Silicon Materials Processing Characterization And Reliability
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Silicon Materials Processing Characterization And Reliability
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Author :
language : en
Publisher:
Release Date : 2002
Silicon Materials Processing Characterization And Reliability written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Semiconductors categories.
Silicon Materials Processing Characterization And Reliability Volume 716
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Author : Janice L. Veteran
language : en
Publisher:
Release Date : 2002-10-11
Silicon Materials Processing Characterization And Reliability Volume 716 written by Janice L. Veteran and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-10-11 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Silicon Analog Components
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Author : Badih El-Kareh
language : en
Publisher: Springer
Release Date : 2019-08-07
Silicon Analog Components written by Badih El-Kareh and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-07 with Technology & Engineering categories.
This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications; Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.
Characterization In Silicon Processing
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Author : Yale Strausser
language : en
Publisher: Elsevier
Release Date : 2013-10-22
Characterization In Silicon Processing written by Yale Strausser and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.
This volume is devoted to the consideration of the use use of surface, thin film and interface characterization tools in support of silicon-based semiconductor processing. The approach taken is to consider each of the types of films used in silicon devices individually in its own chapter and to discuss typical problems seen throughout that films' history, including characterization tools which are most effectively used to clarifying and solving those problems.
Techniques And Challenges For 300 Mm Silicon
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Author : H. Richter
language : en
Publisher: Elsevier Science Limited
Release Date : 1999
Techniques And Challenges For 300 Mm Silicon written by H. Richter and has been published by Elsevier Science Limited this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Technology & Engineering categories.
The activities of the semiconductor industry to introduce a new, large wafer diameter were triggered by expected potential overall savings - cost and resource - and an anticipated increasing demand for Silicon wafers. In the beginning, around 1994, agreement on the diameter of the next wafer generation had to be achieved and finally 300 mm was globally accepted to be the next wafer diameter, a decision obtained at international summits in 1994/1995, based on the work of a SEMI task force. Several workshops on 300 mm wafers have been held by SEMI, JSNM and other organizations during the past few years. However, the present E-MRS conference on Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modeling and Equipment was the first international scientific conference about this subject. The papers - invited as well as submitted - cover a wide range of subjects, financial issues, fab concepts, crystal growth, wafer process development, material and defect issues, wafer characterization and provide an excellent review of the present status of 300 mm technology.
Materials Characterization For Systems Performance And Reliability
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Author : James W. McCauley
language : en
Publisher: Springer
Release Date : 1986-03-31
Materials Characterization For Systems Performance And Reliability written by James W. McCauley and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1986-03-31 with Technology & Engineering categories.
The Sagamore Army Materials Research Conferences have been held in the beautiful Adirondack Mountains of New York State since 1954. Organized and conducted by the Army Materials and Mechanics Research Center (Watertown, Massachusetts) in cooperation with Syracuse University, the Conferences have focused on key issues in Materials Science and Engineering that impact directly on current or future Army problem areas. A select group of speakers and attendees are assembled from academia, industry, and other parts of the Department of Defense and Government to provide an optimum forum for a full dialogue on the selected topic. This book is a collection of the full manuscripts of the formal presentations given at the Conference. The emergence and use of nontraditional materials and the excessive failures and reject rates of high technology, materials intensive engineering systems necessitates a new approach to quality control. Thus, the theme of this year's Thirty-First Conference, "Materials Characterization for Systems Performance and Reliability," was selected to focus on the need and mechanisms to transition from defect interrogation of materials after production to utilization of materials characterization during manufacturing. The guidance and help of the steering committee and the dedicated and conscientious efforts of Ms. Karen Ka100stian, Con ference Coordinator, and Mr. William K. Wilson, and Ms. Mary Ann Holmquist are gratefully acknowledged. The continued active interest and support of Dr. Edward S. Wright, Director, AMMRC; Dr. Robert W. Lewis, Associate Director, AMMRC; and COL L. C. Ross, Commander/ Deputy Director, AMMRC; are greatly appreciated.
Electrical Characterization Of Silicon On Insulator Materials And Devices
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Author : Sorin Cristoloveanu
language : en
Publisher:
Release Date : 2014-09-01
Electrical Characterization Of Silicon On Insulator Materials And Devices written by Sorin Cristoloveanu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-09-01 with categories.
Materials And Process Characterization
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Author : Norman G. Einspruch
language : en
Publisher: Academic Press
Release Date : 2014-12-01
Materials And Process Characterization written by Norman G. Einspruch and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-12-01 with Technology & Engineering categories.
VLSI Electronics: Microstructure Science, Volume 6: Materials and Process Characterization addresses the problem of how to apply a broad range of sophisticated materials characterization tools to materials and processes used for development and production of very large scale integration (VLSI) electronics. This book discusses the various characterization techniques, such as Auger spectroscopy, secondary ion mass spectroscopy, X-ray topography, transmission electron microscopy, and spreading resistance. The systematic approach to the technologies of VLSI electronic materials and device manufacture are also considered. This volume is beneficial to materials scientists, chemists, and engineers who are commissioned with the responsibility of developing and implementing the production of materials and devices to support the VLSI era.
Silicon Carbide Materials Processing And Devices
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Author :
language : en
Publisher:
Release Date : 2002
Silicon Carbide Materials Processing And Devices written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Semiconductors categories.
Silicon Carbide 2002 Materials Processing And Devices Volume 742
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Author : Stephen E. Saddow
language : en
Publisher:
Release Date : 2003-03-25
Silicon Carbide 2002 Materials Processing And Devices Volume 742 written by Stephen E. Saddow and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-03-25 with Technology & Engineering categories.
Advances in silicon carbide materials, processing and device design have recently resulted in implementation of SiC-based electronic systems and offer great promise in high-voltage, high-temperature and high-frequency applications. This volume focuses on new developments in basic science of SiC materials as well as rapidly maturing device technologies. The challenges in this field include understanding and decreasing defect densities in bulk SiC crystals, controlling morphology and residual impurities in epilayers, optimization of implant activation and oxide-SiC interfaces, and developing novel device structures. This book brings together the crystal growers, physicists and device experts needed to continue the rapid pace of silicon-carbide-based technology. Topics include: epitaxial growth; characterization/defects; MOS technology; SiC processing and devices.