Surface Mount Guidelines For Process Control Quality And Reliability
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Surface Mount Guidelines For Process Control Quality And Reliability
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Author : David Boswell
language : en
Publisher: McGraw-Hill Companies
Release Date : 1992
Surface Mount Guidelines For Process Control Quality And Reliability written by David Boswell and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Business & Economics categories.
Systems Quality Reliability Handbook
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Author : Intel Corporation
language : en
Publisher:
Release Date : 1988
Systems Quality Reliability Handbook written by Intel Corporation and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Computers categories.
Systems quality/reliability overview; Materials quality; Reliability; Manufacturing; Product regulations; Field activities; Support; Statistical process control tools; Glossary.
Contamination Of Electronic Assemblies
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Author : Elissa M. Bumiller
language : en
Publisher: CRC Press
Release Date : 2002-11-12
Contamination Of Electronic Assemblies written by Elissa M. Bumiller and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-11-12 with Technology & Engineering categories.
Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of
Surface Mount Technology
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Author : Ray Prasad
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Surface Mount Technology written by Ray Prasad and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Design Guidelines For Surface Mount And Fine Pitch Technology
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Author : Vern Solberg
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1996
Design Guidelines For Surface Mount And Fine Pitch Technology written by Vern Solberg and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
Very Good,No Highlights or Markup,all pages are intact.
Reliability Engineering
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Author : Kailash C. Kapur
language : en
Publisher: John Wiley & Sons
Release Date : 2014-03-21
Reliability Engineering written by Kailash C. Kapur and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-03-21 with Technology & Engineering categories.
An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Containing illustrative guides that include worked problems, numerical examples, homework problems, a solutions manual, and class-tested materials, it demonstrates to product development and manufacturing professionals how to distribute key reliability practices throughout an organization. The authors explain how to integrate reliability methods and techniques in the Six Sigma process and Design for Six Sigma (DFSS). They also discuss relationships between warranty and reliability, as well as legal and liability issues. Other topics covered include: Reliability engineering in the 21st Century Probability life distributions for reliability analysis Process control and process capability Failure modes, mechanisms, and effects analysis Health monitoring and prognostics Reliability tests and reliability estimation Reliability Engineering provides a comprehensive list of references on the topics covered in each chapter. It is an invaluable resource for those interested in gaining fundamental knowledge of the practical aspects of reliability in design, manufacturing, and testing. In addition, it is useful for implementation and management of reliability programs.
Solder Joint Reliability Of Bga Csp Flip Chip And Fine Pitch Smt Assemblies
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Author : John H. Lau
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1997
Solder Joint Reliability Of Bga Csp Flip Chip And Fine Pitch Smt Assemblies written by John H. Lau and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chip-scale package (CSP), and solder-bumped flip chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. For these technologies, solder is the electrical and mechanical "glue," and thus solder joint reliability is one of the most critical issues in the development of these technologies. This book is a one-stop guide to the state of the art of solder joint reliability problem-solving methods, or choose a creative, high-performance, robust, and cost-effective design and high-yield manufacturing process for their interconnect systems will be able to do so with this unique sourcebook. It meets the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. This book is structured to provide readers with the necessary know-how for practical, on-the-job problem-solving guidance. The book covers the solder joint reliability of BGA, CSP, flip chip, and FPT assemblies completely, proceeding from the theoretical basics to applications. Specific areas covered include: Definition of reliability, life distribution, failure rate, mean time to failure, etc.; Some well-known life distributions; Accelerated testing; Parameter estimation of life distributions; Acceleration factors for solders;Solder mechanics: plasticity, creep, and constitutive equations; Design, material, and manufacturing processes of BGA, CSP, flip chip, and FTP; Failure analysis and root cause of failure for BGA, CSP, flip chip, and FPT solder joints; Design for reliability of BGA, CSP, flip chip and FPT solder joints; Solder joint reliability of CBGA, PBGA, DBGA, and TBGA assemblies under thermal fatigue, mechanical bending and twisting, and shock and vibration conditions; solder joint reliability of flip chip (e.g., high-temperature and eutectic solder bumped flip chips on ceramic and PCB) assemblies under thermal fatigue, mechanical pulling, shearing, bending and twisting, and shock and vibration conditions; Solder joint reliability of CSP (e.g., LG Semicon's, Mitsubishi's, Motorola's, Tessera's, NEC's, nitto Denko's and Toshiba's) assemblies under thermal fatigue and mechanical bending conditions; Solder joint reliability of PQFP and TSOP assemblies under thermal fatigue, mechanical bending and twisting, and vibration conditions.
Surface Mount Technology For Concurrent Engineering And Manufacturing
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Author : Frank Classon
language : en
Publisher: McGraw-Hill Companies
Release Date : 1993
Surface Mount Technology For Concurrent Engineering And Manufacturing written by Frank Classon and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Technology & Engineering categories.
A guide to gaining the valuable miniaturization and cost-saving benefits of surface mount technology (SMT), showing how to integrate multiple company functions - designs, manufacturing, testing and management - and save time and money at every stage.
Optimizing Quality In Electronics Assembly A Heretical Approach
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Author : James Allen Smith
language : en
Publisher: McGraw Hill Professional
Release Date : 1997
Optimizing Quality In Electronics Assembly A Heretical Approach written by James Allen Smith and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Business & Economics categories.
In a radical departure from the dozens of other quality books, this one makes the case that the traditional TQM procedures used in the electronics assembly field are not only ineffective-they contribute to many failures. The only book to focus exclusively on quality in electronics manufacturing-& to propose a measurable cost/benefit methodology-this provocative volume shows what's lacking in current quality programs, & how fresh approaches can yet avoid a quality "catastrophe" in the electronics industry. Along the way, numerous quality myths are exploded, hidden issues are confronted, & an array of electronics specific solutions are offered.
Electronic Systems Quality Management Handbook
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Author : Marsha Ludwig-Becker
language : en
Publisher: McGraw-Hill Companies
Release Date : 1997
Electronic Systems Quality Management Handbook written by Marsha Ludwig-Becker and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Business & Economics categories.
Annotation Quality management for electronic systems has grown far beyond the basic inspection techniques of the past. New, performance-based quality management approaches are now used at every electronics company, from huge corporations to small start-ups. This book goes beyond generic quality approaches to present an electronics-specific program for quality management.