Reliability And Failure Of Electronic Materials And Devices 2 E
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Reliability And Failure Of Electronic Materials And Devices 2 E
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Author : Milton Ohring
language : ko
Publisher:
Release Date : 2015-04
Reliability And Failure Of Electronic Materials And Devices 2 E written by Milton Ohring and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-04 with categories.
Reliability And Failure Of Electronic Materials And Devices
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Author : Milton Ohring
language : en
Publisher: Elsevier
Release Date : 1998-06-12
Reliability And Failure Of Electronic Materials And Devices written by Milton Ohring and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-06-12 with Technology & Engineering categories.
Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. - Discusses reliability and failure on both the chip and packaging levels - Handles the role of defects in yield and reliability - Includes a tutorial chapter on the mathematics of reliability - Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints - Considers defect detection methods and failure analysis techniques
Reliability And Failure Of Electronic Materials And Devices
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Author : Milton Ohring
language : en
Publisher: Academic Press
Release Date : 2014-10-14
Reliability And Failure Of Electronic Materials And Devices written by Milton Ohring and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-14 with Technology & Engineering categories.
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Proceedings Of The International Workshop On Physics And Technology Of Thin Films
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Author : Alireza Zaker Moshfegh
language : en
Publisher: World Scientific
Release Date : 2004-06-08
Proceedings Of The International Workshop On Physics And Technology Of Thin Films written by Alireza Zaker Moshfegh and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-06-08 with Science categories.
Thin films science and technology plays an important role in the high-tech industries. Thin film technology has been developed primarily for the need of the integrated circuit industry. The demand for development of smaller and smaller devices with higher speed especially in new generation of integrated circuits requires advanced materials and new processing techniques suitable for future giga scale integration (GSI) technology. In this regard, physics and technology of thin films can play an important role to acheive this goal. The production of thin films for device purposes has been developed over the past 40 years. Thin films as a two dimensional system are of great importance to many real-world problems. Their material costs are very small as compared to the corresponding bulk material and they perform the same function when it comes to surface processes. Thus, knowledge and determination of the nature, functions and new properties of thin films can be used for the development of new technologies for future applications. Thin film technology is based on three foundations: fabrication, characterization and applications. Some of the important applications of thin films are microelectronics, communication, optical electronics, catalysis, coating of all kinds, and energy generation and conservation strategies. This book emphasizes the importance of thin films and their properties for the new technologies. It presents basic principles, processes techniques and applications of thin films. As thin films physics and technology is a multidisciplinary field, the book will be useful to a wide varity of readers (especially young researcher) in physics, electronic engineering, material science and metallurgy. Contents: Deposition Processes; Characterization Techniques; Surface Processes; Nanomaterials; Optical Materials; Superconductivity; Magnetic Thin Films. Readership: Graduate students and researchers involved with the physics and technology of thin films.
Progress Report On Reliability Of Electronic Equipment
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Author : United States. Department of Defense. Research and Development Board. Ad Hoc Group on Reliability of Electronic Equipment
language : en
Publisher:
Release Date : 1952
Progress Report On Reliability Of Electronic Equipment written by United States. Department of Defense. Research and Development Board. Ad Hoc Group on Reliability of Electronic Equipment and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1952 with Electronics categories.
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging
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Author : Ephraim Suhir
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-26
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-26 with Technology & Engineering categories.
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Reliabilitystudy Of Power Gallium Nitride Transistors
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Author :
language : en
Publisher: Marcon Denis
Release Date :
Reliabilitystudy Of Power Gallium Nitride Transistors written by and has been published by Marcon Denis this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Optical Waveguide Sensing And Imaging
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Author : Wojtek J. Bock
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-12-14
Optical Waveguide Sensing And Imaging written by Wojtek J. Bock and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-12-14 with Science categories.
The book explores various aspects of existing and emerging fiber and waveguide optics sensing and imaging technologies including recent advances in nanobiophotonics. The focus is both on fundamental and applied research as well as on applications in civil engineering, biomedical sciences, environment, security and defence. The book aims to provide a reference of state-of-the-art overviews covering a variety of topics on the interface of engineering and biomedical sciences.
Introduction To Electronic Materials For Engineers An 2nd Edition
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Author : Wei Gao
language : en
Publisher: World Scientific Publishing Company
Release Date : 2011-05-16
Introduction To Electronic Materials For Engineers An 2nd Edition written by Wei Gao and has been published by World Scientific Publishing Company this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-16 with Technology & Engineering categories.
An Introduction to Electronic Materials for Engineers aims to give a basic understanding and comprehensive overview of a wide range of materials, such as conducting materials, semiconductors, magnetic materials, optical materials, dielectric materials, superconductors, thermoelectric materials and ionic materials. The new chapters added into this latest edition include thin film electronic materials, organic electronic materials and nanostructured materials. These chapters aim to reflect the new developments made in electronic materials and nanotechnology research towards the design and fabrication of modern equipment and electronic devices.This book is designed for undergraduate engineering and technology students who have background knowledge of physics and chemistry, as well as for engineers who work on materials processing or application, or electric/electronic engineering.It emphasizes on the synthesis, performance and application of electronic materials and will enable readers to understand and relate to the devices and materials.
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2019-12-01
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-12-01 with Technology & Engineering categories.
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.