Reliabilitystudy Of Power Gallium Nitride Transistors
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Reliabilitystudy Of Power Gallium Nitride Transistors
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Author :
language : en
Publisher: Marcon Denis
Release Date :
Reliabilitystudy Of Power Gallium Nitride Transistors written by and has been published by Marcon Denis this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Reliability Of Power Gallium Nitride Based Transistors
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Author : Denis Marcon
language : en
Publisher: Legare Street Press
Release Date : 2023-07-18
Reliability Of Power Gallium Nitride Based Transistors written by Denis Marcon and has been published by Legare Street Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-07-18 with categories.
In this cutting-edge study, Denis Marcon examines the reliability of power gallium nitride (GaN) based transistors. Using advanced simulation techniques and experimental data, he develops new models for predicting the reliability of these devices under various operating conditions. This book will be of particular interest to researchers and engineers working on power electronics and related fields. This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work is in the "public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.
Power Gan Devices
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Author : Matteo Meneghini
language : en
Publisher: Springer
Release Date : 2016-09-08
Power Gan Devices written by Matteo Meneghini and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-09-08 with Technology & Engineering categories.
This book presents the first comprehensive overview of the properties and fabrication methods of GaN-based power transistors, with contributions from the most active research groups in the field. It describes how gallium nitride has emerged as an excellent material for the fabrication of power transistors; thanks to the high energy gap, high breakdown field, and saturation velocity of GaN, these devices can reach breakdown voltages beyond the kV range, and very high switching frequencies, thus being suitable for application in power conversion systems. Based on GaN, switching-mode power converters with efficiency in excess of 99 % have been already demonstrated, thus clearing the way for massive adoption of GaN transistors in the power conversion market. This is expected to have important advantages at both the environmental and economic level, since power conversion losses account for 10 % of global electricity consumption. The first part of the book describes the properties and advantages of gallium nitride compared to conventional semiconductor materials. The second part of the book describes the techniques used for device fabrication, and the methods for GaN-on-Silicon mass production. Specific attention is paid to the three most advanced device structures: lateral transistors, vertical power devices, and nanowire-based HEMTs. Other relevant topics covered by the book are the strategies for normally-off operation, and the problems related to device reliability. The last chapter reviews the switching characteristics of GaN HEMTs based on a systems level approach. This book is a unique reference for people working in the materials, device and power electronics fields; it provides interdisciplinary information on material growth, device fabrication, reliability issues and circuit-level switching investigation.
Reliability Of Power Gallium Nitride Based Transistors Primary Source Edition
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Author : Denis Marcon
language : en
Publisher: Nabu Press
Release Date : 2013-12-08
Reliability Of Power Gallium Nitride Based Transistors Primary Source Edition written by Denis Marcon and has been published by Nabu Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-08 with categories.
This is a reproduction of a book published before 1923. This book may have occasional imperfections such as missing or blurred pages, poor pictures, errant marks, etc. that were either part of the original artifact, or were introduced by the scanning process. We believe this work is culturally important, and despite the imperfections, have elected to bring it back into print as part of our continuing commitment to the preservation of printed works worldwide. We appreciate your understanding of the imperfections in the preservation process, and hope you enjoy this valuable book. ++++ The below data was compiled from various identification fields in the bibliographic record of this title. This data is provided as an additional tool in helping to ensure edition identification: ++++ Reliability Of Power Gallium Nitride Based Transistors Denis Marcon Marcon Denis
Gallium Nitride Power Devices
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Author : Hongyu Yu
language : en
Publisher: CRC Press
Release Date : 2017-07-06
Gallium Nitride Power Devices written by Hongyu Yu and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-06 with Science categories.
