Process Integration And Performance Evaluation Of Ge Based Quantum Well Channel Mosfets For Sub 22nm Node Digital Cmos Logic Technology
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Process Integration And Performance Evaluation Of Ge Based Quantum Well Channel Mosfets For Sub 22nm Node Digital Cmos Logic Technology
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Author : Se-Hoon Lee
language : en
Publisher:
Release Date : 2011
Process Integration And Performance Evaluation Of Ge Based Quantum Well Channel Mosfets For Sub 22nm Node Digital Cmos Logic Technology written by Se-Hoon Lee and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.
Since metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for integrated circuits in 1961, complementary MOS technology has become the mainstream of semiconductor industry. Its performance has been improved based on scaling of dimensions of MOS field-effect-transistors (MOSFET) in accordance with Moore's law, which states that the density of MOSFETs due to scaling approximately doubles every two years. Entering into sub-100nm regime caused a lot of challenges. Traditional way of scaling no longer provided performance enhancement of individual MOSFETs. Increased channel doping which is required to prevent degradation of device electrostatics from short channel effects caused carrier mobility degradation. New inventions needed to be incorporated to sustain performance enhancement trend with scaling. Implementation of process induced strained Si technology allowed mobility enhancement, and high-K/metal gate instead of conventional poly-Si/SiO2 allowed continuing electrical gate oxide thickness scaling, hence extending the life span of Moore's law. As we are now moving toward 22nm logic technology and below, new concerns have been rapidly aroused. Controlling power consumption and performance variability are becoming as important as developing scaled devices with enhanced performance. Expandability of strained-Si channel technology via process induced strain also faces increasing complexity from ever tighter gate pitch and difficulties in controlling defect level with the channel stress enhancement techniques. At the same time, long-lasting planar MOSFET architecture also faces serious challenges due to the limits of controlling short channel effects. New paradigms and pathways for future technology seems to be required. As a result, new material sets, new device architectures and concepts are being vigorously explored in the literature. These new trends can be categorized into three groups: MOSFET structure with (non-Si) high mobility channel materials, advanced (non-planar) MOSFET structures, and MOSFET-type structures with new device operation concepts such as tunneling FETs. This dissertation presents research on high mobility channel MOSFET structures (planar and non-planar) using group IV material (mainly SiGe) for enhanced performance and reduced operating power. This work especially focuses on improving the performance of short channel device performance of SiGe channel pMOSFETs which has long been researched yet clearly demonstrated in literature only recently. To reach the goal, novel processing technologies such as millisecond flash source/drain anneal and high pressure hydrogen post-metal anneal are explored. Finally, performance dependence on channel and substrate direction has been analyzed to find the optimal use of these SiGe channels. This work describes an exciting opportunity of weighting the possibility of using high mobility channel MOSFETs for future logic technology.
Reliability Of High Mobility Sige Channel Mosfets For Future Cmos Applications
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Author : Jacopo Franco
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-19
Reliability Of High Mobility Sige Channel Mosfets For Future Cmos Applications written by Jacopo Franco and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-19 with Technology & Engineering categories.
Due to the ever increasing electric fields in scaled CMOS devices, reliability is becoming a showstopper for further scaled technology nodes. Although several groups have already demonstrated functional Si channel devices with aggressively scaled Equivalent Oxide Thickness (EOT) down to 5Å, a 10 year reliable device operation cannot be guaranteed anymore due to severe Negative Bias Temperature Instability. This book focuses on the reliability of the novel (Si)Ge channel quantum well pMOSFET technology. This technology is being considered for possible implementation in next CMOS technology nodes, thanks to its benefit in terms of carrier mobility and device threshold voltage tuning. We observe that it also opens a degree of freedom for device reliability optimization. By properly tuning the device gate stack, sufficiently reliable ultra-thin EOT devices with a 10 years lifetime at operating conditions are demonstrated. The extensive experimental datasets collected on a variety of processed 300mm wafers and presented here show the reliability improvement to be process - and architecture-independent and, as such, readily transferable to advanced device architectures as Tri-Gate (finFET) devices. We propose a physical model to understand the intrinsically superior reliability of the MOS system consisting of a Ge-based channel and a SiO2/HfO2 dielectric stack. The improved reliability properties here discussed strongly support (Si)Ge technology as a clear frontrunner for future CMOS technology nodes.
Microlithography
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Author : Bruce W. Smith
language : en
Publisher: CRC Press
Release Date : 2020-05-01
Microlithography written by Bruce W. Smith and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-01 with Technology & Engineering categories.
