Materials Reliability In Microelectronics Vi Volume 428
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Materials Reliability In Microelectronics Vi Volume 428
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Author : William F. Filter
language : en
Publisher:
Release Date : 1996-11-18
Materials Reliability In Microelectronics Vi Volume 428 written by William F. Filter and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-11-18 with Technology & Engineering categories.
MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.
Thin Films Stresses And Mechanical Properties Vi
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Author : Shefford P. Baker
language : en
Publisher: Materials Research Society
Release Date : 1996-02-11
Thin Films Stresses And Mechanical Properties Vi written by Shefford P. Baker and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-02-11 with Technology & Engineering categories.
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Thin Films Stresses And Mechanical Properties Vi
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Author : William W. Gerberich
language : en
Publisher:
Release Date : 1997
Thin Films Stresses And Mechanical Properties Vi written by William W. Gerberich and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
Interest in the mechanical properties of thin films remains high throughout the world, as evidenced by the large international contingent represented in this book. With regard to stresses, techniques for sorting out residual stress and strain states are becoming more varied and sophisticated. Discussions include Raman scattering, nonlinear acoustic responses and back-scattered electron imaging microscopies, as well as the more standard wafer-bending and X-ray techniques. Spectroscopy, indenting and the burgeoning field of nanoprobe imaging for the characterization of mechanical properties of thin films are also highlighted. Topics include: mechanical properties of films and multilayers; fracture and adhesion; nanoindentation of films and surfaces; mechanical property methods and modelling; tribological properties of thin films; properties of polymer films; stress effects in thin films and interconnects; epitaxy and strain relief mechanisms, measurements.
Materials For Mechanical And Optical Microsystems Volume 444
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Author : Michael L. Reed
language : en
Publisher:
Release Date : 1997-03-30
Materials For Mechanical And Optical Microsystems Volume 444 written by Michael L. Reed and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-03-30 with Mathematics categories.
A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR
Materials Reliability In Microelectronics Vii Volume 473
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Author : J. Joseph Clement
language : en
Publisher:
Release Date : 1997-10-20
Materials Reliability In Microelectronics Vii Volume 473 written by J. Joseph Clement and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-10-20 with Technology & Engineering categories.
The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.
Microporous And Macroporous Materials Volume 431
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Author : Raul F. Lobo
language : en
Publisher:
Release Date : 1996-11-05
Microporous And Macroporous Materials Volume 431 written by Raul F. Lobo and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-11-05 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials Issues In Art And Archaeology V Volume 462
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Author : Pamela B. Vandiver
language : en
Publisher:
Release Date : 1997-10-15
Materials Issues In Art And Archaeology V Volume 462 written by Pamela B. Vandiver and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-10-15 with Technology & Engineering categories.
This book presents cutting-edge multidisciplinary work on the characterization of ancient materials; the technologies of selection, production and usage by which materials are transformed into objects and artifacts; the science underlying their deterioration, preservation and conservation; and sociocultural interpretation derived from an empirical methodology of observation, measurement and experimentation. Of particular interest are contributions which explore the interface and overlap among traditional materials science, the history of technology and the archaeological and conservation sciences, or that investigate new methods and applications of materials science in art and archaeology. Topics include: analytical chemistry and spectroscopy; ancient and historical metallurgy; natural and artificial glass; characterization, sources and production of ceramics; organic materials technologies; architectural conservation and materials characterization; conservation of archaeological and historical materials; and other studies of ceramics and metals.
Microwave Processing Of Materials V Volume 430
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 1996-10-28
Microwave Processing Of Materials V Volume 430 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-10-28 with Technology & Engineering categories.
Based on an international gathering of scientists and engineers from 17 countries, this book, the fifth in a continuing series, assesses microwave processing of materials as an emerging technology. Significant advances in understanding and control of microwave energy and its use in the processing and testing of materials are outlined. Future research and development needs are also explored. Topics include: scale-up and commercialization; microwave nondestructive testing; microwave processing; microwave system design; dielectric properties measurements and analysis; modelling of microwave heating; microwave interactions and mechanisms; microwave processing using variable frequency sources; alternate microwave sources; remediation of hazardous waste; temperature modelling and measurements; microwave processing of polymers; and plasma processing.
Defects In Electronic Materials Ii Volume 442
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Author : Jürgen Michel
language : en
Publisher:
Release Date : 1997-05-02
Defects In Electronic Materials Ii Volume 442 written by Jürgen Michel and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-05-02 with Technology & Engineering categories.
The pervasive role of defects in determining the thermal, mechanical, electrical, optical and magnetic properties of materials is significant as is the knowledge and operation of generation and control of defects in electronic materials. Developing novel semiconductor materials, however, requires new insights into the role of defects to achieve new properties. New experimental techniques must be developed to study defects in small structures. Research groups come together in this book from MRS to provide a vivid picture of the current problems, progress and methods in defect studies in electronic materials. Topics include new techniques in defect studies; processing induced defects, plasma-induced point defects; processing induced defects -defects and gate-oxide integrity; point defects and reaction; point defects and interactions in Si; impurity diffusion and hydrogen in Si; dislocations in group IV semiconductors; point defects and defect interactions in SiGe; point defects in III-V compounds; compensation and structural defects in III-V compounds and layers and structures.
Low Dielectric Constant Materials
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Author :
language : en
Publisher:
Release Date : 1998
Low Dielectric Constant Materials written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Electric insulators and insulation categories.