Plastic Ball Grid Array Pbga Solder Joint Reliability Assessment Under Combined Thermal Cycling And Vibration Loading Conditions

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Plastic Ball Grid Array Pbga Solder Joint Reliability Assessment Under Combined Thermal Cycling And Vibration Loading Conditions

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Author : Haiyu Qi
language : en
Publisher:
Release Date : 2006

Plastic Ball Grid Array Pbga Solder Joint Reliability Assessment Under Combined Thermal Cycling And Vibration Loading Conditions written by Haiyu Qi and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with categories.

Lead Free Solder Interconnect Reliability

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Author : Dongkai Shangguan
language : en
Publisher: ASM International
Release Date : 2005

Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.

Proceedings

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Author :
language : en
Publisher:
Release Date : 2004

Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Electronic apparatus and appliances categories.

Lead Free Solder

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Author : John Hock Lye Pang
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-10-15

Lead Free Solder written by John Hock Lye Pang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-15 with Technology & Engineering categories.

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

Journal Of Electronic Packaging

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Author :
language : en
Publisher:
Release Date : 2008

Journal Of Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Electronic packaging categories.

Lead Free Solder Interconnect Reliability

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Author : Dongkai Shangguan
language : en
Publisher: ASM International(OH)
Release Date : 2005

Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and has been published by ASM International(OH) this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.

Provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed.

Solder Joint Reliability

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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27

Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Electrical Electronics Abstracts

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Author :
language : en
Publisher:
Release Date : 1997

Electrical Electronics Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electrical engineering categories.

Modeling Analysis Design And Tests For Electronics Packaging Beyond Moore

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Author : Hengyun Zhang
language : en
Publisher: Woodhead Publishing
Release Date : 2019-11-14

Modeling Analysis Design And Tests For Electronics Packaging Beyond Moore written by Hengyun Zhang and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-14 with Technology & Engineering categories.

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging

Chemical Abstracts

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Author :
language : en
Publisher:
Release Date : 2002

Chemical Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Chemistry categories.