GaN is considered the most promising material candidate in next-generation power device applications, owing to its unique material properties, for example, bandgap, high breakdown field, and high electron mobility. Therefore, GaN power device technologies are listed as the top priority to be developed in many countries, including the United States, the European Union, Japan, and China. This book presents a comprehensive overview of GaN power device technologies, for example, material growth, property analysis, device structure design, fabrication process, reliability, failure analysis, and packaging. It provides useful information to both students and researchers in academic and related industries working on GaN power devices. GaN wafer growth technology is from Enkris Semiconductor, currently one of the leading players in commercial GaN wafers. Chapters 3 and 7, on the GaN transistor fabrication process and GaN vertical power devices, are edited by Dr. Zhihong Liu, who has been working on GaN devices for more than ten years. Chapters 2 and 5, on the characteristics of polarization effects and the original demonstration of AlGaN/GaN heterojunction field-effect transistors, are written by researchers from Southwest Jiaotong University. Chapters 6, 8, and 9, on surface passivation, reliability, and package technologies, are edited by a group of researchers from the Southern University of Science and Technology of China.
Reliability And Failure Analysis Of Gan On Si Power Devices
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Author : Wen Yang
language : en
Publisher:
Release Date : 2021
Reliability And Failure Analysis Of Gan On Si Power Devices written by Wen Yang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021 with categories.
Wide bandgap power semiconductor devices, especially Gallium Nitride (GaN) high electron mobility transistors (HEMTs), have gained a lot of attention for high power applications due to their low on-resistance and high switching speed compared to their silicon counterparts. However, the reliability and failure issues related to dynamic performance, gate reliability, and electrostatic discharge have limited the wide applications of GaN power devices. This dissertation presents a systematic study of reliability and failure analysis of GaN-on-Si power devices. Firstly, the correlation between the physical trap mechanisms and the dynamic on-resistance (R[subscript on]) degradation has been investigated using a multi-frequency C-V measurement during pulse-mode stress. The experimental results indicate that the deep-level traps originated from the buffer layer play a dominant role in the dynamic R[subscript on] degradation. Secondly, the Si substrate in GaN-on-Si lateral power devices can be used as an independent contact termination rather than a thermal cooling pad. Therefore, the substrate bias effect in dynamic R[subscript on] and Gate Charge (Q[subscript g]) is necessary to explore both conduction and switching loss in GaN-based converter. A reverse dual polarity (RDP) substrate pulse technique has been developed to mitigate the dynamic R[subscript on] degradation. Thirdly, the gate reliability issues, including Time-dependent dielectric breakdown (TDDB), and Bias Temperature Instability (BTI) have been explored to improve the current capability. The physical model of TDDB in GaN power devices has been established by applying the substrate biases. And three phases of threshold voltage degradation have been presented under Negative Bias Temperature Instability stress. Lastly, the ESD characteristics of GaN power devices are considered for the development of a monolithic GaN-on-Si platform. The breakdown mechanisms under ESD stress have been comprehensively studied using Transmission Line Pulse (TLP) and Very-fast Transmission Line Pulse (VFTLP) measurements.
Study Of Gallium Nitride High Electron Mobility Transistors Towards Highly Efficient And Reliable Power Switchin
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Author : Lars Heuken
language : en
Publisher:
Release Date : 2020
Study Of Gallium Nitride High Electron Mobility Transistors Towards Highly Efficient And Reliable Power Switchin written by Lars Heuken and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020 with categories.
Investigation Of Gallium Nitride Transistor Reliability Through Accelerated Life Testing And Modeling
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Author : Bradley D. Christiansen
language : en
Publisher:
Release Date : 2011
Investigation Of Gallium Nitride Transistor Reliability Through Accelerated Life Testing And Modeling written by Bradley D. Christiansen and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Gallium nitride categories.
Dielectric Reliability In High Voltage Gan Metal Insulator Semiconductor High Electron Mobility Transistors
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Author : Shireen M. Warnock
language : en
Publisher:
Release Date : 2017
Dielectric Reliability In High Voltage Gan Metal Insulator Semiconductor High Electron Mobility Transistors written by Shireen M. Warnock and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017 with categories.
