Reliability Failure Analysis Of Integrated Circuits Ics And Devices
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Reliability Failure Analysis Of Integrated Circuits Ics And Devices
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Author : Vijay K. Garg
language : en
Publisher:
Release Date : 1995
Reliability Failure Analysis Of Integrated Circuits Ics And Devices written by Vijay K. Garg and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with categories.
Reliability And Failure Of Electronic Materials And Devices
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Author : Milton Ohring
language : en
Publisher: Academic Press
Release Date : 2014-10-14
Reliability And Failure Of Electronic Materials And Devices written by Milton Ohring and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-14 with Technology & Engineering categories.
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Microelectronic Failure Analysis Desk Reference
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Author :
language : en
Publisher: ASM International
Release Date : 2001-01-01
Microelectronic Failure Analysis Desk Reference written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-01-01 with Technology & Engineering categories.
Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.
Microelectronics Failure Analysis
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Author :
language : en
Publisher: ASM International
Release Date : 2004-01-01
Microelectronics Failure Analysis written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-01-01 with Technology & Engineering categories.
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Reliability Abstracts And Technical Reviews
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Author :
language : en
Publisher:
Release Date : 1970
Reliability Abstracts And Technical Reviews written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1970 with Reliability (Engineering) categories.
Istfa 2007 Proceedings Of The 33rd International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2007-01-01
Istfa 2007 Proceedings Of The 33rd International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-01-01 with Technology & Engineering categories.
Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Microelectronic Failure Analysis
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Author :
language : en
Publisher: ASM International
Release Date : 2002-01-01
Microelectronic Failure Analysis written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-01-01 with Technology & Engineering categories.
Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Microscopy Of Semiconducting Materials 1987 Proceedings Of The Institute Of Physics Conference Oxford University April 1987
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Author : A.G. Cullis
language : en
Publisher: CRC Press
Release Date : 2021-01-31
Microscopy Of Semiconducting Materials 1987 Proceedings Of The Institute Of Physics Conference Oxford University April 1987 written by A.G. Cullis and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-01-31 with Science categories.
The various forms of microscopy and related microanalytical techniques are making unique contributions to semiconductor research and development that underpin many important areas of microelectronics technology. Microscopy of Semiconducting Materials 1987 highlights the progress that is being made in semiconductor microscopy, primarily in electron probe methods as well as in light optical and ion scattering techniques. The book covers the state of the art, with sections on high resolution microscopy, epitaxial layers, quantum wells and superlattices, bulk gallium arsenide and other compounds, properties of dislocations, device silicon and dielectric structures, silicides and contacts, device testing, x-ray techniques, microanalysis, and advanced scanning microscopy techniques. Contributed by numerous international experts, this volume will be an indispensable guide to recent developments in semiconductor microscopy for all those who work in the field of semiconducting materials and research development.
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2019-12-01
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-12-01 with Technology & Engineering categories.
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Cmos Electronics
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Author : Jaume Segura
language : en
Publisher: John Wiley & Sons
Release Date : 2004-03-26
Cmos Electronics written by Jaume Segura and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-03-26 with Technology & Engineering categories.
CMOS manufacturing environments are surrounded with symptoms that can indicate serious test, design, or reliability problems, which, in turn, can affect the financial as well as the engineering bottom line. This book educates readers, including non-engineers involved in CMOS manufacture, to identify and remedy these causes. This book instills the electronic knowledge that affects not just design but other important areas of manufacturing such as test, reliability, failure analysis, yield-quality issues, and problems. Designed specifically for the many non-electronic engineers employed in the semiconductor industry who need to reliably manufacture chips at a high rate in large quantities, this is a practical guide to how CMOS electronics work, how failures occur, and how to diagnose and avoid them. Key features: Builds a grasp of the basic electronics of CMOS integrated circuits and then leads the reader further to understand the mechanisms of failure. Unique descriptions of circuit failure mechanisms, some found previously only in research papers and others new to this publication. Targeted to the CMOS industry (or students headed there) and not a generic introduction to the broader field of electronics. Examples, exercises, and problems are provided to support the self-instruction of the reader.