Quality In High Volume Electronics Design

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Quality In High Volume Electronics Design

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Author : Vino Mody
language : en
Publisher: Dog Ear Publishing
Release Date : 2016-02-29

Quality In High Volume Electronics Design written by Vino Mody and has been published by Dog Ear Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-02-29 with Business & Economics categories.

The author compiles valuable lessons learned from his work with hundreds of suppliers and customers world-wide. The design of electronics is fundamental to quality and reliability; manufacturing must follow rules regarding what to and what not to do to make defect-free products; transportation, storage and warehousing operations must adhere to certain disciplines; installation should be done correctly to avoid premature degradation; and failed products must be repaired carefully to avoid damage. Large volume and complex logistics will amplify errors so mistakes in these steps will cost the business huge amounts of money. Also covered are criteria for relevant metrics. The book concisely summarizes few very specific and high impact precautions necessary to build the quality in design. It highlights pitfalls that must be avoided in subsequent manufacturing and delivery operations that can degrade product reliability. The author emphasizes the leadership team must inspire team dynamics and collaboration with central focus on customers. The book will be useful to management and technical ranks involved in design, manufacturing and deployment and customer service. Service provider companies will also benefit from this book. As technology evolves, new products are reaching the market faster, and customers are demanding higher quality and lower cost. For your business to thrive in this environment, it will need to master the processes discussed in these pages that will serve as a valuable reference for a roadmap to success.

Reliability Engineering For Electronic Design

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Author : Norman Fuqua
language : en
Publisher: CRC Press
Release Date : 2020-11-25

Reliability Engineering For Electronic Design written by Norman Fuqua and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-11-25 with Technology & Engineering categories.

This book addresses the needs of electronic design engineers, reliability engineers, and their respective managers, stressing a pragmatic viewpoint rather than a vigorous mathematical presentation.

Machine Learning Applications In Electronic Design Automation

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Author : Haoxing Ren
language : en
Publisher: Springer Nature
Release Date : 2023-01-01

Machine Learning Applications In Electronic Design Automation written by Haoxing Ren and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-01-01 with Technology & Engineering categories.

​This book serves as a single-source reference to key machine learning (ML) applications and methods in digital and analog design and verification. Experts from academia and industry cover a wide range of the latest research on ML applications in electronic design automation (EDA), including analysis and optimization of digital design, analysis and optimization of analog design, as well as functional verification, FPGA and system level designs, design for manufacturing (DFM), and design space exploration. The authors also cover key ML methods such as classical ML, deep learning models such as convolutional neural networks (CNNs), graph neural networks (GNNs), generative adversarial networks (GANs) and optimization methods such as reinforcement learning (RL) and Bayesian optimization (BO). All of these topics are valuable to chip designers and EDA developers and researchers working in digital and analog designs and verification.

Practical Reliability Of Electronic Equipment And Products

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Author : Eugene R. Hnatek
language : en
Publisher: CRC Press
Release Date : 2002-10-25

Practical Reliability Of Electronic Equipment And Products written by Eugene R. Hnatek and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-10-25 with Technology & Engineering categories.

Practical Reliability of Electronic Equipment and Products will help electrical, electronics, manufacturing, mechanical, systems design, and reliability engineers; electronics production managers; electronic circuit designers; and upper-level undergraduate and graduate students in these disciplines.

Invented And Made In The Usa

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Author : Vino Mody
language : en
Publisher: Dog Ear Publishing
Release Date : 2017-06-07

Invented And Made In The Usa written by Vino Mody and has been published by Dog Ear Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-06-07 with Business & Economics categories.

