Substrate Noise
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Substrate Noise Coupling In Mixed Signal Asics
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Author : Stéphane Donnay
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-05-31
Substrate Noise Coupling In Mixed Signal Asics written by Stéphane Donnay and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-05-31 with Technology & Engineering categories.
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Substrate Noise Coupling In Rfics
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Author : Ahmed Helmy
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-03-23
Substrate Noise Coupling In Rfics written by Ahmed Helmy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-03-23 with Technology & Engineering categories.
The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Substrate Noise
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Author : Edoardo Charbon
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-08
Substrate Noise written by Edoardo Charbon and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-08 with Technology & Engineering categories.
In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.
Substrate Noise Coupling In Analog Rf Circuits
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Author : Stephane Bronckers
language : en
Publisher: Artech House
Release Date : 2010
Substrate Noise Coupling In Analog Rf Circuits written by Stephane Bronckers and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Technology & Engineering categories.
This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.
Substrate Noise
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Author : Edoardo Charbon
language : en
Publisher:
Release Date : 2014-01-15
Substrate Noise written by Edoardo Charbon and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-01-15 with categories.
Noise Coupling In System On Chip
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Author : Thomas Noulis
language : en
Publisher: CRC Press
Release Date : 2018-01-09
Noise Coupling In System On Chip written by Thomas Noulis and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-01-09 with Technology & Engineering categories.
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Noise Contamination In Nanoscale Vlsi Circuits
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Author : Selahattin Sayil
language : en
Publisher: Springer Nature
Release Date : 2022-08-31
Noise Contamination In Nanoscale Vlsi Circuits written by Selahattin Sayil and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-08-31 with Technology & Engineering categories.
This textbook provides readers with a comprehensive introduction to various noise sources that significantly reduce performance and reliability in nanometer-scale integrated circuits. The author covers different types of noise, such as crosstalk noise caused by signal switching of adjacent wires, power supply noise or IR voltage drop in the power line due to simultaneous buffer / gate switching events, substrate coupling noise, radiation-induced transients, thermally induced noise and noise due to process and environmental Coverages also includes the relationship between some of these noise sources, as well as compound effects, and modeling and mitigation of noise mechanisms.
Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement
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Author : Yue Ma
language : en
Publisher: CRC Press
Release Date : 2019-03-08
Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement written by Yue Ma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-08 with Computers categories.
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Microwave And Millimeter Wave Circuits And Systems
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Author : Apostolos Georgiadis
language : en
Publisher: John Wiley & Sons
Release Date : 2012-09-17
Microwave And Millimeter Wave Circuits And Systems written by Apostolos Georgiadis and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-09-17 with Technology & Engineering categories.
Microwave and Millimeter Wave Circuits and Systems: Emerging Design, Technologies and Applications provides a wide spectrum of current trends in the design of microwave and millimeter circuits and systems. In addition, the book identifies the state-of-the art challenges in microwave and millimeter wave circuits systems design such as behavioral modeling of circuit components, software radio and digitally enhanced front-ends, new and promising technologies such as substrate-integrated-waveguide (SIW) and wearable electronic systems, and emerging applications such as tracking of moving targets using ultra-wideband radar, and new generation satellite navigation systems. Each chapter treats a selected problem and challenge within the field of Microwave and Millimeter wave circuits, and contains case studies and examples where appropriate. Key Features: Discusses modeling and design strategies for new appealing applications in the domain of microwave and millimeter wave circuits and systems Written by experts active in the Microwave and Millimeter Wave frequency range (industry and academia) Addresses modeling/design/applications both from the circuit as from the system perspective Covers the latest innovations in the respective fields Each chapter treats a selected problem and challenge within the field of Microwave and Millimeter wave circuits, and contains case studies and examples where appropriate This book serves as an excellent reference for engineers, researchers, research project managers and engineers working in R&D, professors, and post-graduates studying related courses. It will also be of interest to professionals working in product development and PhD students.
The Electronic Design Automation Handbook
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Author : Dirk Jansen
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-02-23
The Electronic Design Automation Handbook written by Dirk Jansen and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-02-23 with Computers categories.
When I attended college we studied vacuum tubes in our junior year. At that time an average radio had ?ve vacuum tubes and better ones even seven. Then transistors appeared in 1960s. A good radio was judged to be one with more thententransistors. Latergoodradioshad15–20transistors and after that everyone stopped counting transistors. Today modern processors runing personal computers have over 10milliontransistorsandmoremillionswillbeaddedevery year. The difference between 20 and 20M is in complexity, methodology and business models. Designs with 20 tr- sistors are easily generated by design engineers without any tools, whilst designs with 20M transistors can not be done by humans in reasonable time without the help of Prof. Dr. Gajski demonstrates the Y-chart automation. This difference in complexity introduced a paradigm shift which required sophisticated methods and tools, and introduced design automation into design practice. By the decomposition of the design process into many tasks and abstraction levels the methodology of designing chips or systems has also evolved. Similarly, the business model has changed from vertical integration, in which one company did all the tasks from product speci?cation to manufacturing, to globally distributed, client server production in which most of the design and manufacturing tasks are outsourced.