Modeling And Application Of Flexible Electronics Packaging
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Modeling And Application Of Flexible Electronics Packaging
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Author : YongAn Huang
language : en
Publisher: Springer
Release Date : 2019-04-23
Modeling And Application Of Flexible Electronics Packaging written by YongAn Huang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-23 with Technology & Engineering categories.
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Advanced Materials For Printed Flexible Electronics
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Author : Colin Tong
language : en
Publisher: Springer Nature
Release Date : 2021-10-04
Advanced Materials For Printed Flexible Electronics written by Colin Tong and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-10-04 with Technology & Engineering categories.
This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.
Flexible Glass
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Author : Sean M. Garner
language : en
Publisher: John Wiley & Sons
Release Date : 2017-08-10
Flexible Glass written by Sean M. Garner and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-08-10 with Technology & Engineering categories.
Provides the reader how to apply flexible glass applications that are not possible or practical to address with alternative substrate materials. Examples of technology areas include displays, touch sensors, lighting, backplanes, and photovoltaics. Built on more than 10 years of valuable discussions and collaborations focused on truly defining what flexible glass means in the context of the emerging electronic and opto-electronic applications, this book provides a broad overview as well as detailed descriptions that cover flexible glass properties, device fabrication methods, and emerging applications. It provides the basis for identifying new device designs, applications, and manufacturing processes for which flexible glass substrates are uniquely suited and encourages and enables the reader to identify and pursue advanced flexible glass applications that do not exist today and provides a launching point for exciting future directions. The chapters are grouped into three sections. The first focuses on flexible glass and flexible glass reliability and has three chapters with authors from Corning. The second section focuses on flexible glass device fabrication which includes chapters on roll-to-roll processing, vacuum deposition, and printed electronics. These chapters are authored by established experts in their respective fields that have extensive experience in processing flexible glass substrates in toolsets that range from research to pilot scale. The third section focuses on flexible glass device applications and includes chapters on photovoltaics, displays, integrated photonics, and microelectronics integration. These are authored by experts with direct experience in fabricating and characterizing flexible glass devices. The diverse list of authors and their depth of experience in working with a variety of material systems, processes, and device technologies significantly adds valuable context to the overall flexible glass discussion.
Library Of Congress Subject Headings
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Author : Library of Congress
language : en
Publisher:
Release Date : 2012
Library Of Congress Subject Headings written by Library of Congress and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with Subject headings, Library of Congress categories.
Electronic Materials Handbook
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Author :
language : en
Publisher: ASM International
Release Date : 1989-11-01
Electronic Materials Handbook written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-01 with Technology & Engineering categories.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Thermal Management For Opto Electronics Packaging And Applications
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Author : Xiaobing Luo
language : en
Publisher: John Wiley & Sons
Release Date : 2024-08-12
Thermal Management For Opto Electronics Packaging And Applications written by Xiaobing Luo and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-08-12 with Technology & Engineering categories.
Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Advances In Graphic Communication Printing And Packaging Technology And Materials
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Author : Pengfei Zhao
language : en
Publisher: Springer Nature
Release Date : 2021-05-25
Advances In Graphic Communication Printing And Packaging Technology And Materials written by Pengfei Zhao and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-25 with Technology & Engineering categories.
This book includes a selection of reviewed papers presented at the 11th China Academic Conference on Printing and Packaging, held on November 26–29, 2020, Guangzhou, China. The conference is jointly organized by China Academy of Printing Technology and South China University of Technology. With 10 keynote talks and 200 presented papers on graphic communication and packaging technologies, the conference attracted more than 300 scientists. The proceedings cover the recent findings in color science and technology, image processing technology, digital media technology, mechanical and electronic engineering and numerical control, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book is of interest to university researchers, R&D engineers and graduate students in the field of graphic arts, packaging, color science, image science, material science, computer science, digital media, network technology and smart manufacturing technology.
Thin Film Deposition Techniques
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Author : Tahir Iqbal Awan
language : en
Publisher: Springer Nature
Release Date : 2025-01-02
Thin Film Deposition Techniques written by Tahir Iqbal Awan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-01-02 with Technology & Engineering categories.
This book describes the basics and historical aspects of thin film. The introductory chapter of this book contains various aspects about thin-film deposition methods, significance of nanomaterials in the fabrication of thin film, certain fundamental characteristics of thin films (electrical, optical, and morphological), some challenges (thickness uniformity, film adhesion issues, temperature-related challenges, film defects and quality control, preparation of the surface of the substrate before deposition, etc.) faced during the formation of thin film, significance, and different types of deposition techniques along with their basic introduction, working principle, construction, merits/demerits, and also application in specific fields. This book specifically works on the techniques of thin-film deposition and role of the thin film in the formation of these deposition methods.
Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices
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Author : Ephraim Suhir
language : en
Publisher: CRC Press
Release Date : 2021-01-28
Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices written by Ephraim Suhir and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-01-28 with Technology & Engineering categories.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Manufacturing Challenges In Electronic Packaging
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Author : Y.C. Lee
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Manufacturing Challenges In Electronic Packaging written by Y.C. Lee and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.