Lifetime Reliability Aware Design Of Integrated Circuits
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Lifetime Reliability Aware Design Of Integrated Circuits
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Author : Mohsen Raji
language : en
Publisher: Springer Nature
Release Date : 2022-11-16
Lifetime Reliability Aware Design Of Integrated Circuits written by Mohsen Raji and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-16 with Technology & Engineering categories.
This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.
Fundamentals Of Electromigration Aware Integrated Circuit Design
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Author : Jens Lienig
language : en
Publisher: Springer
Release Date : 2018-02-23
Fundamentals Of Electromigration Aware Integrated Circuit Design written by Jens Lienig and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-02-23 with Technology & Engineering categories.
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Circuit Design For Reliability
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Author : Ricardo Reis
language : en
Publisher: Springer
Release Date : 2014-11-08
Circuit Design For Reliability written by Ricardo Reis and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-08 with Technology & Engineering categories.
This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management.
Design Tool And Methodologies For Interconnect Reliability Analysis In Integrated Circuits
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Author : Syed Mohiul Alam
language : en
Publisher:
Release Date : 2004
Design Tool And Methodologies For Interconnect Reliability Analysis In Integrated Circuits written by Syed Mohiul Alam and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with categories.
Total on-chip interconnect length has been increasing exponentially with technology scaling. Consequently, interconnect-driven design is an emerging trend in state-of-the- art integrated circuits. Cu-based interconnect technology is expected to meet some of the challenges of technology scaling. However, Cu interconnects still pose a reliability concern due to electromigration-induced failure over time. The major contribution of this thesis is a new reliability CAD tool, SysRel, for thermal-aware reliability analysis with either Al or Cu metallization technology in conventional and three-dimensional integrated circuits. An interconnect tree is the fundamental reliability unit for circuit-level reliability assessments for metallization schemes with fully-blocking boundaries at the vias. When vias do not block electromigration as indicated in some Cu experimental studies, multiple trees linked by a non-blocking via are merged to create a single fundamental reliability unit. SysRel utilizes a tree-based hierarchical analysis that sufficiently captures the differences between electromigration behavior in Al and Cu metallizations. The hierarchical flow first identifies electromigration-critical nets or "mortal" trees, applies a default model to estimate the lifetimes of individual trees, and then produces a set of full-chip reliability metrics based on stochastic analysis using the desired lifetime of the circuit. We have exercised SysRel to compare layout-specific reliability with Cu and Al metallizations in various circuits and circuit elements. Significantly improved test-level reliability in Cu is required to achieve equivalent circuit-level reliability. The required improvement will increase as low-k dielectric materials are introduced and liner thicknesses are reduced in future.
Integrated Circuit Quality And Reliability
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Author : Eugene R. Hnatek
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Integrated Circuit Quality And Reliability written by Eugene R. Hnatek and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Design For High Performance Low Power And Reliable 3d Integrated Circuits
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Author : Sung Kyu Lim
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-11-27
Design For High Performance Low Power And Reliable 3d Integrated Circuits written by Sung Kyu Lim and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-11-27 with Technology & Engineering categories.
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Reliability Aware Memory Design Using Advanced Reconfiguration Mechanisms
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Author : Peyman Pouyan
language : en
Publisher:
Release Date : 2015
Reliability Aware Memory Design Using Advanced Reconfiguration Mechanisms written by Peyman Pouyan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.
Fast and Complex Data Memory systems has become a necessity in modern computational units in today's integrated circuits. These memory systems are integrated in form of large embedded memory for data manipulation and storage. This goal has been achieved by the aggressive scaling of transistor dimensions to few nanometer (nm) sizes, though; such a progress comes with a drawback, making it critical to obtain high yields of the chips. Process variability, due to manufacturing imperfections, along with temporal aging, mainly induced by higher electric fields and temperature, are two of the more significant threats that can no longer be ignored in nano-scale embedded memory circuits, and can have high impact on their robustness. Static Random Access Memory (SRAM) is one of the most used embedded memories; generally implemented with the smallest device dimensions and therefore its robustness can be highly important in nanometer domain design paradigm. Their reliable operation needs to be considered and achieved both in cell and also in architectural SRAM array design. Recently, and with the approach to near/below 10nm design generations, novel non-FET devices such as Memristors are attracting high attention as a possible candidate to replace the conventional memory technologies. In spite of their favorable characteristics such as being low power and highly scalable, they also suffer with reliability challenges, such as process variability and endurance degradation, which needs to be mitigated at device and architectural level. This thesis work tackles such problem of reliability concerns in memories by utilizing advanced reconfiguration techniques. In both SRAM arrays and Memristive crossbar memories novel reconfiguration strategies are considered and analyzed, which can extend the memory lifetime. These techniques include monitoring circuits to check the reliability status of the memory units, and architectural implementations in order to reconfigure the memory system to a more reliable configuration before a fail happens.
Variation Aware Design Of Custom Integrated Circuits A Hands On Field Guide
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Author : Trent McConaghy
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-10-02
Variation Aware Design Of Custom Integrated Circuits A Hands On Field Guide written by Trent McConaghy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-10-02 with Technology & Engineering categories.
This book targets custom IC designers who are encountering variation issues in their designs, especially for modern process nodes at 45nm and below, such as statistical process variations, environmental variations, and layout effects. It teaches them the state-of-the-art in Variation-Aware Design tools, which help the designer to analyze quickly the variation effects, identify the problems, and fix the problems. Furthermore, this book describes the algorithms and algorithm behavior/performance/limitations, which is of use to designers considering these tools, designers using these tools, CAD researchers, and CAD managers.
Physical Design For 3d Integrated Circuits
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Author : Aida Todri-Sanial
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Physical Design For 3d Integrated Circuits written by Aida Todri-Sanial and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Aging Aware Design Methods For Reliable Analog Integrated Circuits Using Operating Point Dependent Degradation
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Author :
language : en
Publisher:
Release Date : 2015
Aging Aware Design Methods For Reliable Analog Integrated Circuits Using Operating Point Dependent Degradation written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.