Silicon Microchannel Heat Sinks
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Silicon Microchannel Heat Sinks
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Author : Lian Zhang
language : en
Publisher: Springer Science & Business Media
Release Date : 2004-01-22
Silicon Microchannel Heat Sinks written by Lian Zhang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-01-22 with Science categories.
Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 mm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes. Scientists and engineers tackling thermal and MEMS problems will find the discussion in this book inspiring for their future design of microscale heat transfer experiments. This book will also contribute to the study of two-phase microchannel flows by providing extensive experimental data which are otherwise barely available.
Silicon Microchannel Heat Sinks
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Author : Lian Zhang
language : en
Publisher:
Release Date : 2014-01-15
Silicon Microchannel Heat Sinks written by Lian Zhang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-01-15 with categories.
Next Generation Microchannel Heat Exchangers
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Author : Michael M. Ohadi
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-10-16
Next Generation Microchannel Heat Exchangers written by Michael M. Ohadi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-10-16 with Technology & Engineering categories.
In Next Generation Microchannel Heat Exchangers, the authors’ focus on the new generation highly efficient heat exchangers and presentation of novel data and technical expertise not available in the open literature. Next generation micro channels offer record high heat transfer coefficients with pressure drops much less than conventional micro channel heat exchangers. These inherent features promise fast penetration into many mew markets, including high heat flux cooling of electronics, waste heat recovery and energy efficiency enhancement applications, alternative energy systems, as well as applications in mass exchangers and chemical reactor systems. The combination of up to the minute research findings and technical know-how make this book very timely as the search for high performance heat and mass exchangers that can cut costs in materials consumption intensifies.
Integrated Interconnect Technologies For 3d Nanoelectronic Systems
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Author : Muhannad S. Bakir
language : en
Publisher: Artech House
Release Date : 2008-11-30
Integrated Interconnect Technologies For 3d Nanoelectronic Systems written by Muhannad S. Bakir and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-11-30 with Technology & Engineering categories.
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Microchannel Phase Change Transport Phenomena
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Author : Sujoy Kumar Saha
language : en
Publisher: Butterworth-Heinemann
Release Date : 2015-09-27
Microchannel Phase Change Transport Phenomena written by Sujoy Kumar Saha and has been published by Butterworth-Heinemann this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-09-27 with Science categories.
Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity. This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems. A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient. Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis. - Up-to-date information will help delineate further research direction in the microchannel heat transfer - The latest modeling information and recommendations will help in design method and purpose
Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research
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Author : Madhusudan Iyengar
language : en
Publisher: World Scientific
Release Date : 2014-08-25
Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research written by Madhusudan Iyengar and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-25 with Technology & Engineering categories.
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Embedded Cooling Of Electronic Devices Conduction Evaporation And Single And Two Phase Convection
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Author : Madhusudan Iyengar
language : en
Publisher: World Scientific
Release Date : 2024-01-10
Embedded Cooling Of Electronic Devices Conduction Evaporation And Single And Two Phase Convection written by Madhusudan Iyengar and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-01-10 with Technology & Engineering categories.
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Heat And Mass Transfer In Porous Media
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Author : J.M.P.Q. Delgado
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-10-08
Heat And Mass Transfer In Porous Media written by J.M.P.Q. Delgado and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-08 with Technology & Engineering categories.
This book, "Heat and Mass Transfer in Porous Media", presents a set of new developments in the field of basic and applied research work on the physical and chemical aspects of heat and mass transfer phenomena in a porous medium domain, as well as related material properties and their measurements. The book contents include both theoretical and experimental developments, providing a self-contained major reference that is appealing to both the scientists and the engineers. At the same time, these topics will encounter of a variety of scientific and engineering disciplines, such as chemical, civil, agricultural, mechanical engineering, etc. The book is divided in several chapters that intend to be a short monograph in which the authors summarize the current state of knowledge for benefit of professionals.
Thermal Transport In Oblique Finned Micro Minichannels
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Author : Yan Fan
language : en
Publisher: Springer
Release Date : 2014-10-15
Thermal Transport In Oblique Finned Micro Minichannels written by Yan Fan and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-15 with Science categories.
The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies. Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.
Shape And Structure From Engineering To Nature
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Author : Adrian Bejan
language : en
Publisher: Cambridge University Press
Release Date : 2000-10-16
Shape And Structure From Engineering To Nature written by Adrian Bejan and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-10-16 with Science categories.
Seemingly universal geometric forms unite the flow systems of engineering and nature. For example, tree-shaped flows can be seen in computers, lungs, dendritic crystals, urban street patterns, and communication links. In this groundbreaking book, first published in 2000, Adrian Bejan considers the design and optimization of engineered systems and discovers a deterministic principle of the generation of geometric form in natural systems. Shape and structure spring from the struggle for better performance in both engineering and nature. This idea is the basis of the new constructal theory: the objective and constraints principle used in engineering is the same mechanism from which the geometry in natural flow systems emerges. From heat exchangers to river channels, the book draws many parallels between the engineered and the natural world. Among the topics covered are mechanical structure, thermal structure, heat trees, ducts and rivers, turbulent structure, and structure in transportation and economics. The numerous illustrations, examples, and homework problems in every chapter make this an ideal text for engineering design courses. Its provocative ideas will also appeal to a broad range of readers in engineering, natural sciences, economics, and business.