Proceedings Of The Microelectronics Symposium
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Proceedings Of The Microelectronics Symposium
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Author :
language : en
Publisher:
Release Date : 1968
Proceedings Of The Microelectronics Symposium written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1968 with categories.
Proceedings Of The International Symposium On Microelectronics
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Author :
language : en
Publisher:
Release Date : 1997
Proceedings Of The International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Hybrid integrated circuits categories.
Microelectronics Symposium
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Author : Institute of Electrical and Electronics Engineers. St. Louis Section
language : en
Publisher:
Release Date : 1963
Microelectronics Symposium written by Institute of Electrical and Electronics Engineers. St. Louis Section and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1963 with Miniature electronic equipment categories.
Microelectronics Packaging Handbook
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Author : R.R. Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Microelectronics Packaging Handbook written by R.R. Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Computers categories.
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Advanced Flip Chip Packaging
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Author : Ho-Ming Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-20
Advanced Flip Chip Packaging written by Ho-Ming Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-20 with Technology & Engineering categories.
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Microelectronic Applications Of Chemical Mechanical Planarization
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Author : Yuzhuo Li
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-19
Microelectronic Applications Of Chemical Mechanical Planarization written by Yuzhuo Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-19 with Technology & Engineering categories.
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Electronics Packaging Forum
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Author : James E. Morris
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Electronics Packaging Forum written by James E. Morris and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Design For Manufacturability And Statistical Design
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Author : Michael Orshansky
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-10-28
Design For Manufacturability And Statistical Design written by Michael Orshansky and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-28 with Technology & Engineering categories.
Design for Manufacturability and Statistical Design: A Comprehensive Approach presents a comprehensive overview of methods that need to be mastered in understanding state-of-the-art design for manufacturability and statistical design methodologies. Broadly, design for manufacturability is a set of techniques that attempt to fix the systematic sources of variability, such as those due to photolithography and CMP. Statistical design, on the other hand, deals with the random sources of variability. Both paradigms operate within a common framework, and their joint comprehensive treatment is one of the objectives of this book and an important differentation.
Electronic Materials Handbook
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Author :
language : en
Publisher: ASM International
Release Date : 1989-11-01
Electronic Materials Handbook written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-01 with Technology & Engineering categories.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Long Term Non Operating Reliability Of Electronic Products
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Author : Judy Pecht
language : en
Publisher: CRC Press
Release Date : 2019-07-23
Long Term Non Operating Reliability Of Electronic Products written by Judy Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-07-23 with Mathematics categories.
In today's electronic environment, operating reliability for continued daily use of electronic products is essential. This book discusses the reliability of products that lie dormant for long periods of time and are subject to stresses such as humidity, ionic contaminants, temperature, radiation, shock, and vibration. Non-operating reliability is especially critical for life-saving electronic products such as fire alarm systems, standby power sources, and burglar alarms. Air bags in automobiles, earthquake alarm systems, and radiation warning systems in nuclear power plants are also covered. This physics-of-failure approach is also important to maintaining defense hardware such as missiles and munitions systems which often lie dormant for years before being deployed on very short notice