Physical Design For Multichip Modules
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Physical Design For Multichip Modules
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Author : Mysore Sriram
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Physical Design For Multichip Modules written by Mysore Sriram and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Conceptual Design Of Multichip Modules And Systems
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Author : Peter A. Sandborn
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-14
Conceptual Design Of Multichip Modules And Systems written by Peter A. Sandborn and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-14 with Technology & Engineering categories.
Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
High Performance Design Automation For Multi Chip Modules And Packages
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Author : Jun-Dong Cho
language : en
Publisher: World Scientific
Release Date : 1996
High Performance Design Automation For Multi Chip Modules And Packages written by Jun-Dong Cho and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Multichip Modules
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Author : Ernest Kuh
language : en
Publisher: World Scientific
Release Date : 1992-03-31
Multichip Modules written by Ernest Kuh and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992-03-31 with Technology & Engineering categories.
Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
Algorithms For Vlsi Physical Design Automation
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Author : Naveed A. Sherwani
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29
Algorithms For Vlsi Physical Design Automation written by Naveed A. Sherwani and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Technology & Engineering categories.
Algorithms for VLSI Physical Design Automation is a core reference text for graduate students and CAD professionals. It provides a comprehensive treatment of the principles and algorithms of VLSI physical design. Algorithms for VLSI Physical Design Automation presents the concepts and algorithms in an intuitive manner. Each chapter contains 3-4 algorithms that are discussed in detail. Additional algorithms are presented in a somewhat shorter format. References to advanced algorithms are presented at the end of each chapter. Algorithms for VLSI Physical Design Automation covers all aspects of physical design. The first three chapters provide the background material while the subsequent chapters focus on each phase of the physical design cycle. In addition, newer topics like physical design automation of FPGAs and MCMs have been included. The author provides an extensive bibliography which is useful for finding advanced material on a topic. Algorithms for VLSI Physical Design Automation is an invaluable reference for professionals in layout, design automation and physical design.
Physical Design For Multichip Modules
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Author : Bernhard M. Riess
language : en
Publisher:
Release Date : 1997
Physical Design For Multichip Modules written by Bernhard M. Riess and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electronic packaging categories.
Multi Chip Module Test Strategies
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Author : Yervant Zorian
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Multi Chip Module Test Strategies written by Yervant Zorian and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Microelectronics Packaging Handbook
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Author : R.R. Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Microelectronics Packaging Handbook written by R.R. Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Computers categories.
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Vlsi Physical Design From Graph Partitioning To Timing Closure
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Author : Andrew B. Kahng
language : en
Publisher: Springer Nature
Release Date : 2022-06-14
Vlsi Physical Design From Graph Partitioning To Timing Closure written by Andrew B. Kahng and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-06-14 with Technology & Engineering categories.
The complexity of modern chip design requires extensive use of specialized software throughout the process. To achieve the best results, a user of this software needs a high-level understanding of the underlying mathematical models and algorithms. In addition, a developer of such software must have a keen understanding of relevant computer science aspects, including algorithmic performance bottlenecks and how various algorithms operate and interact. This book introduces and compares the fundamental algorithms that are used during the IC physical design phase, wherein a geometric chip layout is produced starting from an abstract circuit design. This updated second edition includes recent advancements in the state-of-the-art of physical design, and builds upon foundational coverage of essential and fundamental techniques. Numerous examples and tasks with solutions increase the clarity of presentation and facilitate deeper understanding. A comprehensive set of slides is available on the Internet for each chapter, simplifying use of the book in instructional settings. “This improved, second edition of the book will continue to serve the EDA and design community well. It is a foundational text and reference for the next generation of professionals who will be called on to continue the advancement of our chip design tools and design the most advanced micro-electronics.” Dr. Leon Stok, Vice President, Electronic Design Automation, IBM Systems Group “This is the book I wish I had when I taught EDA in the past, and the one I’m using from now on.” Dr. Louis K. Scheffer, Howard Hughes Medical Institute “I would happily use this book when teaching Physical Design. I know of no other work that’s as comprehensive and up-to-date, with algorithmic focus and clear pseudocode for the key algorithms. The book is beautifully designed!” Prof. John P. Hayes, University of Michigan “The entire field of electronic design automation owes the authors a great debt for providing a single coherent source on physical design that is clear and tutorial in nature, while providing details on key state-of-the-art topics such as timing closure.” Prof. Kurt Keutzer, University of California, Berkeley “An excellent balance of the basics and more advanced concepts, presented by top experts in the field.” Prof. Sachin Sapatnekar, University of Minnesota
Vlsi Physical Design Automation Theory And Practice
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Author : Sadiq M Sait
language : en
Publisher: World Scientific Publishing Company
Release Date : 1999-10-04
Vlsi Physical Design Automation Theory And Practice written by Sadiq M Sait and has been published by World Scientific Publishing Company this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-10-04 with Computers categories.
VLSI is an important area of electronic and computer engineering. However, there are few textbooks available for undergraduate/postgraduate study of VLSI design automation and chip layout. VLSI Physical Design Automation: Theory and Practice fills the void and is an essential introduction for senior undergraduates, postgraduates and anyone starting work in the field of CAD for VLSI. It covers all aspects of physical design, together with such related areas as automatic cell generation, silicon compilation, layout editors and compaction. A problem-solving approach is adopted and each solution is illustrated with examples. Each topic is treated in a standard format: Problem Definition, Cost Functions and Constraints, Possible Approaches and Latest Developments.Special features: The book deals with all aspects of VLSI physical design, from partitioning and floorplanning to layout generation and silicon compilation; provides a comprehensive treatment of most of the popular algorithms; covers the latest developments and gives a bibliography for further research; offers numerous fully described examples, problems and programming exercises.