Reliability Of Electronic Packages And Semiconductor Devices
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Reliability And Failure Of Electronic Materials And Devices
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Author : Milton Ohring
language : en
Publisher: Academic Press
Release Date : 2014-10-14
Reliability And Failure Of Electronic Materials And Devices written by Milton Ohring and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-14 with Technology & Engineering categories.
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Semiconductor Device Reliability
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Author : A. Christou
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Semiconductor Device Reliability written by A. Christou and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.
Semiconductor Packaging
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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2016-04-19
Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Reliability Of Electronic Packages And Semiconductor Devices
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Author : Giulio Di Giacomo
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1997
Reliability Of Electronic Packages And Semiconductor Devices written by Giulio Di Giacomo and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Microelectronic packaging categories.
This text looks at predicting and extending the functional life of semiconductor components. Using empirical modelling, the author covers major types of failure mechanisms that can greatly reduce the active life of semiconductor components, including interconnection fatigue and electromigration.
Materials And Reliability Handbook For Semiconductor Optical And Electron Devices
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Author : Osamu Ueda
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-09-24
Materials And Reliability Handbook For Semiconductor Optical And Electron Devices written by Osamu Ueda and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-09-24 with Technology & Engineering categories.
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.
Power Electronic Packaging
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Author : Yong Liu
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-02-15
Power Electronic Packaging written by Yong Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-15 with Technology & Engineering categories.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Wide Bandgap Power Semiconductor Packaging
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Author : Katsuaki Suganuma
language : en
Publisher: Woodhead Publishing
Release Date : 2018-05-28
Wide Bandgap Power Semiconductor Packaging written by Katsuaki Suganuma and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-05-28 with Technology & Engineering categories.
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. - Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance - Provides the latest research on potential solutions, with an eye towards the end goal of system integration - Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates
Reliability And Radiation Effects In Compound Semiconductors
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Author : Allan H Johnston
language : en
Publisher: World Scientific
Release Date : 2010-04-27
Reliability And Radiation Effects In Compound Semiconductors written by Allan H Johnston and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-04-27 with Technology & Engineering categories.
This book focuses on reliability and radiation effects in compound semiconductors, which have evolved rapidly during the last 15 years. It starts with first principles, and shows how advances in device design and manufacturing have suppressed many of the older reliability mechanisms.It is the first book that comprehensively covers reliability and radiation effects in optoelectronic as well as microelectronic devices. It contrasts reliability mechanisms of compound semiconductors with those of silicon-based devices, and shows that the reliability of many compound semiconductors has improved to the level where they can be used for ten years or more with low failure rates.
Reliability Of Electronic Components
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Author : Titu I. Bajenescu
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Reliability Of Electronic Components written by Titu I. Bajenescu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The first detailed studies of electronic components reliability were undertaken to improve the performance of communications and navigational systems used by the American army. The techniques then developed were subsequently refined and applied to equipment used for many other applications where high reliability was of paramount importance - for example in civil airline electronic systems. The evolution of good and reliable products is the responsibility of technical and professional persons, engineers and designers. These individuals cannot succeed unless they are given adequate opportunity to apply their arts and mysteries so as to bring the end-product to the necessary level of satisfaction. Few managements, however, are yet aware of the far greater potential value of the reliability of their products or services. Yet customer satisfaction depends, in most cases, far more on the reliability of performance than on quality in the industrial sense. There was a time when reliable design could be prescribed simply as "picking good parts and using them right". Nowadays the complexity of systems, particularly electronic systems, and the demand for ultrahigh reliability in many applications mean that sophisticated methods based on numerical analysis and probability techniques have been brought to bear - particularly in the early stages of design - on determining the feasibility of systems.
Modern Power Electronic Devices
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Author : Francesco Iannuzzo
language : en
Publisher: Energy Engineering
Release Date : 2020-10
Modern Power Electronic Devices written by Francesco Iannuzzo and has been published by Energy Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-10 with Technology & Engineering categories.
Power devices are key to modern power systems, performing functions such as inverting and changing voltages, buffering and switching. Following a device-centric approach, this book covers power electronic applications, semiconductor physics, materials science, application engineering, and key technologies such as MOSFET, IGBT and WBG.