Plasma Etching Processes For Interconnect Realization In Vlsi
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Plasma Etching Processes For Interconnect Realization In Vlsi
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Author : Nicolas Posseme
language : en
Publisher: Elsevier
Release Date : 2015-04-14
Plasma Etching Processes For Interconnect Realization In Vlsi written by Nicolas Posseme and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-04-14 with Technology & Engineering categories.
This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions.This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice of copper/low-k interconnect architecture is one of the keys for integrated circuit performance, process manufacturability and scalability. Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dimension and profile control, selectivity) and new emerging challenges (residue formation, dielectric wiggling) are critical points of research in order to control the reliability and reduce defects in interconnects. These issues and potential solutions are illustrated by the authors through different process architectures available in the semiconductor industry (metallic or organic hard mask strategies). Presents the difficulties encountered for interconnect realization in very large-scale integrated (VLSI) circuits Focused on plasma-dielectric surface interaction Helps you further reduce the dielectric constant for the future technological nodes
Plasma Etching Processes For Cmos Devices Realization
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Author : Nicolas Posseme
language : en
Publisher: Elsevier
Release Date : 2017-01-25
Plasma Etching Processes For Cmos Devices Realization written by Nicolas Posseme and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-01-25 with Technology & Engineering categories.
Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent. Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography. This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization. Helps readers discover the master technology used to pattern complex structures involving various materials Explores the capabilities of cold plasmas to generate well controlled etched profiles and high etch selectivities between materials Teaches users how etch compensation helps to create devices that are smaller than 20 nm
Atomic Molecular Ionization By Electron Scattering
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Author : K. N. Joshipura
language : en
Publisher: Cambridge University Press
Release Date : 2019-01-24
Atomic Molecular Ionization By Electron Scattering written by K. N. Joshipura and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-24 with Science categories.
Covers quantum scattering theories, experimental and theoretical calculations and applications in a comprehensive manner.
Advances In Atomic Molecular And Optical Physics
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Author :
language : en
Publisher: Academic Press
Release Date : 2017-06-07
Advances In Atomic Molecular And Optical Physics written by and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-06-07 with Science categories.
Advances in Atomic, Molecular, and Optical Physics, Volume 66, provides a comprehensive compilation of recent developments in a field that is in a state of rapid growth as new experimental and theoretical techniques are used on many problems, both old and new. Topics covered include related applied areas, such as atmospheric science, astrophysics, surface physics, and laser physics, with timely articles written by distinguished experts that contain relevant review materials and detailed descriptions of important developments in the field. Presents the work of international experts in the field Contains comprehensive articles that compile recent developments in a field that is experiencing rapid growth, with new experimental and theoretical techniques emerging Ideal for users interested in optics, excitons, plasmas, and thermodynamics Topics covered include atmospheric science, astrophysics, surface physics, and laser physics, amongst others
Low Energy Electrons
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Author : Oddur Ingólfsson
language : en
Publisher: CRC Press
Release Date : 2019-04-23
Low Energy Electrons written by Oddur Ingólfsson and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-23 with Science categories.
Low-energy electrons are ubiquitous in nature and play an important role in natural phenomena as well as many potential and current industrial processes. Authored by 16 active researchers, this book describes the fundamental characteristics of low-energy electron–molecule interactions and their role in different fields of science and technology, including plasma processing, nanotechnology, and health care, as well as astro- and atmospheric physics and chemistry. The book is packed with illustrative examples, from both fundamental and application sides, features about 130 figures, and lists over 800 references. It may serve as an advanced graduate-level study course material where selected chapters can be used either individually or in combination as a basis to highlight and study specific aspects of low-energy electron–molecule interactions. It is also directed at researchers in the fields of plasma physics, nanotechnology, and radiation damage to biologically relevant material (such as in cancer therapy), especially those with an interest in high-energy-radiation-induced processes, from both an experimental and a theoretical point of view.
Plasma Etching Processes For Sub Quarter Micron Devices
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Author : G. S. Mathad
language : en
Publisher: The Electrochemical Society
Release Date : 2000
Plasma Etching Processes For Sub Quarter Micron Devices written by G. S. Mathad and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Integrated circuits categories.
Applications Of Plasma Processes To Vlsi Technology
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Author : Takuo Sugano
language : en
Publisher: Wiley-Interscience
Release Date : 1985-09-24
Applications Of Plasma Processes To Vlsi Technology written by Takuo Sugano and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985-09-24 with Science categories.
Presents state-of-the-art research in microelectronic processing for very large scale integration. Emphasizing applications and techniques, this book provides considerable insight into Japan's technological effort in this important area of science. Focuses on research involving plasma deposition and dry etching. Considerable attention is devoted to MOS gate fabrication, the studies of the influence of process parameters on electrical properties, dry processing technologies, and the theory of plasma chemical reactions.
Dry Etching For Vlsi
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Author : A.J. van Roosmalen
language : en
Publisher: Springer Science & Business Media
Release Date : 1991-03-31
Dry Etching For Vlsi written by A.J. van Roosmalen and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-03-31 with Science categories.
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
Plasma Etching In Semiconductor Fabrication
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Author : Russ A. Morgan
language : en
Publisher: North-Holland
Release Date : 1985-01-01
Plasma Etching In Semiconductor Fabrication written by Russ A. Morgan and has been published by North-Holland this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985-01-01 with Science categories.
Hardbound. This book is based on a post-graduate study carried out by the author on plasma etching mechanisms of semiconductor materials such as silicon, silicon dioxide, photoresist and aluminium films used in integrated circuit fabrication. In this book he gives an extensive review of the chemistry of dry etching, sustaining mechanisms and reactor architecture. He also describes a study made on the measurement of the electrical characteristics and ionization conditions existing in a planar reactor. In addition, practical problems such as photoresist mask erosion have been investigated and the reader will find the photoresist chemistry very useful. The book contains a great deal of practical information on plasma etching processes. The electronics industry is continually seeking ways to improve the miniaturization of devices, and this account of the author's findings should be a useful contribution to the work of miniaturization.
Plasma Processes For Semiconductor Fabrication
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Author : W. N. G. Hitchon
language : en
Publisher: Cambridge University Press
Release Date : 1999-01-28
Plasma Processes For Semiconductor Fabrication written by W. N. G. Hitchon and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-01-28 with Technology & Engineering categories.
Plasma processing is a central technique in the fabrication of semiconductor devices. This self-contained book provides an up-to-date description of plasma etching and deposition in semiconductor fabrication. It presents the basic physics and chemistry of these processes, and shows how they can be accurately modeled. The author begins with an overview of plasma reactors and discusses the various models for understanding plasma processes. He then covers plasma chemistry, addressing the effects of different chemicals on the features being etched. Having presented the relevant background material, he then describes in detail the modeling of complex plasma systems, with reference to experimental results. The book closes with a useful glossary of technical terms. No prior knowledge of plasma physics is assumed in the book. It contains many homework exercises and serves as an ideal introduction to plasma processing and technology for graduate students of electrical engineering and materials science. It will also be a useful reference for practicing engineers in the semiconductor industry.