Testing And Inverse Modelling For Solder Joint Reliability Assessment
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Testing And Inverse Modelling For Solder Joint Reliability Assessment
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Author : Elisha Tingha Kamara
language : en
Publisher:
Release Date : 2013
Testing And Inverse Modelling For Solder Joint Reliability Assessment written by Elisha Tingha Kamara and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013 with categories.
Assembly And Reliability Of Lead Free Solder Joints
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2020-05-29
Assembly And Reliability Of Lead Free Solder Joints written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-29 with Technology & Engineering categories.
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Modeling Analysis Design And Tests For Electronics Packaging Beyond Moore
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Author : Hengyun Zhang
language : en
Publisher: Woodhead Publishing
Release Date : 2019-11-14
Modeling Analysis Design And Tests For Electronics Packaging Beyond Moore written by Hengyun Zhang and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-14 with Technology & Engineering categories.
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Solder Joint Reliability
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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 1991-05-31
Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-05-31 with Computers categories.
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Solder Joint Reliability
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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Lead Free Solder Interconnect Reliability
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Author : Dongkai Shangguan
language : en
Publisher: ASM International
Release Date : 2005
Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.
Proceedings Of The 8th Biennial Conference On Engineering Systems Design And Analysis 2006 Fatigue And Fracture Heat Transfer Internal Combustion Engines Manufacturing Technology And Society
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Author :
language : en
Publisher:
Release Date : 2006
Proceedings Of The 8th Biennial Conference On Engineering Systems Design And Analysis 2006 Fatigue And Fracture Heat Transfer Internal Combustion Engines Manufacturing Technology And Society written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Engineering design categories.
New Advances In Mechanisms Mechanical Transmissions And Robotics
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Author : Erwin-Christian Lovasz
language : en
Publisher: Springer Nature
Release Date : 2020-10-14
New Advances In Mechanisms Mechanical Transmissions And Robotics written by Erwin-Christian Lovasz and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-10-14 with Technology & Engineering categories.
This volume gathers the proceedings of the Joint International Conference of the XIII International Conference on Mechanisms and Mechanical Transmissions (MTM) and the XXIV International Conference on Robotics (Robotics), held in Timişoara, Romania. It addresses the applications of mechanisms and transmissions in several modern technical fields such as mechatronics, biomechanics, machines, micromachines, robotics and apparatus. In doing so, it combines theoretical findings and experimental testing. The book presents peer-reviewed papers written by researchers specialized in mechanism analysis and synthesis, dynamics of mechanisms and machines, mechanical transmissions, biomechanics, precision mechanics, mechatronics, micromechanisms and microactuators, computational and experimental methods, CAD in mechanism and machine design, mechanical design of robot architecture, parallel robots, mobile robots, micro and nano robots, sensors and actuators in robotics, intelligent control systems, biomedical engineering, teleoperation, haptics, and virtual reality.
Applied Mechanics Reviews
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Author :
language : en
Publisher:
Release Date : 1948
Applied Mechanics Reviews written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1948 with Mechanics, Applied categories.
Dissertation Abstracts International
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Author :
language : en
Publisher:
Release Date : 2005
Dissertation Abstracts International written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Dissertations, Academic categories.