The Simulation Of Thermomechanically Induced Stress In Plastic Encapsulated Ic Packages
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The Simulation Of Thermomechanically Induced Stress In Plastic Encapsulated Ic Packages
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Author : Gerard Kelly
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
The Simulation Of Thermomechanically Induced Stress In Plastic Encapsulated Ic Packages written by Gerard Kelly and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of time and money invested in undertaking costly experimental trials. In a high volume production environment, any design improvement that increases yield and reliability can be of immense benefit to the manufacturer. Components and systems need to be packaged to protect the IC from its environment. Encapsulating devices in plastic is very cheap and has the advantage of allowing them to be produced in high volume on an assembly line. Currently 95% of all ICs are encapsulated in plastic. Plastic packages are robust, light weight, and suitable for automated assembly onto printed circuit boards. They have developed from low pincount (14-28 pins) dual-in-line (DIP) packages in the 1970s, to fine pitch PQFPs (plastic quad flat pack) and TQFPs (thin quad flat pack) in the 1980s-1990s, with leadcounts as high as 256. The demand for PQFPs in 1997 was estimated to be 15 billion and this figure is expected to grow to 20 billion by the year 2000.
Benefiting From Thermal And Mechanical Simulation In Micro Electronics
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Author : G.Q. Zhang
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29
Benefiting From Thermal And Mechanical Simulation In Micro Electronics written by G.Q. Zhang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Technology & Engineering categories.
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture
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Author : E-H Wong
language : en
Publisher: Woodhead Publishing
Release Date : 2015-05-23
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture written by E-H Wong and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05-23 with Technology & Engineering categories.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
Lead Free Soldering Process Development And Reliability
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Author : Jasbir Bath
language : en
Publisher: John Wiley & Sons
Release Date : 2020-06-23
Lead Free Soldering Process Development And Reliability written by Jasbir Bath and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-06-23 with Technology & Engineering categories.
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Istfa 2006
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Author : Electronic Device Failure Analysis Society
language : en
Publisher: ASM International
Release Date : 2006
Istfa 2006 written by Electronic Device Failure Analysis Society and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Technology & Engineering categories.
Transactions Of The Asme
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Author :
language : en
Publisher:
Release Date : 2003
Transactions Of The Asme written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Electronic packaging categories.
Itherm 2002
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Author : Cristina H. Amon
language : en
Publisher:
Release Date : 2002
Itherm 2002 written by Cristina H. Amon and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Ball grid array technology categories.
Itherm
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Author :
language : en
Publisher:
Release Date : 2002
Itherm written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Electronic apparatus and appliances categories.
Moisture Sensitivity Of Plastic Packages Of Ic Devices
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Author : X.J. Fan
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-07-23
Moisture Sensitivity Of Plastic Packages Of Ic Devices written by X.J. Fan and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-07-23 with Technology & Engineering categories.
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
American Book Publishing Record
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Author :
language : en
Publisher:
Release Date : 2000
American Book Publishing Record written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Books categories.