits. The basic purpose of this program has been met.
Lifetime Reliability Aware Design Of Integrated Circuits
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Author : Mohsen Raji
language : en
Publisher: Springer Nature
Release Date : 2022-11-16
Lifetime Reliability Aware Design Of Integrated Circuits written by Mohsen Raji and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-16 with Technology & Engineering categories.
This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.
Competitive Factors Influencing World Trade In Integrated Circuits
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Author : United States International Trade Commission
language : en
Publisher:
Release Date : 1979
Competitive Factors Influencing World Trade In Integrated Circuits written by United States International Trade Commission and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1979 with Competition, International categories.
International Competitiveness In Electronics
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Author : Congress of the U.S., Washington, DC. Office of Technology Assessment
language : en
Publisher: DIANE Publishing
Release Date : 1983
International Competitiveness In Electronics written by Congress of the U.S., Washington, DC. Office of Technology Assessment and has been published by DIANE Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1983 with categories.
This assessment continues the Office of Technology Assessment's (OTA) exploration of the meaning of industrial policy in the United States context, while also examining the industrial policies of several U.S. economic rivals. The major focus is on electronics, an area which virtually defines "high technology" of the 1980's. The assessment sets the characteristics of the technology itself alongside other forces that exert major influences over international competitiveness. Specific areas addressed include: electronics technology; structure, trade, and competitiveness in the international electronics industry; quality, reliability, and automation in manufacturing; role of financing in competitiveness and electronics; human resources (education, training, management); employment effects; national industrial policies; and U.S. trade policies and their effects. The report concludes by outlining five options for a U.S. industrial policy, drawing on electronics for examples of past and prospective impacts, as well as on OTA's previous studies of the steel and automotive industries. A detailed summary and introductory comments are included. Also included in appendices are case studies in the development and marketing of electronics products, a discussion of offshore manufacturing, and a glossary of terms used in the assessment. (JN)
International Competitiveness In Electronics
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Author :
language : en
Publisher:
Release Date : 1983
International Competitiveness In Electronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1983 with Competition, International categories.