Thermal Mechanical And Multi Physics Simulation And Experiments In Micro Electronics And Micro Systems Eurosime 2009
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Thermal Mechanical And Multi Physics Simulation And Experiments In Micro Electronics And Micro Systems Eurosime 2009
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Author :
language : en
Publisher:
Release Date : 2010
Thermal Mechanical And Multi Physics Simulation And Experiments In Micro Electronics And Micro Systems Eurosime 2009 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with categories.
Reliability Of Organic Compounds In Microelectronics And Optoelectronics
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Author : Willem Dirk van Driel
language : en
Publisher: Springer Nature
Release Date : 2022-01-31
Reliability Of Organic Compounds In Microelectronics And Optoelectronics written by Willem Dirk van Driel and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-01-31 with Technology & Engineering categories.
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
2016 17th International Conference On Thermal Mechanical And Multi Physics Simulation And Experiments In Microelectronics And Microsystems Eurosime
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Author :
language : en
Publisher:
Release Date : 2016
2016 17th International Conference On Thermal Mechanical And Multi Physics Simulation And Experiments In Microelectronics And Microsystems Eurosime written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016 with Microelectronics categories.
2016 17th International Conference On Thermal Mechanical And Multi Physics Simulation And Experiments In Microelectronics And Microsystems Eurosime
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Author :
language : en
Publisher:
Release Date : 2016
2016 17th International Conference On Thermal Mechanical And Multi Physics Simulation And Experiments In Microelectronics And Microsystems Eurosime written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016 with Microelectronics categories.
Mechanics Of Microsystems
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Author : Alberto Corigliano
language : en
Publisher: John Wiley & Sons
Release Date : 2018-04-02
Mechanics Of Microsystems written by Alberto Corigliano and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-02 with Technology & Engineering categories.
Mechanics of Microsystems Alberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi and Stefano Mariani, Politecnico di Milano, Italy A mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability Mechanics of Microsystems takes a mechanical approach to microsystems and covers fundamental concepts including MEMS design, modelling and reliability. The book examines the mechanical behaviour of microsystems from a ‘design for reliability’ point of view and includes examples of applications in industry. Mechanics of Microsystems is divided into two main parts. The first part recalls basic knowledge related to the microsystems behaviour and offers an overview on microsystems and fundamental design and modelling tools from a mechanical point of view, together with many practical examples of real microsystems. The second part covers the mechanical characterization of materials at the micro-scale and considers the most important reliability issues (fracture, fatigue, stiction, damping phenomena, etc) which are fundamental to fabricate a real working device. Key features: Provides an overview of MEMS, with special focus on mechanical-based Microsystems and reliability issues. Includes examples of applications in industry. Accompanied by a website hosting supplementary material. The book provides essential reading for researchers and practitioners working with MEMS, as well as graduate students in mechanical, materials and electrical engineering.
Thermal Mechanical And Multi Physics Simulation And Experiments In Micro Electronics And Micro Systems Eurosime 2010
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Author :
language : en
Publisher:
Release Date : 2011
Thermal Mechanical And Multi Physics Simulation And Experiments In Micro Electronics And Micro Systems Eurosime 2010 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.
Solid State Lighting Reliability Part 2
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Author : Willem Dirk van Driel
language : en
Publisher: Springer
Release Date : 2017-07-11
Solid State Lighting Reliability Part 2 written by Willem Dirk van Driel and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-11 with Technology & Engineering categories.
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.
2017 18th International Conference On Thermal Mechanical And Multi Physics Simulation And Experiments In Microelectronics And Microsystems Eurosime
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Author :
language : en
Publisher:
Release Date : 2017
2017 18th International Conference On Thermal Mechanical And Multi Physics Simulation And Experiments In Microelectronics And Microsystems Eurosime written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017 with categories.
2017 18th International Conference On Thermal Mechanical And Multi Physics Simulation And Experiments In Microelectronics And Microsystems Eurosime
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2017-04-03
2017 18th International Conference On Thermal Mechanical And Multi Physics Simulation And Experiments In Microelectronics And Microsystems Eurosime written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-04-03 with categories.
EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems
Power Electronic Packaging
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Author : Yong Liu
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-02-15
Power Electronic Packaging written by Yong Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-15 with Technology & Engineering categories.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.