Microelectronics
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Microelectronics
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Author : Maurizio Di Paolo Emilio
language : en
Publisher: Springer
Release Date : 2015-08-17
Microelectronics written by Maurizio Di Paolo Emilio and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-08-17 with Technology & Engineering categories.
This book serves as a practical guide for practicing engineers who need to design analog circuits for microelectronics. Readers will develop a comprehensive understanding of the basic techniques of analog modern electronic circuit design, discrete and integrated, application as sensors and control and data acquisition systems,and techniques of PCB design. · Describes fundamentals of microelectronics design in an accessible manner; · Takes a problem-solving approach to the topic, offering a hands-on guide for practicing engineers; · Provides realistic examples to inspire a thorough understanding of system-level issues, before going into the detail of components and devices; · Uses a new approach and provides several skills that help engineers and designers retain key and advanced concepts.
Microelectronics Research Development Background Paper
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Author : United States. Congress. Office of Technology Assessment
language : en
Publisher: DIANE Publishing
Release Date : 1986
Microelectronics Research Development Background Paper written by United States. Congress. Office of Technology Assessment and has been published by DIANE Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1986 with categories.
Microelectronics
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Author : Edward Keonjian
language : en
Publisher:
Release Date : 1963
Microelectronics written by Edward Keonjian and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1963 with Technology & Engineering categories.
Microelectronics Packaging Handbook
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Author : Rao Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-01-31
Microelectronics Packaging Handbook written by Rao Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-01-31 with Computers categories.
Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.
Mechanics Of Microelectronics
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Author : G.Q. Zhang
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-08-25
Mechanics Of Microelectronics written by G.Q. Zhang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-08-25 with Technology & Engineering categories.
From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture
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Author : E-H Wong
language : en
Publisher: Woodhead Publishing
Release Date : 2015-05-23
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture written by E-H Wong and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05-23 with Technology & Engineering categories.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study
Microelectronics To Nanoelectronics
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Author : Anupama B. Kaul
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Microelectronics To Nanoelectronics written by Anupama B. Kaul and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Science categories.
Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena. Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology’s Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached the commercial realm. Capitalizing on Dr. Kaul’s considerable technical experience with micro- and nanotechnologies and her extensive research in prestigious academic and industrial labs, the book offers a fresh perspective on application-driven research in micro- and nanoelectronics, including MEMS. Chapters explore how rapid developments in this area are transitioning from the lab to the market, where new and exciting materials, devices, and manufacturing technologies are revolutionizing the electronics industry. Although many micro- and nanotechnologies still face major scientific and technological challenges and remain within the realm of academic research labs, rapid advances in this area have led to the recent emergence of new applications and markets. This handbook encapsulates that exciting recent progress by providing high-quality content contributed by international experts from academia, leading industrial institutions—such as Hewlett-Packard—and government laboratories including the U.S. Department of Energy’s Sandia National Laboratory. Offering something for everyone, from students to scientists to entrepreneurs, this book showcases the broad spectrum of cutting-edge technologies that show significant promise for electronics and related applications in which nanotechnology plays a key role.
Microelectronics Circuits And Systems
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Author : Abhijit Biswas
language : en
Publisher: Springer Nature
Release Date : 2021-08-03
Microelectronics Circuits And Systems written by Abhijit Biswas and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-08-03 with Technology & Engineering categories.
This book presents a collection of peer-reviewed articles from the 7th International Conference on Microelectronics, Circuits, and Systems – Micro 2020. The volume covers the latest development and emerging research topics of material sciences, devices, microelectronics, circuits, nanotechnology, system design and testing, simulation, sensors, photovoltaics, optoelectronics, and its different applications. This book also deals with several tools and techniques to match the theme of the conference. It will be a valuable resource for researchers, professionals, Ph.D. scholars, undergraduate and postgraduate students working in Electronics, Microelectronics, Electrical, and Computer Engineering.
Microelectronic Materials And Processes
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Author : Roland Levy
language : en
Publisher: Springer Science & Business Media
Release Date : 1989-01-31
Microelectronic Materials And Processes written by Roland Levy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-01-31 with Technology & Engineering categories.
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Microelectronic Interconnections And Assembly
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Author : G.G. Harman
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Microelectronic Interconnections And Assembly written by G.G. Harman and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.