Power Integrity For Nanoscale Integrated Systems
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Power Integrity For Nanoscale Integrated Systems
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Author : Masanori Hashimoto
language : en
Publisher: McGraw Hill Professional
Release Date : 2014-03-07
Power Integrity For Nanoscale Integrated Systems written by Masanori Hashimoto and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-03-07 with Technology & Engineering categories.
Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery
Power Integrity For Nanoscale Integrated Systems
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Author : Raj Nair
language : en
Publisher: McGraw-Hill Education
Release Date : 2014-03-19
Power Integrity For Nanoscale Integrated Systems written by Raj Nair and has been published by McGraw-Hill Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-03-19 with Technology & Engineering categories.
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery
E Learning E Education And Online Training
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Author : Guanglu Sun
language : en
Publisher: Springer Nature
Release Date : 2019-11-18
E Learning E Education And Online Training written by Guanglu Sun and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-18 with Education categories.
This book constitutes the proceedings of the 5th International Conference on e-Learning, e-Education, and Online Training, eLEOT 2019, held in Kunming, China, in August 2019. The 46 revised full papers presented were carefully reviewed and selected from 99 submissions. They focus on most recent and innovative trends in this broad area, ranging from distance education to collaborative learning, from interactive learning environments to the modelling of STEM (Science, Technology, Mathematics, Engineering) curricula.
Electrical Modeling And Design For 3d System Integration
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Author : Er-Ping Li
language : en
Publisher: John Wiley & Sons
Release Date : 2012-04-10
Electrical Modeling And Design For 3d System Integration written by Er-Ping Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-04-10 with Technology & Engineering categories.
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Circuits At The Nanoscale
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Author : Krzysztof Iniewski
language : en
Publisher: CRC Press
Release Date : 2018-10-08
Circuits At The Nanoscale written by Krzysztof Iniewski and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-08 with Technology & Engineering categories.
Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.
Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement
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Author : Yue Ma
language : en
Publisher: CRC Press
Release Date : 2019-03-08
Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement written by Yue Ma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-08 with Computers categories.
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Intelligent System And Computing
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Author : Yang Yi
language : en
Publisher: BoD – Books on Demand
Release Date : 2020-04-29
Intelligent System And Computing written by Yang Yi and has been published by BoD – Books on Demand this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-04-29 with Computers categories.
The book “Intelligent System and Computing” reports the theory, mathematical models, algorithms, design methods, and applications of intelligent systems and computing. It covers various disciplines including computer and information science, electrical and computer engineering, natural sciences, economics, and neuroscience. The broad-ranging discussion covers the key disciplines in computational science and artificial intelligence as well as advances in neuromorphic computing, deep learning, the Internet of Things, computer vision, and many others. This volume provides both academics and professionals with a comprehensive overview of the field and presents areas for future research.
Physical Design For 3d Integrated Circuits
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Author : Aida Todri-Sanial
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Physical Design For 3d Integrated Circuits written by Aida Todri-Sanial and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Peterson S Graduate Programs In Engineering Applied Sciences Aerospace Aeronautical Engineering Agricultural Engineering Bioengineering And Architectural Engineering 2011
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Author : Peterson's
language : en
Publisher: Peterson's
Release Date : 2011-05-01
Peterson S Graduate Programs In Engineering Applied Sciences Aerospace Aeronautical Engineering Agricultural Engineering Bioengineering And Architectural Engineering 2011 written by Peterson's and has been published by Peterson's this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-01 with Study Aids categories.
Peterson's Graduate Programs in Engineering & Applied Sciences, Aerospace/Aeronautical Engineering, Agricultural Engineering & Bioengineering, and Architectural Engineering contains a wealth of information on colleges and universities that offer graduate work these exciting fields. The institutions listed include those in the United States and Canada, as well as international institutions that are accredited by U.S. accrediting bodies. Up-to-date information, collected through Peterson's Annual Survey of Graduate and Professional Institutions, provides valuable information on degree offerings, professional accreditation, jointly offered degrees, part-time and evening/weekend programs, postbaccalaureate distance degrees, faculty, students, degree requirements, entrance requirements, expenses, financial support, faculty research, and unit head and application contact information. Readers will find helpful links to in-depth descriptions that offer additional detailed information about a specific program or department, faculty members and their research, and much more. In addition, there are valuable articles on financial assistance, the graduate admissions process, advice for international and minority students, and facts about accreditation, with a current list of accrediting agencies.
Semiconductor Nanoscale Devices Materials And Design Challenges
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Author : Ashish Raman, Prabhat Singh, Naveen Kumar, Ravi Ranjan
language : en
Publisher: Bentham Science Publishers
Release Date : 2025-03-14
Semiconductor Nanoscale Devices Materials And Design Challenges written by Ashish Raman, Prabhat Singh, Naveen Kumar, Ravi Ranjan and has been published by Bentham Science Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-03-14 with Technology & Engineering categories.
Semiconductor Nanoscale Devices: Materials and Design Challenges provides a comprehensive exploration of nanoscale technologies and semiconductor device design, focusing on innovative materials and advanced applications. It bridges classical and quantum concepts, offering insights into foundational materials, device architectures, and future technologies like biosensors, 6G communication, and photovoltaics. The book is organized into three sections: foundational concepts, methodologies and advancements, and next-generation applications. It emphasizes practical design, analytical modeling, and optimization for real-world applications, making it a valuable resource for professionals and researchers. Key Features: - Comprehensive coverage of nanoscale semiconductor device design challenges and innovations. - Focus on advanced materials and methodologies for cutting-edge technologies. - Practical insights into measurement techniques and device optimization. - In-depth exploration of emerging applications like 6G, biosensors, and photovoltaics.