The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations. Renowned experts from the world’s leading academic and industrial organizations have provided in-depth coverage of the technologies involved in optical, deep-ultraviolet (DUV), immersion, multiple patterning, extreme ultraviolet (EUV), maskless, nanoimprint, and directed self-assembly lithography, together with comprehensive descriptions of the advanced materials and processes involved. New in the Third Edition In addition to the full revision of existing chapters, this new Third Edition features coverage of the technologies that have emerged over the past several years, including multiple patterning lithography, design for manufacturing, design process technology co-optimization, maskless lithography, and directed self-assembly. New advances in lithography modeling are covered as well as fully updated information detailing the new technologies, systems, materials, and processes for optical UV, DUV, immersion, and EUV lithography. The Third Edition of Microlithography: Science and Technology authoritatively covers the science and engineering involved in the latest generations of microlithography and looks ahead to the future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current technology, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to better understand the complex world of microlithography science and technology.
Fundamentals Of Iii V Semiconductor Mosfets
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Author : Serge Oktyabrsky
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-03-16
Fundamentals Of Iii V Semiconductor Mosfets written by Serge Oktyabrsky and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-03-16 with Technology & Engineering categories.
Fundamentals of III-V Semiconductor MOSFETs presents the fundamentals and current status of research of compound semiconductor metal-oxide-semiconductor field-effect transistors (MOSFETs) that are envisioned as a future replacement of silicon in digital circuits. The material covered begins with a review of specific properties of III-V semiconductors and available technologies making them attractive to MOSFET technology, such as band-engineered heterostructures, effect of strain, nanoscale control during epitaxial growth. Due to the lack of thermodynamically stable native oxides on III-V's (such as SiO2 on Si), high-k oxides are the natural choice of dielectrics for III-V MOSFETs. The key challenge of the III-V MOSFET technology is a high-quality, thermodynamically stable gate dielectric that passivates the interface states, similar to SiO2 on Si. Several chapters give a detailed description of materials science and electronic behavior of various dielectrics and related interfaces, as well as physics of fabricated devices and MOSFET fabrication technologies. Topics also include recent progress and understanding of various materials systems; specific issues for electrical measurement of gate stacks and FETs with low and wide bandgap channels and high interface trap density; possible paths of integration of different semiconductor materials on Si platform.
Nanoscale Transistors
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Author : Mark Lundstrom
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-06-18
Nanoscale Transistors written by Mark Lundstrom and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-06-18 with Technology & Engineering categories.
To push MOSFETs to their scaling limits and to explore devices that may complement or even replace them at molecular scale, a clear understanding of device physics at nanometer scale is necessary. Nanoscale Transistors provides a description on the recent development of theory, modeling, and simulation of nanotransistors for electrical engineers, physicists, and chemists working on nanoscale devices. Simple physical pictures and semi-analytical models, which were validated by detailed numerical simulations, are provided for both evolutionary and revolutionary nanotransistors. After basic concepts are reviewed, the text summarizes the essentials of traditional semiconductor devices, digital circuits, and systems to supply a baseline against which new devices can be assessed. A nontraditional view of the MOSFET using concepts that are valid at nanoscale is developed and then applied to nanotube FET as an example of how to extend the concepts to revolutionary nanotransistors. This practical guide then explore the limits of devices by discussing conduction in single molecules
The Source Drain Engineering Of Nanoscale Germanium Based Mos Devices
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Author : Zhiqiang Li
language : en
Publisher: Springer
Release Date : 2016-03-24
The Source Drain Engineering Of Nanoscale Germanium Based Mos Devices written by Zhiqiang Li and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-03-24 with Technology & Engineering categories.
This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600°C and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10−7Ω•cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.
Atomic Layer Deposition For Semiconductors
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Author : Cheol Seong Hwang
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-18
Atomic Layer Deposition For Semiconductors written by Cheol Seong Hwang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-18 with Science categories.
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Compact Modeling
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Author : Gennady Gildenblat
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-06-22
Compact Modeling written by Gennady Gildenblat and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-06-22 with Technology & Engineering categories.
Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.
Finfets And Other Multi Gate Transistors
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Author : J.-P. Colinge
language : en
Publisher: Springer Science & Business Media
Release Date : 2008
Finfets And Other Multi Gate Transistors written by J.-P. Colinge and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Technology & Engineering categories.
This book explains the physics and properties of multi-gate field-effect transistors (MuGFETs), how they are made and how circuit designers can use them to improve the performances of integrated circuits. It covers the emergence of quantum effects due to the reduced size of the devices and describes the evolution of the MOS transistor from classical structures to SOI (silicon-on-insulator) and then to MuGFETs.
Nanowire Field Effect Transistor Fet
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Author : Antonio García-Loureiro
language : en
Publisher:
Release Date : 2021
Nanowire Field Effect Transistor Fet written by Antonio García-Loureiro and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021 with categories.
In the last few years, the leading semiconductor industries have introduced multi-gate non-planar transistors into their core business. These are being applied in memories and in logical integrated circuits to achieve better integration on the chip, increased performance, and reduced energy consumption. Intense research is underway to develop these devices further and to address their limitations, in order to continue transistor scaling while further improving performance. This Special Issue looks at recent developments in the field of nanowire field-effect transistors (NW-FETs), covering different aspects of the technology, physics, and modelling of these nanoscale devices.