The Importance Of Interconnection Technologies Reliability Of Power Electronic Packages
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The Importance Of Interconnection Technologies Reliability Of Power Electronic Packages
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Author : Sébastien Jacques
language : en
Publisher:
Release Date : 2017
The Importance Of Interconnection Technologies Reliability Of Power Electronic Packages written by Sébastien Jacques and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017 with Technology categories.
This chapter deals with the reliability of die interconnections used in plastic discrete power packages, dedicated to on-board electronic systems used in a wide range of applications such as automotive industry. A complete reliability analysis of two bonding technologies-aluminum wire and ribbon bonding-is proposed. This study is particularly focused on interconnection technologies' aging, when the package is subjected to thermal cycling or power cycling with high-temperature swings. For thermal cycling, the experimental reliability test results highlight that wire bond package aging is about 2.5 faster than the ribbon bond package. For power cycling, this acceleration factor is about 1.5. In both cases and whatever the bonding technique, the failure mechanism of the package is of a fatigue-stress nature. Many failure analysis results show wire bond lift-off. The degradation of the ribbon bond is more difficult to observe. Thermo-mechanical simulations using finite elements show a high stress concentration in the heel area. For the wire-bonding technique, the wire is subjected to repeated flexing and pulling that lead to its lift off. The ribbon-bonding process shows a higher robustness, thanks to a higher contact surface on the die, the low-loop profile and the stiffness of the ribbon.
System Reliability
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Author : Constantin Volosencu
language : en
Publisher: BoD – Books on Demand
Release Date : 2017-12-20
System Reliability written by Constantin Volosencu and has been published by BoD – Books on Demand this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-20 with Technology & Engineering categories.
Researchers from the entire world write to figure out their newest results and to contribute new ideas or ways in the field of system reliability and maintenance. Their articles are grouped into four sections: reliability, reliability of electronic devices, power system reliability and feasibility and maintenance. The book is a valuable tool for professors, students and professionals, with its presentation of issues that may be taken as examples applicable to practical situations. Some examples defining the contents can be highlighted: system reliability analysis based on goal-oriented methodology; reliability design of water-dispensing systems; reliability evaluation of drivetrains for off-highway machines; extending the useful life of asset; network reliability for faster feasibility decision; analysis of standard reliability parameters of technical systems' parts; cannibalisation for improving system reliability; mathematical study on the multiple temperature operational life testing procedure, for electronic industry; reliability prediction of smart maximum power point converter in photovoltaic applications; reliability of die interconnections used in plastic discrete power packages; the effects of mechanical and electrical straining on performances of conventional thick-film resistors; software and hardware development in the electric power system; electric interruptions and loss of supply in power systems; feasibility of autonomous hybrid AC/DC microgrid system; predictive modelling of emergency services in electric power distribution systems; web-based decision-support system in the electric power distribution system; preventive maintenance of a repairable equipment operating in severe environment; and others.
Modeling And Simulation For Electric Vehicle Applications
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Author : Mohamed Amine Fakhfakh
language : en
Publisher: BoD – Books on Demand
Release Date : 2016-10-05
Modeling And Simulation For Electric Vehicle Applications written by Mohamed Amine Fakhfakh and has been published by BoD – Books on Demand this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-10-05 with Technology & Engineering categories.
The book presents interesting topics from the area of modeling and simulation of electric vehicles application. The results presented by the authors of the book chapters are very interesting and inspiring. The book will familiarize the readers with the solutions and enable the readers to enlarge them by their own research. It will be useful for students of Electrical Engineering; it helps them solve practical problems.
Reliability And Safety In Railway
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Author : Xavier Perpinya
language : en
Publisher: BoD – Books on Demand
Release Date : 2012-03-30
Reliability And Safety In Railway written by Xavier Perpinya and has been published by BoD – Books on Demand this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-30 with Technology & Engineering categories.
In railway applications, performance studies are fundamental to increase the lifetime of railway systems. One of their main goals is verifying whether their working conditions are reliable and safety. This task not only takes into account the analysis of the whole traction chain, but also requires ensuring that the railway infrastructure is properly working. Therefore, several tests for detecting any dysfunctions on their proper operation have been developed. This book covers this topic, introducing the reader to railway traction fundamentals, providing some ideas on safety and reliability issues, and experimental approaches to detect any of these dysfunctions. The objective of the book is to serve as a valuable reference for students, educators, scientists, faculty members, researchers, and engineers.
Wide Bandgap Power Semiconductor Packaging
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Author : Katsuaki Suganuma
language : en
Publisher: Woodhead Publishing
Release Date : 2018-05-28
Wide Bandgap Power Semiconductor Packaging written by Katsuaki Suganuma and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-05-28 with Technology & Engineering categories.
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates
Semiconductor Power Devices
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Author : Josef Lutz
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-01-15
Semiconductor Power Devices written by Josef Lutz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-15 with Technology & Engineering categories.
Semiconductor power devices are the heart of power electronics. They determine the performance of power converters and allow topologies with high efficiency. Semiconductor properties, pn-junctions and the physical phenomena for understanding power devices are discussed in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device production technology. In practice, not only the semiconductor, but also the thermal and mechanical properties of packaging and interconnection technologies are essential to predict device behavior in circuits. Wear and aging mechanisms are identified and reliability analyses principles are developed. Unique information on destructive mechanisms, including typical failure pictures, allows assessment of the ruggedness of power devices. Also parasitic effects, such as device induced electromagnetic interference problems, are addressed. The book concludes with modern power electronic system integration techniques and trends.
Electronic Components And Technology
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Author : Stephen Sangwine
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Electronic Components And Technology written by Stephen Sangwine and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Most introductory textbooks in electronics focus on the theory while leaving the practical aspects to be covered in laboratory courses. However, the sooner such matters are introduced, the better able students will be to include such important concerns as parasitic effects and reliability at the very earliest stages of design. This philosophy has kept Electronic Components and Technology thriving for two decades, and this completely updated third edition continues the approach with a more international outlook. Not only does this textbook introduce the properties, behavior, fabrication, and use of electronic components, it also helps students grasp and apply sound engineering practice by incorporating in-depth discussions on topics such as safety and reliability. The author employs a holistic treatment that clearly demonstrates how electronic components and subsystems work together, reinforcing the concepts with numerous examples, case studies, problems, illustrations, and objectives. This edition was updated to reflect advances and changes to industrial practice, including packaging technologies, digital oscilloscopes, lead-free solders, and new battery technologies. Additionally, the text's scope now extends to include terminology and standards used worldwide. Including coverage of topics often ignored in other textbooks on the subject, Electronic Components and Technology, Third Edition encourages students to be better, more thoughtful designers and prepares them with current industrial practices.
Energy And Water Development Appropriations For 2016
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Author : United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development
language : en
Publisher:
Release Date : 2015
Energy And Water Development Appropriations For 2016 written by United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with Federal aid to energy development categories.
Introduction To Microsystem Packaging Technology
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Author : Yufeng Jin
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Introduction To Microsystem Packaging Technology written by Yufeng Jin and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Itherm 2002
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Author : Cristina H. Amon
language : en
Publisher:
Release Date : 2002
Itherm 2002 written by Cristina H. Amon and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Science categories.