As the demand for more energy-efficient electronics increases, GaN has emerged as a promising transistor material candidate for high-voltage power management applications. The AlGaN/GaN Metal-Insulator-Semiconductor High Electron Mobility Transistor (MIS-HEMT) constitutes the most suitable device structure for this application as it offers lower gate leakage than its HEMT counterpart. GaN has excellent material properties, but there are still many challenges to overcome before its widespread commercial deployment. Time-dependent dielectric breakdown (TDDB), a catastrophic condition arising after prolonged high-voltage gate stress, is a particularly important concern. This thesis investigates this crucial reliability issue in depth. Using a robust characterization strategy, we have studied not only the dielectric breakdown behavior in GaN MIS-HEMTs but also the evolution of the device subthreshold characteristics in the face of high bias stress. This allows us to work towards understanding on a more physical level the underlying degradation behind dielectric breakdown in order to inform future device lifetime models. We begin by looking at positive gate stress TDDB, a classic condition studied in the silicon CMOS community for many years. In order to understand the impact of TDDB, we must also understand how transient degradation effects such as threshold voltage (VT) shift may impact our results and ensure we can disentangle the permanent degradation associated with TDDB. With the foundational understanding of TDDB we establish under these positive gate stress conditions, we turn our attention to OFF-state stress which is a more relevant stress condition that mimics the most common state of these GaN power switching transistors in power management circuits. In order to develop accurate lifetime models for GaN MIS-HEMTs, we show that much care must be taken to ensure that device lifetime does not become distorted by transient trapping-related degradation effects. It is also crucial to have a physics-based lifetime model that gives confidence in making lifetime projections from data collected in the span of hours to lifetime estimations on the order of many years.
Dielectric Reliability In Gan Metal Insulator Semiconductor High Electron Mobility Transistors
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Author : Ethan S. Lee
language : en
Publisher:
Release Date : 2018
Dielectric Reliability In Gan Metal Insulator Semiconductor High Electron Mobility Transistors written by Ethan S. Lee and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018 with categories.
GaN Metal Insulator Semiconductor High Electron Mobility Transistors (GaN MIS-HEMTs) show excellent promise as high voltage power transistors that can operate efficiently at high temperatures and frequencies. However, current GaN technology faces several obstacles, one of which is Time-Dependent Dielectric Breakdown (TDDB) of the gate dielectric. Under prolonged electrical stress, the gate dielectric suffers a catastrophic breakdown that renders the transistor useless. Understanding the physics behind gate dielectric breakdown and accurately estimating the average time to failure of the dielectric are of critical importance. TDDB is conventionally studied under DC conditions. However, as actual device operation in power circuits involves rapid switching between on and off states, it is important to determine if estimations done from DC stress results are accurate. Due to the rich dynamics of the GaN MIS-HEMT system such as electron trapping and carrier accumulation at the dielectric/AlGaN interface, unaccounted physics might be introduced under AC stress that may cause error in DC estimation. To this end, we characterize TDDB behavior of GaN MIS-HEMTs at both DC stress conditions and more accurate AC stress conditions. We find that TDDB behavior is improved for AC stress compared to DC stress conditions at high stress frequencies. At 100 kHz, the average dielectric breakdown time is twice the average dielectric breakdown time under DC stress conditions. Furthermore, the impact of tensile mechanical stress on TDDB under DC stress is investigated. This is an important concern because of the piezoelectric nature of GaN and the substantial lattice mismatch between Si, GaN and AlGaN that results in high mechanical strain in the active portion of the device. If mechanical stress significantly impacts TDDB, designers will have to work with further constraints to ensure minimal stress across the dielectric. To address this, we have carried out measurements of TDDB under [epsilon] = 0.29% tensile strain. We find that TDDB in both the On-state and Off-state stress conditions are unaffected by this mechanical stress. Through measurements done in this thesis, we gather further insight towards understanding the physics behind TDDB. Through AC stress we find that the dynamics of the GaN MIS-HEMTs prolong dielectric breakdown times. Through mechanical stress we find that modulation of the 2-Dimensional Electron Gas and dielectric bond straining have minimal impact on TDDB.