Investigation Of Properties Of Novel Silicon Pixel Assemblies Employing Thin N In P Sensors And 3d Integration
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Investigation Of Properties Of Novel Silicon Pixel Assemblies Employing Thin N In P Sensors And 3d Integration
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Author : Philipp Weigell
language : en
Publisher:
Release Date : 2013
Investigation Of Properties Of Novel Silicon Pixel Assemblies Employing Thin N In P Sensors And 3d Integration written by Philipp Weigell and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with categories.
Semiconductor Radiation Detectors
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Author : Salim Reza
language : en
Publisher: CRC Press
Release Date : 2017-10-23
Semiconductor Radiation Detectors written by Salim Reza and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-10-23 with Technology & Engineering categories.
The aim of this book is to educate the reader on radiation detectors, from sensor to read-out electronics to application. Relatively new detector materials, such as CdZTe and Cr compensated GaAs, are introduced, along with emerging applications of radiation detectors. This X-ray technology has practical applications in medical, industrial, and security applications. It identifies materials based on their molecular composition, not densities as the traditional transmission equipment does. With chapters written by an international selection of authors from both academia and industry, the book covers a wide range of topics on radiation detectors, which will satisfy the needs of both beginners and experts in the field.
International Aerospace Abstracts
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Author :
language : en
Publisher:
Release Date : 1999
International Aerospace Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Aeronautics categories.
Chemical Abstracts
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Author :
language : en
Publisher:
Release Date : 2002
Chemical Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Chemistry categories.
Electrical Electronics Abstracts
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Author :
language : en
Publisher:
Release Date : 1997
Electrical Electronics Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electrical engineering categories.
Index To Ieee Publications
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Author : Institute of Electrical and Electronics Engineers
language : en
Publisher:
Release Date : 1996
Index To Ieee Publications written by Institute of Electrical and Electronics Engineers and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Electric engineering categories.
Issues for 1973- cover the entire IEEE technical literature.
Characterization Of 3d Silicon Assemblies For Atlas Pixel Upgrade
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Author : Marcello Borri
language : en
Publisher:
Release Date : 2013
Characterization Of 3d Silicon Assemblies For Atlas Pixel Upgrade written by Marcello Borri and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with categories.
The ATLAS pixel detector will be upgraded with a new Insertable B-layer (IBL). The IBL will be inserted between the existing pixel detector and the reduced diameter vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have required the development of new radiation hard pixel sensor technologies and a new front end chip.3D-silicon sensors will populate 25% of the IBL sensing area. They are a newgeneration of micro-machined sensors with electrodes etched inside the silicon bulk rather than on the wafer surface. 3D-silicon sensors were studied by performing simulations, laboratory measurements and beam tests on irradiated and not irradiated samples. This thesis describes the development of a fast algorithm of the signal response in 3D-silicon sensors using Geant4 simulations. The simulation of the signal response is compared to actual data from test-beam and radioactive source measurements. The setup for each of these measurements is also simulated in Geant4 using experience gained after working with the real setup.
Investigation Of Ultra Thin Folded Flex Assembly For Highly Miniaturised System In A Package Technology Platforms
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Author : Bivragh Majeed
language : en
Publisher:
Release Date : 2008
Investigation Of Ultra Thin Folded Flex Assembly For Highly Miniaturised System In A Package Technology Platforms written by Bivragh Majeed and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Computer systems categories.
This thesis addresses some of the challenges faced in the implementation of the physical layer of Ambient Electronic Systems (AES). AES will help in realising the information technology dream in which our surroundings will be populated by intelligent micro-nano interactive modules. System-in-a-Package is one of the enabling technologies that can be utilised to realise a physical layer of AES. One of the key challenges of the SiP approach is miniaturisation of different components. The underlying objective of the current work is to investigate the fundamental material and fabrication issues arising from the miniaturisation of different components in a folded flex assembly. Folded flex technology is used to develop a technology platform that can be adapted for future AES. This platform is developed as an investigative tool for performance evaluation of different materials and processes including flexible substrate, silicon die, interconnection mechanism and folded flex assembly. The evaluation yielded distinct results in terms of achieving an effective approach for fabricating thin flexible substrate. A critical thickness was evaluated below which wrinkling would be an issue and thickness reduction advantages are negated by increased handling problems. Silicon die characterisation revealed that the thinning process had little impact on the electrical properties; however, mechanical properties were influenced by the singulation process. A novel analytical model was developed to determine the stress in thinned die, demonstrating that the thinning process induced very little stress. A characterised and reliable flip chip interconnect assembly sequence that provides thin, less than 20 microns, interconnect stand-off heights for different silicon die thicknesses was developed. This was achieved by modifying the shape of the gold stud bump and having a direct contact between the gold stud bump and the copper pad. An electrically functioning and reliable 3-D folded flex module was fabricated, highlighting the assembly challenges, thermo-mechanical stresses and thermal performance of the module.
Design Methodology
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Author :
language : en
Publisher:
Release Date : 2015
Design Methodology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.
The design methodology for the development of 3D integrated edgeless pixel detectors with in-pixel processing using Electronic Design Automation (EDA) tools is presented. A large area 3 tier 3D detector with one sensor layer and two ASIC layers containing one analog and one digital tier, is built for x-ray photon time of arrival measurement and imaging. A full custom analog pixel is 65[mu]m x 65[mu]m. It is connected to a sensor pixel of the same size on one side, and on the other side it has approximately 40 connections to the digital pixel. A 32 x 32 edgeless array without any peripheral functional blocks constitutes a sub-chip. The sub-chip is an indivisible unit, which is further arranged in a 6 x 6 array to create the entire 1.248cm x 1.248cm ASIC. Each chip has 720 bump-bond I/O connections, on the back of the digital tier to the ceramic PCB. All the analog tier power and biasing is conveyed through the digital tier from the PCB. The assembly has no peripheral functional blocks, and hence the active area extends to the edge of the detector. This was achieved by using a few flavors of almost identical analog pixels (minimal variation in layout) to allow for peripheral biasing blocks to be placed within pixels. The 1024 pixels within a digital sub-chip array have a variety of full custom, semi-custom and automated timing driven functional blocks placed together. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout. The methodology uses the Cadence design platform, however it is not limited to this tool.