Are you worried about the demise of American manufacturing? Discover innovative solutions that can revolutionize its future. Are you tired of hearing news of yet another American company outsourcing factory jobs overseas? Do you struggle to find products sporting a “Made in the USA” tag? Experienced executive Vino Mody is here to shed light on the current state of American industry and provide a hopeful glimpse into its future. After more than three decades of experience with four different companies in the U.S. and Europe, Mody serves as your guide to a comprehensive history of the rise, fall, and current revival of the American industrial era. Invented and Made in the USA explores how disruptive innovations, changes in manufacturing, and the mining of raw materials have created unmatched employment and wealth. By applying lessons from historical trends and his own insider knowledge, Mody provides real-world answers for the economic obstacles facing our nation. The promise of continued prosperity is alive and well. In Invented and Made in the USA, you’ll discover: -How despite doomsday predictions, the future of American industry is actually bright -How authentic wealth is created with new technology, manufacturing, natural resource extraction, and construction -How changed incentives, regulations, and education systems can grow American manufacturing -How expanding manufacturing can alleviate the national deficit, as well as income inequality and social unrest -How to put America on the path to greater self-sufficiency, and much, much more! Invented and Made in the USA is your guidebook through the intricacies of American industry. If you like a solid historical foundation, real-world examples, and expert advice, then you’ll love Vino Mody’s definitive work. Buy Invented and Made in the USA to join the revival today!

Electronic Design

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Author :
language : en
Publisher:
Release Date : 2001

Electronic Design written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Electronic apparatus and appliances categories.

Design And Modeling Of Low Power Vlsi Systems

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Author : Sharma, Manoj
language : en
Publisher: IGI Global
Release Date : 2016-06-06

Design And Modeling Of Low Power Vlsi Systems written by Sharma, Manoj and has been published by IGI Global this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-06-06 with Technology & Engineering categories.

Very Large Scale Integration (VLSI) Systems refer to the latest development in computer microchips which are created by integrating hundreds of thousands of transistors into one chip. Emerging research in this area has the potential to uncover further applications for VSLI technologies in addition to system advancements. Design and Modeling of Low Power VLSI Systems analyzes various traditional and modern low power techniques for integrated circuit design in addition to the limiting factors of existing techniques and methods for optimization. Through a research-based discussion of the technicalities involved in the VLSI hardware development process cycle, this book is a useful resource for researchers, engineers, and graduate-level students in computer science and engineering.

Economics Of Electronic Design Manufacture And Test

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Author : M. Abadir
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29

Economics Of Electronic Design Manufacture And Test written by M. Abadir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Technology & Engineering categories.

The general understanding of design is that it should lead to a manufacturable product. Neither the design nor the process of manufacturing is perfect. As a result, the product will be faulty, will require testing and fixing. Where does economics enter this scenario? Consider the cost of testing and fixing the product. If a manufactured product is grossly faulty, or too many of the products are faulty, the cost of testing and fixing will be high. Suppose we do not like that. We then ask what is the cause of the faulty product. There must be something wrong in the manufacturing process. We trace this cause and fix it. Suppose we fix all possible causes and have no defective products. We would have eliminated the need for testing. Unfortunately, things are not so perfect. There is a cost involved with finding and eliminating the causes of faults. We thus have two costs: the cost of testing and fixing (we will call it cost-1), and the cost of finding and eliminating causes of faults (call it cost-2). Both costs, in some way, are included in the overall cost of the product. If we try to eliminate cost-1, cost-2 goes up, and vice versa. An economic system of production will minimize the overall cost of the product. Economics of Electronic Design, Manufacture and Test is a collection of research contributions derived from the Second Workshop on Economics of Design, Manufacture and Test, written for inclusion in this book.

Encapsulation Technologies For Electronic Applications

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Author : Haleh Ardebili
language : en
Publisher: William Andrew
Release Date : 2009-07-22

Encapsulation Technologies For Electronic Applications written by Haleh Ardebili and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-07-22 with Technology & Engineering categories.

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. - Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Coverage of environmentally friendly 'green encapsulants' - Practical coverage of faults and defects: how to analyze them and how to avoid them

Failure Modes And Mechanisms In Electronic Packages

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Author : P. Singh
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-11-30

Failure Modes And Mechanisms In Electronic Packages written by P. Singh and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-11-30 with Technology & Engineering categories.

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.