Materials For High Temperature Semiconductor Devices
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Materials For High Temperature Semiconductor Devices
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Author : National Research Council
language : en
Publisher: National Academies Press
Release Date : 1995-10-14
Materials For High Temperature Semiconductor Devices written by National Research Council and has been published by National Academies Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-10-14 with Technology & Engineering categories.
Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.
Low Temperature Electronics
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Author : Edmundo A. Gutierrez-D.
language : en
Publisher: Academic Press
Release Date : 2001
Low Temperature Electronics written by Edmundo A. Gutierrez-D. and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
Summarizes the advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. This book provides an exploration of the theory, research, and technologies related to cryoelectronics.
Materials For High Temperature Semiconductor Devices
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Author : National Research Council (U S ) Com
language : en
Publisher: Legare Street Press
Release Date : 2023-07-18
Materials For High Temperature Semiconductor Devices written by National Research Council (U S ) Com and has been published by Legare Street Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-07-18 with categories.
With the demand for semiconductor devices that can withstand high temperatures increasing, the need for reliable and efficient materials has never been greater. This comprehensive report from the National Research Council provides in-depth analysis and recommendations for scientists and engineers working in this field. A must-have resource for anyone interested in the future of semiconductor technology. This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work is in the "public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.
High Temperature Electronics
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Author : F. Patrick McCluskey
language : en
Publisher: CRC Press
Release Date : 2018-05-04
High Temperature Electronics written by F. Patrick McCluskey and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-05-04 with Technology & Engineering categories.
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Technology 2000
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Author :
language : en
Publisher:
Release Date : 1991
Technology 2000 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Industrial policy categories.
Die Attach Materials For High Temperature Applications In Microelectronics Packaging
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Author : Kim S. Siow
language : en
Publisher: Springer
Release Date : 2019-01-29
Die Attach Materials For High Temperature Applications In Microelectronics Packaging written by Kim S. Siow and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-29 with Technology & Engineering categories.
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
High Temperature Electronics
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Author : F. Patrick McCluskey
language : en
Publisher: CRC Press
Release Date : 1996-12-13
High Temperature Electronics written by F. Patrick McCluskey and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-12-13 with Technology & Engineering categories.
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
New And Forthcoming Books
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Author : National Academy Press (U.S.)
language : en
Publisher:
Release Date : 1993
New And Forthcoming Books written by National Academy Press (U.S.) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Science categories.
Two Dimensional Nanostructures For Energy Related Applications
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Author : Kuan Yew Cheong
language : en
Publisher: CRC Press
Release Date : 2017-03-27
Two Dimensional Nanostructures For Energy Related Applications written by Kuan Yew Cheong and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-03-27 with Science categories.
This edited book focuses on the latest advances and development of utilizing two-dimensional nanostructures for energy and its related applications. Traditionally, the geometry of this material refers to "thin film" or "coating." The book covers three main parts, beginning with synthesis, processing, and property of two-dimensional nanostructures for active and passive layers followed by topics on characterization of the materials. It concludes with topics relating to utilization of the materials for usage in devises for energy and its related applications.
Research And Technology Program Digest Flash Index
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Author :
language : en
Publisher:
Release Date : 1967
Research And Technology Program Digest Flash Index written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1967 with Astronautics categories.