Proceedings Of The Symposium On Reliability Of Metals In Electronics
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Proceedings Of The Retma Symposium On Reliable Electronic Connections
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Author : Electronic Industries Association. Engineering Dept
language : en
Publisher:
Release Date : 1954
Proceedings Of The Retma Symposium On Reliable Electronic Connections written by Electronic Industries Association. Engineering Dept and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1954 with Electronic circuits categories.
Electronic Materials Handbook
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Author :
language : en
Publisher: ASM International
Release Date : 1989-11-01
Electronic Materials Handbook written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-01 with Technology & Engineering categories.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Electromigration In Metals
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Author : Paul S. Ho
language : en
Publisher: Cambridge University Press
Release Date : 2022-05-12
Electromigration In Metals written by Paul S. Ho and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-12 with Technology & Engineering categories.
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Proceedings Of The Symposium On Reliability Of Metals In Electronics
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Author : Hazara S. Rathore
language : en
Publisher: The Electrochemical Society
Release Date : 1995
Proceedings Of The Symposium On Reliability Of Metals In Electronics written by Hazara S. Rathore and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Technology & Engineering categories.
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2019-12-01
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-12-01 with Technology & Engineering categories.
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
The Esd Handbook
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Author : Steven H. Voldman
language : en
Publisher: John Wiley & Sons
Release Date : 2021-03-25
The Esd Handbook written by Steven H. Voldman and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-03-25 with Technology & Engineering categories.
A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.
Esd
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Author : Steven H. Voldman
language : en
Publisher: John Wiley & Sons
Release Date : 2006-11-02
Esd written by Steven H. Voldman and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-11-02 with Technology & Engineering categories.
With the growth of high-speed telecommunications and wireless technology, it is becoming increasingly important for engineers to understand radio frequency (RF) applications and their sensitivity to electrostatic discharge (ESD) phenomena. This enables the development of ESD design methods for RF technology, leading to increased protection against electrical overstress (EOS) and ESD. ESD: RF Technology and Circuits: Presents methods for co-synthesizisng ESD networks for RF applications to achieve improved performance and ESD protection of semiconductor chips; discusses RF ESD design methods of capacitance load transformation, matching network co-synthesis, capacitance shunts, inductive shunts, impedance isolation, load cancellation methods, distributed loads, emitter degeneration, buffering and ballasting; examines ESD protection and design of active and passive elements in RF complementary metal-oxide-semiconductor (CMOS), RF laterally-diffused metal oxide semiconductor (LDMOS), RF BiCMOS Silicon Germanium (SiGe), RF BiCMOS Silicon Germanium Carbon (SiGeC), and Gallim Arsenide technology; gives information on RF ESD testing methodologies, RF degradation effects, and failure mechanisms for devices, circuits and systems; highlights RF ESD mixed-signal design integration of digital, analog and RF circuitry; sets out examples of RF ESD design computer aided design methodologies; covers state-of-the-art RF ESD input circuits, as well as voltage-triggered to RC-triggered ESD power clamps networks in RF technologies, as well as off-chip protection concepts. Following the authors series of books on ESD, this book will be a thorough overview of ESD in RF technology for RF semiconductor chip and ESD engineers. Device and circuit engineers working in the RF domain, and quality, reliability and failure analysis engineers will also find it a valuable reference in the rapidly growing are of RF ESD design. In addition, it will appeal to graduate students in RF microwave technology and RF circuit design.
Proceedings Of The 42nd International Conference On Advanced Ceramics And Composites Volume 39 Issue 3
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Author : Jingyang Wang
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-14
Proceedings Of The 42nd International Conference On Advanced Ceramics And Composites Volume 39 Issue 3 written by Jingyang Wang and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-14 with Technology & Engineering categories.
Proceeding of the 42nd International Conference on Advanced Ceramics and Composites, Ceramic Engineering and Science Proceedings Volume 39, Issue 3, 2018 Jingyang Wang, Waltraud Kriven, Tobias Fey, Paolo Colombo, William J. Weber, Jake Amoroso, William G. Fahrenholtz, Kiyoshi Shimamura, Michael Halbig, Soshu Kirihara, Yiquan Wu, and Kathleen Shurgart, Editors Valerie Wiesner and Manabu Fukushima, Volume Editors This proceedings contains a collection of 22 papers from The American Ceramic Society's 42nd International Conference on Advanced Ceramics and Composites, held in Daytona Beach, Florida, January 21-26, 2018. This issue includes papers presented in the following symposia: Advancing Frontiers of Ceramics for Sustainable Societal Development – International Symposium in Honor of Dr. Mrityunjay Singh Symposium 9: Porous Ceramics: Novel Developments and Applications Symposium 10: Virtual Materials (Computational) Design and Ceramic Genome Symposium 12 Materials for Extreme Environments: Ultrahigh Temperature Ceramics (UHTCs) and Nano-laminated Ternary Carbides and Nitrides (MAX Phases) Symposium 13 Advanced Ceramics and Composites for Nuclear Fission and Fusion Energy Symposium 14 Crystalline Materials for Electrical, Optical and Medical Applications Symposium 15 Additive Manufacturing and 3D Printing Technologies Symposium 16: Geopolymers, Inorganic Polymers and Sustainable Materials Focused Session 1: Bio-inspired Processing of Advanced Materials 7th Global Young Investigator Forum
Microelectronics Packaging Handbook
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Author : Rao Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-01-31
Microelectronics Packaging Handbook written by Rao Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-01-31 with Computers categories.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Electrical Contacts
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Author : Paul G. Slade
language : en
Publisher: CRC Press
Release Date : 1999-03-31
Electrical Contacts written by Paul G. Slade and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-03-31 with Technology & Engineering categories.
Covering the choice, attachment, and testing of contact materials, Electrical Contacts introduces a thorough discussion on making electric contact and contact interface conduction, presents a general outline of, and measurement techniques for, important corrosion mechanisms, discusses the results of contact wear when plug-in connections are made and broken, investigates the effect of thin noble metal plating on electronic connections, relates crucial considerations for making high- and low-power contact joints, details arcing effects on contacts including contact erosion, welding, and contamination, and contains nearly 2800 references, tables, equations, drawings, and photographs.