Solder Paste Requirements For Fine Pitch Technology
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Solder Paste Requirements For Fine Pitch Technology
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Author : James P. Langan
language : en
Publisher:
Release Date : 1989
Solder Paste Requirements For Fine Pitch Technology written by James P. Langan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Solder and soldering categories.
Handbook Of Fine Pitch Surface Mount Technology
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 1994
Handbook Of Fine Pitch Surface Mount Technology written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Computers categories.
Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.
Fine Pitch Surface Mount Technology
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Author : Phil Marcoux
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Fine Pitch Surface Mount Technology written by Phil Marcoux and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Design Guidelines For Ultra Fine Pitch Solder Paste Printing
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Author : Martin Wickham
language : en
Publisher:
Release Date : 2002
Design Guidelines For Ultra Fine Pitch Solder Paste Printing written by Martin Wickham and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Electric circuits categories.
Solder Paste In Electronics Packaging
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Author : Jennie Hwang
language : en
Publisher: Springer
Release Date : 1989-04-27
Solder Paste In Electronics Packaging written by Jennie Hwang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-04-27 with Juvenile Nonfiction categories.
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Soldering Processes And Equipment
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Author : Michael Pecht
language : en
Publisher: John Wiley & Sons
Release Date : 1993-08-30
Soldering Processes And Equipment written by Michael Pecht and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993-08-30 with Technology & Engineering categories.
Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.
Modern Solder Technology For Competitive Electronics Manufacturing
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Author : Jennie S. Hwang
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1996
Modern Solder Technology For Competitive Electronics Manufacturing written by Jennie S. Hwang and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.
Solder Paste Technology
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Author : Colin C. Johnson
language : en
Publisher: Tab Professional and Reference Books
Release Date : 1989
Solder Paste Technology written by Colin C. Johnson and has been published by Tab Professional and Reference Books this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Technology & Engineering categories.
Smt Soldering Handbook
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Author : RUDOLF STRAUSS
language : en
Publisher: Elsevier
Release Date : 1998-02-24
Smt Soldering Handbook written by RUDOLF STRAUSS and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-02-24 with Technology & Engineering categories.
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology
Surface Mount Technology With Fine Pitch Components
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Author : H. Danielsson
language : en
Publisher: Springer
Release Date : 1995
Surface Mount Technology With Fine Pitch Components written by H. Danielsson and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Technology & Engineering categories.
This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.