Mechanics And Materials For Electronic Packaging Design And Process Issues In Electronic Packaging
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Mechanics And Materials For Electronic Packaging Design And Process Issues In Electronic Packaging
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Author : American Society of Mechanical Engineers. Applied Mechanics Division
language : en
Publisher:
Release Date : 1994
Mechanics And Materials For Electronic Packaging Design And Process Issues In Electronic Packaging written by American Society of Mechanical Engineers. Applied Mechanics Division and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Technology & Engineering categories.
Power Electronic Packaging
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Author : Yong Liu
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-02-15
Power Electronic Packaging written by Yong Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-15 with Technology & Engineering categories.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Mechanics And Materials For Electronic Packaging Design And Process Issues In Electronic Packaging
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Author :
language : en
Publisher:
Release Date : 1994
Mechanics And Materials For Electronic Packaging Design And Process Issues In Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Electronic packaging categories.
Handbook Of Electronic Package Design
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 2018-10-24
Handbook Of Electronic Package Design written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-24 with Technology & Engineering categories.
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Electronic Packaging Materials And Their Properties
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 1998-12-18
Electronic Packaging Materials And Their Properties written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-12-18 with Technology & Engineering categories.
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Modeling And Simulation For Microelectronic Packaging Assembly
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Author : Shen Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2011-05-17
Modeling And Simulation For Microelectronic Packaging Assembly written by Shen Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-17 with Technology & Engineering categories.
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Manufacturing Challenges In Electronic Packaging
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Author : Y.C. Lee
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-12-31
Manufacturing Challenges In Electronic Packaging written by Y.C. Lee and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-12-31 with Science categories.
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Applied Mechanics Reviews
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Author :
language : en
Publisher:
Release Date : 1948
Applied Mechanics Reviews written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1948 with Mechanics, Applied categories.
Electronic Packaging And Interconnection Handbook
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Author : Charles A. Harper
language : en
Publisher: McGraw-Hill Companies
Release Date : 1997
Electronic Packaging And Interconnection Handbook written by Charles A. Harper and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field
The Electronic Packaging Handbook
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Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19
The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.