Introduction To Multichip Modules
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Introduction To Multichip Modules
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Author : Naveed A. Sherwani
language : en
Publisher: Wiley-Interscience
Release Date : 1995-11-23
Introduction To Multichip Modules written by Naveed A. Sherwani and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-11-23 with Computers categories.
Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this.
Multichip Module Technologies And Alternatives The Basics
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Author : Daryl Ann Doane
language : en
Publisher: Springer Science & Business Media
Release Date : 1992-10-31
Multichip Module Technologies And Alternatives The Basics written by Daryl Ann Doane and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992-10-31 with Computers categories.
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Multichip Modules
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Author : Ernest S. Kuh
language : en
Publisher: World Scientific
Release Date : 1992
Multichip Modules written by Ernest S. Kuh and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Technology & Engineering categories.
Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
High Performance Design Automation For Multi Chip Modules And Packages
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Author : Jun Dong Cho
language : en
Publisher: World Scientific
Release Date : 1996-06-12
High Performance Design Automation For Multi Chip Modules And Packages written by Jun Dong Cho and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-06-12 with Technology & Engineering categories.
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Multi Chip Module Test Strategies
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Author : Yervant Zorian
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Multi Chip Module Test Strategies written by Yervant Zorian and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Multichip Module Technologies And Alternatives The Basics
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Author : Daryl Ann Doane
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Multichip Module Technologies And Alternatives The Basics written by Daryl Ann Doane and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Computers categories.
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Integrated Circuit Hybrid And Multichip Module Package Design Guidelines
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Author : Michael G. Pecht
language : en
Publisher: John Wiley & Sons
Release Date : 1994-03-31
Integrated Circuit Hybrid And Multichip Module Package Design Guidelines written by Michael G. Pecht and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-03-31 with Technology & Engineering categories.
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage.
The Electronics Handbook
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Author : Jerry C. Whitaker
language : en
Publisher: CRC Press
Release Date : 2018-10-03
The Electronics Handbook written by Jerry C. Whitaker and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.
Micro System Technologies 90
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Author : Herbert Reichl
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Micro System Technologies 90 written by Herbert Reichl and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
On September 10-13, 1990, the first international meeting on Microsystem Technologies takes place at the Berlin International Congress Center. Most of the traditional congresses deal with themes that become more and more specific, and only a small part of the scientific world is reflected. The Micro System Technologies is attempting to take the opposite direction: During the last two decades the development of microelectronics was characterized by a tremendous increase of complexity of integrated circuits. At the same time the fields of microoptics and micromechanics have been developed to an advanced state of the art by the application of thin film and semiconductor technologies. The trend of the future development is to increase the integration density by combining the microelectronic, microoptic, and micro mechanic aspects to new complex multifunctional systems, which are able to comprise sensors, actuators, analogue and digital circuits on the same chip or on multichip-modules. Microsystems will lead to extensions of the field of microelectronic applications with important technical alterations and can open new considerable markets. For the realization of economical solutions for microsystems a lot of interdisciplinary cooperation and know-how has to be developed. New materials for sensitive layers, substrates, conducting, semiconducting, or isolating thin films are the basis for the development of new technologies. The increasing complexity leads to increasing interaction among electrical and non-electrical quantities.
Microelectronics
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Author : Jerry C. Whitaker
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Microelectronics written by Jerry C. Whitaker and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
When it comes to electronics, demand grows as technology shrinks. From consumer and industrial markets to military and aerospace applications, the call is for more functionality in smaller and smaller devices. Culled from the second edition of the best-selling Electronics Handbook, Microelectronics, Second Edition presents a summary of the current state of microelectronics and its innovative directions. This book focuses on the materials, devices, and applications of microelectronics technology. It details the IC design process and VLSI circuits, including gate arrays, programmable logic devices and arrays, parasitic capacitance, and transmission line delays. Coverage ranges from thermal properties and semiconductor materials to MOSFETs, digital logic families, memory devices, microprocessors, digital-to-analog and analog-to-digital converters, digital filters, and multichip module technology. Expert contributors discuss applications in machine vision, ad hoc networks, printing technologies, and data and optical storage systems. The book also includes defining terms, references, and suggestions for further reading. This edition features two new sections on fundamental properties and semiconductor devices. With updated material and references in every chapter, Microelectronics, Second Edition is an essential reference for work with microelectronics, electronics, circuits, systems, semiconductors, logic design, and microprocessors.