Structural Analysis In Microelectronics And Fiber Optics 1996
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Structural Analysis In Microelectronics And Fiber Optics 1996
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Author : Ephraim Suhir
language : en
Publisher:
Release Date : 1996
Structural Analysis In Microelectronics And Fiber Optics 1996 written by Ephraim Suhir and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Science categories.
Proceedings of the November 1996 symposium. Contains 18 papers arranged in sections on structural reliability and dynamics, structural analysis of IC packages, solder alloys and joints, and fiber-optic and optoelectronic structures. Specific topics include singular solutions of interfacial stresses
Structural Analysis In Microelectronics And Fiber Optic Systems
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Author :
language : en
Publisher:
Release Date : 1997
Structural Analysis In Microelectronics And Fiber Optic Systems written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Fiber optics categories.
Structural Analysis In Microelectronic And Fiber Optic Systems
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Author : Ephraim Suhir
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Structural Analysis In Microelectronic And Fiber Optic Systems written by Ephraim Suhir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Social Science categories.
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.
National Semiconductor Metrology Program Nist List Of Publications Lp 103 May 2000
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Author :
language : en
Publisher:
Release Date : 2000
National Semiconductor Metrology Program Nist List Of Publications Lp 103 May 2000 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with categories.
National Semiconductor Metrology Program
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Author : National Semiconductor Metrology Program (U.S.)
language : en
Publisher:
Release Date : 2000
National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Semiconductors categories.
National Semiconductor Metrology Program
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Author : National Institute of Standards and Technology (U.S.)
language : en
Publisher:
Release Date : 2000
National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Semiconductors categories.
National Semiconductor Metrology Program Semiconductor Electronics Division Nist List Of Publications Lp 103 March 1999
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Author :
language : en
Publisher:
Release Date : 1999
National Semiconductor Metrology Program Semiconductor Electronics Division Nist List Of Publications Lp 103 March 1999 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with categories.
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging
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Author : Ephraim Suhir
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-26
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-26 with Technology & Engineering categories.
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices
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Author : Ephraim Suhir
language : en
Publisher: CRC Press
Release Date : 2021-01-28
Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices written by Ephraim Suhir and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-01-28 with Technology & Engineering categories.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Modeling And Simulation For Microelectronic Packaging Assembly
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Author : Shen Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2011-05-17
Modeling And Simulation For Microelectronic Packaging Assembly written by Shen Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-17 with Technology & Engineering categories.
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging