Solder Joint Reliability Prediction For Multiple Environments
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Solder Joint Reliability Prediction For Multiple Environments
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Author : Andrew E. Perkins
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-12-16
Solder Joint Reliability Prediction For Multiple Environments written by Andrew E. Perkins and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-16 with Technology & Engineering categories.
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Assembly And Reliability Of Lead Free Solder Joints
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2020-05-29
Assembly And Reliability Of Lead Free Solder Joints written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-29 with Technology & Engineering categories.
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture
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Author : E-H Wong
language : en
Publisher: Woodhead Publishing
Release Date : 2015-05-23
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture written by E-H Wong and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05-23 with Technology & Engineering categories.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study
Materials Design And Manufacturing For Sustainable Environment
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Author : Elango Natarajan
language : en
Publisher: Springer Nature
Release Date : 2022-09-28
Materials Design And Manufacturing For Sustainable Environment written by Elango Natarajan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-28 with Technology & Engineering categories.
The book presents select proceedings of the International Conference on Materials, Design and Manufacturing (ICMDMSE 2022). The book covers recent trends in design and manufacturing practices relating to sustainability. Various topics covered in this book include materials design for sustainability, material characterization, tribology, finite element methods (FEM), computational fluid dynamics in designing materials, manufacturing techniques inclined to sustainability, additive manufacturing, energy, Industry 4.0, MEMS, green manufacturing, and optimization techniques. This book will be useful for researchers and professionals working in various fields of mechanical engineering.
Solder Joint Reliability
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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Handbook Of Lead Free Solder Technology For Microelectronic Assemblies
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Author : Karl J. Puttlitz
language : en
Publisher: CRC Press
Release Date : 2004-02-27
Handbook Of Lead Free Solder Technology For Microelectronic Assemblies written by Karl J. Puttlitz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-02-27 with Technology & Engineering categories.
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Applications Of Neural Networks In Environment Energy And Health Proceedings Of The 1995 Workshop On The Environment And Energy Applications Of Neural Networks
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Author : Paul E Keller
language : en
Publisher: World Scientific
Release Date : 1996-07-04
Applications Of Neural Networks In Environment Energy And Health Proceedings Of The 1995 Workshop On The Environment And Energy Applications Of Neural Networks written by Paul E Keller and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-07-04 with categories.
This book contains the proceedings of the Workshop on Environmental and Energy Applications of Neural Networks. The purpose of this workshop was to provide a forum for discussing environmental, energy, and biomedical applications of neural networks. The applications covered in these proceedings include modeling and predicting soil, air and water pollution; waste reduction; environmental sensing; spectroscopy; hazardous waste handling and cleanup; environmental monitoring of power plants; process monitoring and optimization of power systems; modeling and control of power plants; power load forecasting; fault location and diagnosis of power systems; medical image and signal analysis; medical diagnosis; analysis of environmental health effects; health insurance, and modeling biological systems.
Solid State Lighting Reliability Part 2
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Author : Willem Dirk van Driel
language : en
Publisher: Springer
Release Date : 2017-07-11
Solid State Lighting Reliability Part 2 written by Willem Dirk van Driel and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-11 with Technology & Engineering categories.
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.
Life Cycle Reliability Engineering
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Author : Guang Yang
language : en
Publisher: John Wiley & Sons
Release Date : 2007-02-02
Life Cycle Reliability Engineering written by Guang Yang and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-02-02 with Technology & Engineering categories.
As the Lead Reliability Engineer for Ford Motor Company, Guangbin Yang is involved with all aspects of the design and production of complex automotive systems. Focusing on real-world problems and solutions, Life Cycle Reliability Engineering covers the gamut of the techniques used for reliability assurance throughout a product's life cycle. Yang pulls real-world examples from his work and other industries to explain the methods of robust design (designing reliability into a product or system ahead of time), statistical and real product testing, software testing, and ultimately verification and warranting of the final product's reliability
Handbook Of Concentrator Photovoltaic Technology
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Author : Carlos Algora
language : en
Publisher: John Wiley & Sons
Release Date : 2016-04-25
Handbook Of Concentrator Photovoltaic Technology written by Carlos Algora and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-25 with Technology & Engineering categories.
Concentrator Photovoltaics (CPV) is one of the most promising technologies to produce solar electricity at competitive prices. High performing CPV systems with efficiencies well over 30% and multi-megawatt CPV plants are now a reality. As a result of these achievements, the global CPV market is expected to grow dramatically over the next few years reaching cumulative installed capacity of 12.5 GW by 2020. In this context, both new and consolidated players are moving fast to gain a strategic advantage in this emerging market. Written with clear, brief and self-contained technical explanations, Handbook of Concentrator Photovoltaic Technology provides a complete overview of CPV covering: the fundamentals of solar radiation, solar cells, concentrator optics, modules and trackers; all aspects of characterization and reliability; case studies based on the description of actual systems and plants in the field; environmental impact, market potential and cost analysis. CPV technology is at a key point of expansion. This timely handbook aims to provide a comprehensive assessment of all CPV scientific, technological and engineering background with a view to equipping engineers and industry professionals with all of the vital information they need to help them sustain the impetus of this encouraging technology. Key features: Uniquely combines an explanation of the fundamentals of CPV systems and components with an overview of the market place and their real-life applications. Each chapter is written by well-known industry specialists with extensive expertise in each particular field of CPV technology. Reviews the basic concepts of multi-junction solar cells and new concepts for CPV cells, highlighting the key differences between them. Demonstrates the state of the art of several CPV centres and companies. Facilitates future cost calculation models for CPV. Features extensive case studies in each chapter, including coverage of CPV modules and systems.