Materials For High Density Electronic Packaging And Interconnection
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Materials For High Density Electronic Packaging And Interconnection
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Author : National Research Council
language : en
Publisher: National Academies Press
Release Date : 1990-02-01
Materials For High Density Electronic Packaging And Interconnection written by National Research Council and has been published by National Academies Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-02-01 with Technology & Engineering categories.
Fertigfassaden Fassaden Systembau
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Author : Wendker Fassaden-Systembau GmbH
language : en
Publisher:
Release Date : 2001
Fertigfassaden Fassaden Systembau written by Wendker Fassaden-Systembau GmbH and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with categories.
Materials For High Density Electronic Packaging And Interconnection
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Author : National Aeronautics and Space Administration (NASA)
language : en
Publisher: Createspace Independent Publishing Platform
Release Date : 2018-07-18
Materials For High Density Electronic Packaging And Interconnection written by National Aeronautics and Space Administration (NASA) and has been published by Createspace Independent Publishing Platform this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-07-18 with categories.
Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production. Unspecified Center COMPATIBILITY; ELECTRONIC PACKAGING; SEMICONDUCTORS (MATERIALS); INDUSTRIES; LEADERSHIP; MARKETING...
Electronic Packaging Materials And Their Properties
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Electronic Packaging Materials And Their Properties written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Integrated Circuit Packaging Assembly And Interconnections
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Author : William Greig
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-04-24
Integrated Circuit Packaging Assembly And Interconnections written by William Greig and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-24 with Technology & Engineering categories.
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Electronic Packaging
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Author : John H. Lau
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1998
Electronic Packaging written by John H. Lau and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Electronic packaging categories.
Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.
Electronic Packaging And Interconnection Handbook
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Author : Charles A. Harper
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 2000
Electronic Packaging And Interconnection Handbook written by Charles A. Harper and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.
Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.
Integrated Circuit Packaging Assembly And Interconnections
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Author : William Greig
language : en
Publisher: Springer
Release Date : 2008-11-01
Integrated Circuit Packaging Assembly And Interconnections written by William Greig and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-11-01 with Technology & Engineering categories.
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Materials For Electronic Packaging
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Author : Deborah D.L. Chung
language : en
Publisher: Elsevier
Release Date : 1995-03-31
Materials For Electronic Packaging written by Deborah D.L. Chung and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-03-31 with Technology & Engineering categories.
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Advanced Manufacturing Process Lead Free Interconnect Materials And Reliability Modeling For Electronics Packaging
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Author :
language : en
Publisher: Emerald Group Publishing
Release Date : 2006
Advanced Manufacturing Process Lead Free Interconnect Materials And Reliability Modeling For Electronics Packaging written by and has been published by Emerald Group Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Electronic packaging categories.
This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.