Semiconductor Process Reliability In Practice
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Semiconductor Process Reliability In Practice
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Author : Zhenghao Gan
language : en
Publisher: McGraw Hill Professional
Release Date : 2012-10-10
Semiconductor Process Reliability In Practice written by Zhenghao Gan and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-10-10 with Technology & Engineering categories.
Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown
Reliability Theory And Technology In Manufacturing Process
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Author : Yihai He
language : en
Publisher: Springer Nature
Release Date : 2025-06-24
Reliability Theory And Technology In Manufacturing Process written by Yihai He and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-06-24 with Business & Economics categories.
This book offers a comprehensive examination of the concept, technical framework, and progression of product reliability in the manufacturing industry. It provides in-depth insights into the theories and technologies surrounding reliability analysis and optimization in manufacturing, including both mechanical and electronic component manufacturing and assembly processes. With a practical focus, the book features real-world case studies from the industry to illustrate the theories and concepts presented. The book also includes clear tables and presentations to help readers compare various methods and understand the technical systems involved in analyzing, improving, and controlling reliability in the manufacturing process. The authors have developed new tools to address reliability challenges in the production process and provide a comprehensive theoretical and methodological foundation to guide reliability analysis and optimization. The book is aimed at professional researchers, engineering executives, and personnel, as well as design and production technicians in the fields of quality and reliability engineering. It also serves as a useful reference for technicians and scholars working on solving reliability problems and enhancing quality in the manufacturing industry.
Semiconductor Advanced Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17
Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Cleanrooms
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Author : Michael Kozicki
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Cleanrooms written by Michael Kozicki and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Social Science categories.
In writing this book, our goal was to produce a much needed teaching and reference text with a fresh approach to c1eanroom technology. The most obvious technological reason for bringing this book into being is that c1ean rooms have become vital to the manufacture and development of high technology products in both the commercial and military sectors, and there fore people have to develop an understanding of them. Examples of c1ean room applications include the manufacture of integrated circuits and other electronic components, preciSion mechanical assemblies, computer disks and drives, compact disks, optical components, medical implants and prostheses, pharmaceuticals and biochemicals, and so on. The book is written for anyone who is currently involved, or intends to become involved, with c1eanrooms. We intend it to be used by a wide range of professional groups including process engineers, production engineers, plant mechanical and electrical engineers, research engineers and scientists, managers, and so on. In addition, we believe it will be beneficial to those who design, build, service, and supply c1eanrooms, and may be used as a training aid for students who intend to pursue a career involving controlled environments and others such as c1eanroom operators and maintenance staff. We have attempted to steer clear of complex theory, which may be pursued in many other specialist texts, and keep the book as understandable and applicable as possible.
Distribution Reliability And Power Quality
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Author : Thomas Allen Short
language : en
Publisher: CRC Press
Release Date : 2018-10-08
Distribution Reliability And Power Quality written by Thomas Allen Short and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-08 with Technology & Engineering categories.
Power distribution and quality remain the key challenges facing the electrical utilities industry. Technology alone cannot provide a solution to power quality problems, and there exists a variety of procedures and programs that can be put in place to ensure reliable, high quality electricity. With chapters carefully culled from the best-selling Electric Power Distribution Handbook, Distribution Reliability and Power Quality provides an economical, sharply focused reference for engineers and technicians working in this specialty area of power distribution. The book introduces the concept of reliability, outlining various methods of assessing and improving reliability along with the factors that affect it. It follows with a detailed look at voltage sags and momentary interruptions, various solutions to these issues, power quality monitoring, and other quality issues such as voltage unbalance and harmonics. Because faults are the cause of many interruptions and other power quality problems, the author devotes a detailed chapter to various aspects of faults. Focused on enhancing the delivery of high-quality power, this volume includes a new chapter on reliability and power quality improvement programs that provide a roadmap to better performance and ultimately to higher efficiency. Presenting a host of practical solutions for reliability and power quality specialists, Distribution Reliability and Power Quality gathers critical tools, techniques, and knowledge into a single source that is ideally suited for immediate implementation.
Electrostatic Discharge Protection
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Author : Juin J. Liou
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Electrostatic Discharge Protection written by Juin J. Liou and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Electrostatic discharge (ESD) is one of the most prevalent threats to electronic components. In an ESD event, a finite amount of charge is transferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time. Thus, more than 35 percent of single-event chip damages can be attributed to ESD events, and designing ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry. Electrostatic Discharge Protection: Advances and Applications delivers timely coverage of component- and system-level ESD protection for semiconductor devices and integrated circuits. Bringing together contributions from internationally respected researchers and engineers with expertise in ESD design, optimization, modeling, simulation, and characterization, this book bridges the gap between theory and practice to offer valuable insight into the state of the art of ESD protection. Amply illustrated with tables, figures, and case studies, the text: Instills a deeper understanding of ESD events and ESD protection design principles Examines vital processes including Si CMOS, Si BCD, Si SOI, and GaN technologies Addresses important aspects pertinent to the modeling and simulation of ESD protection solutions Electrostatic Discharge Protection: Advances and Applications provides a single source for cutting-edge information vital to the research and development of effective, robust ESD protection solutions for semiconductor devices and integrated circuits.
Piezoelectric Mems Resonators
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Author : Harmeet Bhugra
language : en
Publisher: Springer
Release Date : 2017-01-09
Piezoelectric Mems Resonators written by Harmeet Bhugra and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-01-09 with Technology & Engineering categories.
This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associated with testing and qualification Examples of commercialization paths for piezoelectric MEMS resonators in the timing and the filter markets ...and more! The authors present industry and academic perspectives, making this book ideal for engineers, graduate students, and researchers.
Semiconductor Packaging
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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2016-04-19
Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Statistical Quality Technologies
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Author : Yuhlong Lio
language : en
Publisher: Springer
Release Date : 2019-08-09
Statistical Quality Technologies written by Yuhlong Lio and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-09 with Mathematics categories.
This book explores different statistical quality technologies including recent advances and applications. Statistical process control, acceptance sample plans and reliability assessment are some of the essential statistical techniques in quality technologies to ensure high quality products and to reduce consumer and producer risks. Numerous statistical techniques and methodologies for quality control and improvement have been developed in recent years to help resolve current product quality issues in today’s fast changing environment. Featuring contributions from top experts in the field, this book covers three major topics: statistical process control, acceptance sampling plans, and reliability testing and designs. The topics covered in the book are timely and have a high potential impact and influence to academics, scholars, students and professionals in statistics, engineering, manufacturing and health.
Publications Of The National Institute Of Standards And Technology Catalog
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Author : National Institute of Standards and Technology (U.S.)
language : en
Publisher:
Release Date : 1980
Publications Of The National Institute Of Standards And Technology Catalog written by National Institute of Standards and Technology (U.S.) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1980 with categories.