Interlayer Dielectrics For Semiconductor Technologies
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Interlayer Dielectrics For Semiconductor Technologies
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Author : Shyam P Muraka
language : en
Publisher: Elsevier
Release Date : 2003-10-13
Interlayer Dielectrics For Semiconductor Technologies written by Shyam P Muraka and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-10-13 with Science categories.
Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.
Ulsi Semiconductor Technology Atlas
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Author : Chih-Hang Tung
language : en
Publisher: John Wiley & Sons
Release Date : 2003-10-06
Ulsi Semiconductor Technology Atlas written by Chih-Hang Tung and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-10-06 with Technology & Engineering categories.
More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs
Semiconductor Technology Istc2001
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Author : Ming Yang
language : en
Publisher:
Release Date : 2001
Semiconductor Technology Istc2001 written by Ming Yang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Semiconductors categories.
Advances In Embedded And Fan Out Wafer Level Packaging Technologies
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Author : Beth Keser
language : en
Publisher: John Wiley & Sons
Release Date : 2019-02-12
Advances In Embedded And Fan Out Wafer Level Packaging Technologies written by Beth Keser and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-12 with Technology & Engineering categories.
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Emerging Semiconductor Technology
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Author : Dinesh C. Gupta
language : en
Publisher: ASTM International
Release Date : 1987
Emerging Semiconductor Technology written by Dinesh C. Gupta and has been published by ASTM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with Technology & Engineering categories.
Materials For Information Technology
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Author : Ehrenfried Zschech
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-07-02
Materials For Information Technology written by Ehrenfried Zschech and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-07-02 with Technology & Engineering categories.
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
High K Gate Dielectric Materials
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Author : Niladri Pratap Maity
language : en
Publisher: CRC Press
Release Date : 2020-12-18
High K Gate Dielectric Materials written by Niladri Pratap Maity and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-12-18 with Science categories.
This volume explores and addresses the challenges of high-k gate dielectric materials, one of the major concerns in the evolving semiconductor industry and the International Technology Roadmap for Semiconductors (ITRS). The application of high-k gate dielectric materials is a promising strategy that allows further miniaturization of microelectronic components. This book presents a broad review of SiO2 materials, including a brief historical note of Moore’s law, followed by reliability issues of the SiO2 based MOS transistor. It goes on to discuss the transition of gate dielectrics with an EOT ~ 1 nm and a selection of high-k materials. A review of the various deposition techniques of different high-k films is also discussed. High-k dielectrics theories (quantum tunneling effects and interface engineering theory) and applications of different novel MOSFET structures, like tunneling FET, are also covered in this book. The volume also looks at the important issues in the future of CMOS technology and presents an analysis of interface charge densities with the high-k material tantalum pentoxide. The issue of CMOS VLSI technology with the high-k gate dielectric materials is covered as is the advanced MOSFET structure, with its working structure and modeling. This timely volume will prove to be a valuable resource on both the fundamentals and the successful integration of high-k dielectric materials in future IC technology.
Physics Of Semiconductors
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Author : Aditya Saxena
language : en
Publisher: Educohack Press
Release Date : 2025-02-20
Physics Of Semiconductors written by Aditya Saxena and has been published by Educohack Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-02-20 with Science categories.
"Physics of Semiconductors: Core Principles" is a comprehensive guide that demystifies how semiconductors function, from the fundamental physics to the devices we use daily. We cater to a general audience, with a focus on readers in the United States. We begin with the basics of quantum mechanics and solid-state physics, before diving into how these principles apply to semiconductors like silicon and gallium arsenide. We explain crucial concepts such as band theory, the flow of electricity through semiconductors, and their use in devices like transistors and solar cells. Additionally, we discuss the manufacturing processes of semiconductors and highlight the advancements scientists are making in developing new and improved semiconductors. "Physics of Semiconductors: Core Principles" is an excellent resource for anyone eager to understand the intricacies of this essential technology.
Semiconductor Technology Istc 2001
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Author : Ming Yang
language : en
Publisher:
Release Date : 2001
Semiconductor Technology Istc 2001 written by Ming Yang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Semiconductors categories.
Dielectric Films For Advanced Microelectronics
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2007-04-04
Dielectric Films For Advanced Microelectronics written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-04 with Technology & Engineering categories.
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.