Thermal Aware Testing Techniques For Digital Vlsi Circuits
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Thermal Aware Testing Techniques For Digital Vlsi Circuits
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Author : Arpita Dutta
language : en
Publisher:
Release Date : 2017-05-18
Thermal Aware Testing Techniques For Digital Vlsi Circuits written by Arpita Dutta and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-05-18 with categories.
Thermal Aware Testing Of Digital Vlsi Circuits And Systems
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Author : Santanu Chattopadhyay
language : en
Publisher: CRC Press
Release Date : 2018-04-24
Thermal Aware Testing Of Digital Vlsi Circuits And Systems written by Santanu Chattopadhyay and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-24 with Technology & Engineering categories.
This book aims to highlight the research activities in the domain of thermal-aware testing. Thermal-aware testing can be employed both at circuit level and at system level Describes range of algorithms for addressing thermal-aware test issue, presents comparison of temperature reduction with power-aware techniques and include results on benchmark circuits and systems for different techniques This book will be suitable for researchers working on power- and thermal-aware design and the testing of digital VLSI chips
Thermal Issues In Testing Of Advanced Systems On Chip
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Author : Nima Aghaee Ghaleshahi
language : en
Publisher: Linköping University Electronic Press
Release Date : 2015-09-23
Thermal Issues In Testing Of Advanced Systems On Chip written by Nima Aghaee Ghaleshahi and has been published by Linköping University Electronic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-09-23 with categories.
Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.
Circadian Rhythms For Future Resilient Electronic Systems
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Author : Xinfei Guo
language : en
Publisher: Springer
Release Date : 2019-06-12
Circadian Rhythms For Future Resilient Electronic Systems written by Xinfei Guo and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-06-12 with Technology & Engineering categories.
This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.
Design And Test Technology For Dependable Systems On Chip
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Author : Ubar, Raimund
language : en
Publisher: IGI Global
Release Date : 2010-12-31
Design And Test Technology For Dependable Systems On Chip written by Ubar, Raimund and has been published by IGI Global this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-12-31 with Computers categories.
"This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)"--
Physical Design For 3d Integrated Circuits
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Author : Aida Todri-Sanial
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Physical Design For 3d Integrated Circuits written by Aida Todri-Sanial and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Enhancing Operational Efficiency And Predictive Maintenance Through Digital Innovation
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Author : Minakshi
language : en
Publisher: IGI Global
Release Date : 2025-09-18
Enhancing Operational Efficiency And Predictive Maintenance Through Digital Innovation written by Minakshi and has been published by IGI Global this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-09-18 with Business & Economics categories.
In today’s industrial landscape, enhancing operational efficiency and implementing predictive maintenance strategies have become critical goals for organizations seeking sustainable growth and competitiveness. Digital innovation has the potential to optimize workflows, reduce downtime, and predict equipment failures. By utilizing real-time data and intelligent systems, companies can move from reactive to proactive maintenance models, streamline operations, and cut costs. Further research into this shift may boost productivity while driving long-term value creation across industries. Enhancing Operational Efficiency and Predictive Maintenance Through Digital Innovation explores the synergistic impact of cutting-edge technologies on our lives. It delves into the interconnected world of devices, the immense data they generate, and the immense potential of advanced analytics and machine learning algorithms to derive valuable insights. This book covers topics such as smart technology, disease detection, and environmental monitoring, and is a useful resource for business owners, engineers, educators, academicians, researchers, and scientists.
Formal Methods For Components And Objects
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Author : Bernhard Beckert
language : en
Publisher: Springer
Release Date : 2013-01-05
Formal Methods For Components And Objects written by Bernhard Beckert and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-01-05 with Computers categories.
Formal methods have been applied successfully to the verification of medium-sized programs in protocol and hardware design for some time. However, their application to the development of large systems requires more emphasis on specification, modeling, and validation techniques supporting the concepts of reusability and modifiability, and their implementation in new extensions of existing programming languages like Java. This book contains 20 revised papers submitted after the 10th Symposium on Formal Methods for Components and Objects, FMCO 2011, which was held in Turin, Italy, in October 2011. Topics covered include autonomic service-component ensembles; trustworthy eternal systems via evolving software, data, and knowledge; parallel patterns for adaptive heterogeneous multicore systems; programming for future 3D architectures with many cores; formal verification of object oriented software; and an infrastructure for reliable computer systems.
Proceedings Of The Acm Great Lakes Symposium On Vlsi
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Author :
language : en
Publisher:
Release Date : 2007
Proceedings Of The Acm Great Lakes Symposium On Vlsi written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Integrated circuits categories.
Nanoelectronic Mixed Signal System Design
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Author : Saraju Mohanty
language : en
Publisher: McGraw Hill Professional
Release Date : 2015-02-20
Nanoelectronic Mixed Signal System Design written by Saraju Mohanty and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-02-20 with Technology & Engineering categories.
Covering both the classical and emerging nanoelectronic technologies being used in mixed-signal design, this book addresses digital, analog, and memory components. Winner of the Association of American Publishers' 2016 PROSE Award in the Textbook/Physical Sciences & Mathematics category. Nanoelectronic Mixed-Signal System Design offers professionals and students a unified perspective on the science, engineering, and technology behind nanoelectronics system design. Written by the director of the NanoSystem Design Laboratory at the University of North Texas, this comprehensive guide provides a large-scale picture of the design and manufacturing aspects of nanoelectronic-based systems. It features dual coverage of mixed-signal circuit and system design, rather than just digital or analog-only. Key topics such as process variations, power dissipation, and security aspects of electronic system design are discussed. Top-down analysis of all stages--from design to manufacturing Coverage of current and developing nanoelectronic technologies--not just nano-CMOS Describes the basics of nanoelectronic technology and the structure of popular electronic systems Reveals the techniques required for design excellence and manufacturability