Multichip Modules
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Chip On Board
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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 1994-06-30
Chip On Board written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-06-30 with Computers categories.
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Multichip Module Technologies And Alternatives The Basics
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Author : Daryl Ann Doane
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Multichip Module Technologies And Alternatives The Basics written by Daryl Ann Doane and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Computers categories.
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Physical Design For Multichip Modules
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Author : Mysore Sriram
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Physical Design For Multichip Modules written by Mysore Sriram and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Multichip Modules
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Author : Ernest S. Kuh
language : en
Publisher: World Scientific
Release Date : 1992
Multichip Modules written by Ernest S. Kuh and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Technology & Engineering categories.
Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
Conceptual Design Of Multichip Modules And Systems
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Author : Peter A. Sandborn
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-14
Conceptual Design Of Multichip Modules And Systems written by Peter A. Sandborn and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-14 with Technology & Engineering categories.
Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Multichip Module Technology Handbook
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Author : Philip E. Garrou
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1998
Multichip Module Technology Handbook written by Philip E. Garrou and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Technology & Engineering categories.
MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and more reliable than those built with standalone ICs. More and more, the speed needs of electronic systems require MCMs. This comprehensive handbook aims to provide designers with the knowledge needed to understand and work with MCMs.
Introduction To Multichip Modules
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Author : Naveed A. Sherwani
language : en
Publisher: Wiley-Interscience
Release Date : 1995-11-23
Introduction To Multichip Modules written by Naveed A. Sherwani and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-11-23 with Computers categories.
Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this.
Multichip Modules With Integrated Sensors
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Author : W.K. Jones
language : en
Publisher: Springer
Release Date : 1996-10-31
Multichip Modules With Integrated Sensors written by W.K. Jones and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-10-31 with Technology & Engineering categories.
Proceedings of the May 1995 workshop. Contains 33 papers which review advances in Multichip Modules (MCM) technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. The authors address new materials development, characterized methods, and high level integration of sensors into electronic packaging. Annotation copyrighted by Book News, Inc., Portland, OR
High Performance Design Automation For Multi Chip Modules And Packages
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Author : Jun Dong Cho
language : en
Publisher: World Scientific
Release Date : 1996-06-12
High Performance Design Automation For Multi Chip Modules And Packages written by Jun Dong Cho and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-06-12 with Technology & Engineering categories.
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Multichip Modules And Related Technologies
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Author : Gerald L. Ginsberg
language : en
Publisher: McGraw-Hill Companies
Release Date : 1994
Multichip Modules And Related Technologies written by Gerald L. Ginsberg and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computers categories.