Multichip Modules With Integrated Sensors

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Multichip Modules With Integrated Sensors

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Author : W.K. Jones
language : en
Publisher: Springer
Release Date : 1996-10-31

Multichip Modules With Integrated Sensors written by W.K. Jones and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-10-31 with Technology & Engineering categories.

Proceedings of the May 1995 workshop. Contains 33 papers which review advances in Multichip Modules (MCM) technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. The authors address new materials development, characterized methods, and high level integration of sensors into electronic packaging. Annotation copyrighted by Book News, Inc., Portland, OR

Epoxy Multichip Modules For The Integration Of Sensors And Signal Processing Chips

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Author : Adnan Siraj Laskar
language : en
Publisher:
Release Date : 1992

Epoxy Multichip Modules For The Integration Of Sensors And Signal Processing Chips written by Adnan Siraj Laskar and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with categories.

Embedded Capacitive Sensors For Multi Chip Module Manufactuting Process Monitoring

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Author : Zikang Pan
language : en
Publisher:
Release Date : 1993

Embedded Capacitive Sensors For Multi Chip Module Manufactuting Process Monitoring written by Zikang Pan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with categories.

Mcm C Mixed Technologies And Thick Film Sensors

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Author : W.K. Jones
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Mcm C Mixed Technologies And Thick Film Sensors written by W.K. Jones and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.

Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

Cost Driven Design Of Smart Microsystems

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Author : Michael Niedermayer
language : en
Publisher: Artech House
Release Date : 2011-12

Cost Driven Design Of Smart Microsystems written by Michael Niedermayer and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-12 with Technology & Engineering categories.

Today's professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants. Written by leading experts, the book offers detailed coverage of the key topics that you need to understand for your work in the field, such as methods for cost estimation, holistic design optimization, a methodology for a cost-driven design, and applied cost optimization. This practical book focuses on fundamental cost influences rather than absolute numbers, helping you appreciate relative values which reflect the competitive advantage of the various design implementations. Moreover, you find specific recommendations on which cost-reduction methods will be most advantageous in varying situations. This forward-looking volume provides keen insight into the underlying factors which drive the current economics and determine future trends of smart microsystems.

Ambient Intelligence With Microsystems

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Author : Kieran Delaney
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-10-17

Ambient Intelligence With Microsystems written by Kieran Delaney and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-10-17 with Computers categories.

Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects. In particular, it deals with the requirements for integrated computation and MEMs sensors, system-in-a-package solutions, and multi-chip modules. On top of this, the publication’s 500 pages cover the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, and practical performance issues that are key to the AmI concept.

Foldable Flex And Thinned Silicon Multichip Packaging Technology

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Author : John W. Balde
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27

Foldable Flex And Thinned Silicon Multichip Packaging Technology written by John W. Balde and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Pixel Multichip Module Design For A High Energy Physics Experiment

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Author :
language : en
Publisher:
Release Date : 2003

Pixel Multichip Module Design For A High Energy Physics Experiment written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with categories.

At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bounded to the circuit. This paper presents recent results on the development of a multichip module prototype and summarizes its performance characteristics.

The Handbook Of Advanced Materials

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Author :
language : en
Publisher: John Wiley & Sons
Release Date : 2004-04-27

The Handbook Of Advanced Materials written by and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-04-27 with Science categories.

Written to educate readers about recent advances in the area of new materials used in making products. Materials and their properties usually limit the component designer. * Presents information about all of these advanced materials that enable products to be designed in a new way * Provides a cost effective way for the design engineer to become acquainted with new materials * The material expert benefits by being aware of the latest development in all these areas so he/she can focus on further improvements

Integrated Systems

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Author : Dirk J. Bartelink
language : en
Publisher:
Release Date : 1995

Integrated Systems written by Dirk J. Bartelink and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Computer input-output equipment categories.

Abstract: "Integrated Systems are defined as batch-fabricated interconnections of complex digital integrated circuits with analog interface circuits and transducers, such as sensors. By providing the cost, performance and reliablity levels of monolithic integration, they offer potential advantages over multi-chip modules assembled with packaging technology. This paper studies the required process technology, as well as design, test and packaging issues, for integrating wide varieties of systems. The goal is to delineate the necessary steps in bringing Integrated Systems to market within a realistic period. With monolithic integration as the ultimate aim, a multi-chip entry point is identified that can start system technology on a learning curve of cost reduction using the same scaling principles that drive integrated circuits. Three challenges to be surmounted are identified in streamlining the I/O's and progressing along a learning curve, namely I/O scaling, I/O loading, and full-functional test. The 'composite IC' is the entry point. A large chip, containing only global interconnects and power distribution, acts as a silicon backplane. Subsystem-chips, such as digital microprocessors or sensors, are flip-chip mounted using the accuracy of MEMS processing to fabricate 'snap-together' physical and electrical interfaces with high reproducibility. While similar to conventional MCMs, this chip-to-chip connection has few compromises over on-chip connections. By keeping the fabrication responsibility within one organization, just as in monolithic chips, there is no need for incoming inspection. Added ESD protection and test-head loading are avoided on interior nodes by a new intrafactory method of testing."